Conference Agenda

Session Overview

Date: Tuesday, 11/June/2024
10:00am - 1:00pm	SC1: Semiconductor packaging using structured glass panels as platform, Dr. Martin Letz, SCHOTT AG, Location: Banquet Hall Floor 3 Chair: Anders E. Petersen, Demant / Oticon See this link<\a> for more information.
1:00pm - 1:45pm	Short course lunch Location: Exhibition area Floor 1 1/2
2:00pm - 5:30pm	BTBF: Next-Gen Packaging Location: Banquet Hall Floor 3 Chair: Heidi Lundén, Schott Primoceler Oy / IMAPS Nordic Tuesday afternoon collaboration session with Business Finland and Business Tampere 14.00-17.30
6:00pm - 9:00pm	WR: Welcome reception Location: Päänäyttämön lämpiö (entrance via outdoors)

Date: Wednesday, 12/June/2024
8:00am - 11:00am	E_setup: Exhbitor setup Location: Exhibition area Floor 1 1/2
8:30am - 3:00pm	Reg: Registration Location: Entrance Hall
9:00am - 11:00am	SC2: "Sustainable materials in electronics", Attila Géczy, Budspest University of Technology, Hungary Location: Banquet Hall Floor 3 Chair: Dr. Markku Sakari Lahti, VTT Technical Research Centre of Finland, Ltd. / IMAPS Nordic
11:00am - 11:30am	CB1: Coffee & tea Location: Exhibition area Floor 1 1/2
11:30am - 11:45am	OS: Opening Session Location: Banquet Hall Floor 3 Chair: Heidi Lundén, Schott Primoceler Oy / IMAPS Nordic test further info
11:30am - 5:00pm	Exh1: Exhibition Location: Exhibition area Floor 1 1/2
11:45am - 12:15pm	Keynote 1: The European Chips Act: Opportunities and Challenges, Ralph W. Bernstein (PhD), SINTEF AS Location: Banquet Hall Floor 3 Chair: Dr. Daniel Wright, SINTEF Digital / IMAPS Nordic
12:15pm - 1:00pm	LW: Lunch Location: Päänäyttämön lämpiö (entrance via outdoors)
1:00pm - 1:45pm	Keynote 2: Textile-based Wearable Antennas and Interconnections in Body-centric Wireless Systems, Prof. Leena Ukkonen, Tampere University Location: Banquet Hall Floor 3 Chair: Paul Collander, IMAPS Nordic
1:45pm - 2:15pm	CB2: Coffee & Tea Location: Exhibition area Floor 1 1/2
2:15pm - 4:15pm	WS: Workshop: Photonics-electronics integration and co-packaging. From technology to applications Location: Banquet Hall Floor 3 Topics: Scalable foundry enablement for electronic and photonic co-design Commercial perspective to electronics-photonics packaging Integration of photonics components – the common ground with microelectronics Micro-transfer printing hybrid integration Silicon photonics platfrom Monolithic integrated photonics with metasurfaces – COMPAS Medical application of hybrid system
4:30pm - 5:00pm	AM: IMAPS Nordic Annual Meeting Location: Banquet Hall Floor 3 Chair: Heidi Lundén, Schott Primoceler Oy / IMAPS Nordic Annual Meeting for IMAPS Nordic memebers
7:00pm - 10:00pm	CD: Conference dinner Location: Restaurant Ravintola Myllärit

Date: Thursday, 13/June/2024
9:00am - 11:00am	T1A: 3D Advanced Packaging Location: Banquet Hall Floor 3 Chair: Anders E. Petersen, Demant / Oticon 9:00am - 9:24am 3D ceramic packaging; a solution to high-density device integration at harsh environments Khashayar Khazen, Pascal Metayer Microcertec, France 9:24am - 9:48am Direct copper interconnection: laser direct structuring and morphological characterization of copper plated vias. Alessandro Mellina Gottardo, Claudio Zafferoni, Riccardo Villa ST Microelectronics, Italy 9:48am - 