Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

 
 
Session Overview
Date: Tuesday, 11/June/2024
10:00am
-
1:00pm
SC1: Semiconductor packaging using structured glass panels as platform, Dr. Martin Letz, SCHOTT AG,
Location: Banquet Hall Floor 3
Chair: Anders E. Petersen, Demant / Oticon
1:00pm
-
1:45pm
Short course lunch
Location: Exhibition area Floor 1 1/2
2:00pm
-
5:30pm
BTBF: Next-Gen Packaging
Location: Banquet Hall Floor 3
Chair: Heidi Lundén, Schott Primoceler Oy / IMAPS Nordic
Tuesday afternoon collaboration session with Business Finland and Business Tampere 14.00-17.30
6:00pm
-
9:00pm
WR: Welcome reception
Location: Päänäyttämön lämpiö (entrance via outdoors)

Date: Wednesday, 12/June/2024
8:00am
-
11:00am
E_setup: Exhbitor setup
Location: Exhibition area Floor 1 1/2
8:30am
-
3:00pm
Reg: Registration
Location: Entrance Hall
9:00am
-
11:00am
SC2: "Sustainable materials in electronics", Attila Géczy, Budspest University of Technology, Hungary
Location: Banquet Hall Floor 3
Chair: Dr. Markku Sakari Lahti, VTT Technical Research Centre of Finland, Ltd. / IMAPS Nordic
11:00am
-
11:30am
CB1: Coffee & tea
Location: Exhibition area Floor 1 1/2
11:30am
-
11:45am
OS: Opening Session
Location: Banquet Hall Floor 3
Chair: Heidi Lundén, Schott Primoceler Oy / IMAPS Nordic
test further info
11:30am
-
5:00pm
Exh1: Exhibition
Location: Exhibition area Floor 1 1/2
11:45am
-
12:15pm
Keynote 1: The European Chips Act: Opportunities and Challenges, Ralph W. Bernstein (PhD), SINTEF AS
Location: Banquet Hall Floor 3
Chair: Dr. Daniel Wright, SINTEF Digital / IMAPS Nordic
12:15pm
-
1:00pm
LW: Lunch
Location: Päänäyttämön lämpiö (entrance via outdoors)
1:00pm
-
1:45pm
Keynote 2: Textile-based Wearable Antennas and Interconnections in Body-centric Wireless Systems, Prof. Leena Ukkonen, Tampere University
Location: Banquet Hall Floor 3
Chair: Paul Collander, IMAPS Nordic
1:45pm
-
2:15pm
CB2: Coffee & Tea
Location: Exhibition area Floor 1 1/2
2:15pm
-
4:15pm
WS: Workshop: Photonics-electronics integration and co-packaging. From technology to applications
Location: Banquet Hall Floor 3
    Topics:
  • Scalable foundry enablement for electronic and photonic co-design
  • Commercial perspective to electronics-photonics packaging
  • Integration of photonics components – the common ground with microelectronics
  • Micro-transfer printing hybrid integration
  • Silicon photonics platfrom
  • Monolithic integrated photonics with metasurfaces – COMPAS
  • Medical application of hybrid system
4:30pm
-
5:00pm
AM: IMAPS Nordic Annual Meeting
Location: Banquet Hall Floor 3
Chair: Heidi Lundén, Schott Primoceler Oy / IMAPS Nordic
Annual Meeting for IMAPS Nordic memebers
7:00pm
-
10:00pm
CD: Conference dinner
Location: Restaurant Ravintola Myllärit

Date: Thursday, 13/June/2024
9:00am
-
11:00am
T1A: 3D Advanced Packaging
Location: Banquet Hall Floor 3
Chair: Anders E. Petersen, Demant / Oticon
 
9:00am - 9:24am

3D ceramic packaging; a solution to high-density device integration at harsh environments

Khashayar Khazen, Pascal Metayer

Microcertec, France



9:24am - 9:48am

Direct copper interconnection: laser direct structuring and morphological characterization of copper plated vias.

Alessandro Mellina Gottardo, Claudio Zafferoni, Riccardo Villa

ST Microelectronics, Italy



9:48am - 10:12am

Accelerate and optimize your packaging using large-scale multiphysics simulations in your browser

Abhishek Deshmukh, Rahul Nagaraja, Jonni Lohi, Mika Lyly, Janne Ruuskanen, Alexandre Halbach, Bassou Khouya

Quanscient, Finland



10:12am - 10:36am

Molding Process Simulation and Viscoelastic Model for Package Warpage Anticipation

Marco Rovitto, Alessandro Mellina

STMicroelectronics, Italy



10:36am - 11:00am

Development of a Non-contact Jet Dispensing of Liquid Metals

Jan Maslik1, Gustaf Mårtensson2, Alessandro Gumiero3, Elio Cometti3, Klas Hjort1

1: Department of Materials Science and Engineering, Division of Microsystems Technology, Ångström Laboratory, Uppsala University, Uppsala, Sweden; 2: Mycronic AB, Täby, Sweden; 3: STMicroelectronics, Agrate Brianza, MB, Italy