10:12am Accelerate and optimize your packaging using large-scale multiphysics simulations in your browser Abhishek Deshmukh, Rahul Nagaraja, Jonni Lohi, Mika Lyly, Janne Ruuskanen, Alexandre Halbach, Bassou Khouya Quanscient, Finland 10:12am - 10:36am Molding Process Simulation and Viscoelastic Model for Package Warpage Anticipation Marco Rovitto, Alessandro Mellina STMicroelectronics, Italy 10:36am - 11:00am Development of a Non-contact Jet Dispensing of Liquid Metals Jan Maslik¹, Gustaf Mårtensson², Alessandro Gumiero³, Elio Cometti³, Klas Hjort¹ 1: Department of Materials Science and Engineering, Division of Microsystems Technology, Ångström Laboratory, Uppsala University, Uppsala, Sweden; 2: Mycronic AB, Täby, Sweden; 3: STMicroelectronics, Agrate Brianza, MB, Italy	T1B: Micropackaging Applications Location: Väinö Voionmaa Floor 8 Chair: Dr. Daniel Wright, SINTEF Digital / IMAPS Nordic 9:00am - 9:24am LTCC Back-scattered Polarization Duplexing Chipless RFID for Nearfield Interrogation Peter Uhlig, Enrico Tolin IMST GmbH, Germany 9:24am - 9:48am Anti-biofouling PCL-based Polyurethane Permselective Film Packaging for Dopamine-sensing Brain Implant Stefanus Wirdatmadja, Vijay Singh Parihar, Lauri Sydänheimo, Merja Voutilainen, Minna Kellomäki, Leena Ukkonen Tampere University, Finland 9:48am - 10:12am OPMMEG – Development of sensor package for measuring magnetic fields from brain Markku Sakari Lahti VTT Technical Research Centre of Finland, Ltd., Finland 10:12am - 10:36am Advanced Nanopackaging for Silicon Nanowire Sensor Thambiraj Selvarathinam¹, Bruce Kim¹, Lee Jeong H.², Park Jong W.² 1: The City University of New York, United States of America; 2: Korea Research Institute of Ships & Ocean Engineering in Republic of Korea. 10:36am - 11:00am Innovative Digital System In Package building block development for futur space equipments Hugo GARCIA¹, Hélène JOCHEM¹, Norbert VENET¹, Mirko ROCCI¹, Luca SOLLECCHIA¹, Andres Matias Dabas¹, Poul JUUL², Kim Ankeraa², Monique Mayr³, Paolo Scalmati⁴, Giovanni Cucinella⁵ 1: Thales Alenia Space; 2: Hytek; 3: Panasonic; 4: Somacis; 5: IMT
9:00am - 3:00pm	Exh2 Location: Exhibition area Floor 1 1/2
11:00am - 11:30am	CB3: Coffee and tea break Location: Exhibition area Floor 1 1/2
11:30am - 12:15pm	Keynote 3: From Reliability of Mobile Phone Packages to Advanced Solutions for Telecom Base Stations and Renewable Energy, Dr. Olli Salmela, Nokia Bell Labs Location: Banquet Hall Floor 3 Chair: Dr. Markku Sakari Lahti, VTT Technical Research Centre of Finland, Ltd. / IMAPS Nordic
12:15pm - 1:00pm	LT: Lunch Location: Päänäyttämön lämpiö (entrance via outdoors)
1:00pm - 3:00pm	T2A: Materials and Processing Location: Banquet Hall Floor 3 Chair: Dr. Jiantong Li, KTH 1:00pm - 1:24pm Novel degradable and water dissoluble substrate for Printed Circuit Board (PCB) applications Attila Géczy¹, István Hajdu¹, Amir Hamadeh¹, Csaba Farkas¹, Péter Tamás Lajter² 1: Budapest University of Technology and Economics, Hungary Faculty of Electrical Engineering and Informatics, Department of Electronics Technology; 2: DegrAway Technologies Ltd., Hungary 1:24pm - 1:48pm Simultaneous Modeling of Swelling and Heat Transfer in Polymers Stefan Wagner¹, Mario Gschwandl², Roland Nagl¹, Michael Fischlschweiger³, Tim Zeiner¹ 1: Graz University of Technology, Graz, Austria; 2: Ottronic E-Systems, Fohnsdorf, Austria; 3: Clausthal University of Technology, Clausthal-Zellerfeld, Germany 1:48pm - 2:12pm Monolithic fabrication of on-paper self-charging power systems through direct ink writing Yingchun Su, Yujie Fu, Shiqian Chen, Zheng Li, Han Xue, Jiantong Li KTH Royal Institute of Technology, Sweden 2:12pm - 2:36pm Comparative Simulation of Thermally Conductive Silicone Grease and Graphene-enhanced Thermal Pad in Single-chip and Multi-chip Packaging Jiabin Chen¹, Yunzheng Xuan², Yiran Liu², Jin Chen¹, Yuanyuan Wang³, Johan Möller³, Johan Liu^1,4 1: Shanghai Ruixi New Materials High Tech Co. Ltd., No 818, Chuhua North Road, Shanghai, P. R. China; 2: Shanghai Institute of IC Materials, No 333, Huangqing Road, Jiading District, Shanghai, P. R. China c SHT Smart High-Tech AB, Arendals Allé 3, SE-418 79 Gothenburg, Sweden; 3: SHT Smart High-Tech AB, Arendals Allé 3, SE-418 79 Gothenburg, Sweden; 4: Electronics Materials and Systems Laboratory, Department of Microtechnology and Nanoscience, Chalmers University of Technology, Kemivägen 9, SE 412 96, Gothenburg, Sweden 2:36pm - 3:00pm PurPest - developing a sensor system prototype for detecting pests in plants Daniel Wright¹, Andrea Ficke² 1: SINTEF Digital, Norway; 2: Norwegian Institute of Bioeconomy Research (NIBIO)	T2B: Optoelectronics and photonics Location: Väinö Voionmaa Floor 8 Chair: Dr. Hoang-Vu Nguyen, University of South-Eastern Norway (USN) 1:00pm - 1:24pm Integration of a miniature multichannel laser diode chip to a silicon photonics integrated circuit using Laser-Assisted Bonding Aleksandr Vlasov, Santeri Lehtinen, Evgenii Lepukhov, Heikki Virtanen, Samu-Pekka Ojanen, Jukka Viheriälä, Mircea Guina Tampere University, Finland 1:24pm - 1:48pm Advancements in Microelectronic and Optoelectronic Packaging: Novel Approaches for Enhanced Performance and Reliability GIOVANNI ZAFARANA, LUCA MAURI, ENEA RIZZI, ALESSIO CORAZZA SAES GROUP, Italy 1:48pm - 2:12pm Sodium silicate as an enabler for wafer bonding of glass substrates and lids Parnika Gupta, Joseph O' Brien, Jun Su Lee, How Yuan Hwang, Kamil Gradkowski, Padraic E. Morrissey, Peter O' Brien Tyndall National Institute, Ireland 2:12pm - 2:36pm Assembly of optical micro-ring resonator-based ultrasound sensor for photoacoustic imaging Evgenii Lepukhov¹, Aleksandr Vlasov¹, Santhosh Pandian¹, Rainer Hainberger², Paul Müllner², Moritz Eggeling², Tapio Niemi¹ 1: Tampere university, Finland; 2: AIT Austrian Institute of Technology, Austria 2:36pm - 3:00pm Co-Integration of microelectronics and photonics in novel sensor Firehun Dullo¹, Daniel Wright¹, Christpher Dirdal¹, Marco Povoli¹, Anneirudh Sundararajan², Milan Milosevic² 1: SINTEF Digital, Norway; 2: PHIX, The Netherlands
3:00pm - 3:15pm	CB4: Coffee and tea break Location: Exhibition area Floor 1 1/2
3:15pm - 3:45pm	Keynote 4: A Fully Additive Manufacturing Approach for the Fabrication of Interconnects, Onboard, and Embedded Passives for HDI-Printed Circuit Boards, Dr. Shailesh Singh Chouhan, Luleå University of Technology Location: Banquet Hall Floor 3 Chair: Dr. Jiantong Li, KTH
3:45pm - 4:00pm	CLS: Closing session Location: Banquet Hall Floor 3 Chair: Heidi Lundén, Schott Primoceler Oy / IMAPS Nordic