T1B: Micropackaging Applications
Location: Väinö Voionmaa Floor 8
Chair: Dr. Daniel Wright, SINTEF Digital / IMAPS Nordic
 
9:00am - 9:24am

LTCC Back-scattered Polarization Duplexing Chipless RFID for Nearfield Interrogation

Peter Uhlig, Enrico Tolin

IMST GmbH, Germany



9:24am - 9:48am

Anti-biofouling PCL-based Polyurethane Permselective Film Packaging for Dopamine-sensing Brain Implant

Stefanus Wirdatmadja, Vijay Singh Parihar, Lauri Sydänheimo, Merja Voutilainen, Minna Kellomäki, Leena Ukkonen

Tampere University, Finland



9:48am - 10:12am

OPMMEG – Development of sensor package for measuring magnetic fields from brain

Markku Sakari Lahti

VTT Technical Research Centre of Finland, Ltd., Finland



10:12am - 10:36am

Advanced Nanopackaging for Silicon Nanowire Sensor

Thambiraj Selvarathinam1, Bruce Kim1, Lee Jeong H.2, Park Jong W.2

1: The City University of New York, United States of America; 2: Korea Research Institute of Ships & Ocean Engineering in Republic of Korea.



10:36am - 11:00am

Innovative Digital System In Package building block development for futur space equipments

Hugo GARCIA1, Hélène JOCHEM1, Norbert VENET1, Mirko ROCCI1, Luca SOLLECCHIA1, Andres Matias Dabas1, Poul JUUL2, Kim Ankeraa2, Monique Mayr3, Paolo Scalmati4, Giovanni Cucinella5

1: Thales Alenia Space; 2: Hytek; 3: Panasonic; 4: Somacis; 5: IMT

9:00am
-
3:00pm
Exh2
Location: Exhibition area Floor 1 1/2
11:00am
-
11:30am
CB3: Coffee and tea break
Location: Exhibition area Floor 1 1/2
11:30am
-
12:15pm
Keynote 3: From Reliability of Mobile Phone Packages to Advanced Solutions for Telecom Base Stations and Renewable Energy, Dr. Olli Salmela, Nokia Bell Labs
Location: Banquet Hall Floor 3
Chair: Dr. Markku Sakari Lahti, VTT Technical Research Centre of Finland, Ltd. / IMAPS Nordic
12:15pm
-
1:00pm
LT: Lunch
Location: Päänäyttämön lämpiö (entrance via outdoors)
1:00pm
-
3:00pm
T2A: Materials and Processing
Location: Banquet Hall Floor 3
Chair: Dr. Jiantong Li, KTH
 
1:00pm - 1:24pm

Novel degradable and water dissoluble substrate for Printed Circuit Board (PCB) applications

Attila Géczy1, István Hajdu1, Amir Hamadeh1, Csaba Farkas1, Péter Tamás Lajter2

1: Budapest University of Technology and Economics, Hungary Faculty of Electrical Engineering and Informatics, Department of Electronics Technology; 2: DegrAway Technologies Ltd., Hungary



1:24pm - 1:48pm

Simultaneous Modeling of Swelling and Heat Transfer in Polymers

Stefan Wagner1, Mario Gschwandl2, Roland Nagl1, Michael Fischlschweiger3, Tim Zeiner1

1: Graz University of Technology, Graz, Austria; 2: Ottronic E-Systems, Fohnsdorf, Austria; 3: Clausthal University of Technology, Clausthal-Zellerfeld, Germany



1:48pm - 2:12pm

Monolithic fabrication of on-paper self-charging power systems through direct ink writing

Yingchun Su, Yujie Fu, Shiqian Chen, Zheng Li, Han Xue, Jiantong Li

KTH Royal Institute of Technology, Sweden



2:12pm - 2:36pm

Comparative Simulation of Thermally Conductive Silicone Grease and Graphene-enhanced Thermal Pad in Single-chip and Multi-chip Packaging

Jiabin Chen1, Yunzheng Xuan2, Yiran Liu2, Jin Chen1, Yuanyuan Wang3, Johan Möller3, Johan Liu1,4

1: Shanghai Ruixi New Materials High Tech Co. Ltd., No 818, Chuhua North Road, Shanghai, P. R. China; 2: Shanghai Institute of IC Materials, No 333, Huangqing Road, Jiading District, Shanghai, P. R. China c SHT Smart High-Tech AB, Arendals Allé 3, SE-418 79 Gothenburg, Sweden; 3: SHT Smart High-Tech AB, Arendals Allé 3, SE-418 79 Gothenburg, Sweden; 4: Electronics Materials and Systems Laboratory, Department of Microtechnology and Nanoscience, Chalmers University of Technology, Kemivägen 9, SE 412 96, Gothenburg, Sweden



2:36pm - 3:00pm

PurPest - developing a sensor system prototype for detecting pests in plants

Daniel Wright1, Andrea Ficke2

1: SINTEF Digital, Norway; 2: Norwegian Institute of Bioeconomy Research (NIBIO)

T2B: Optoelectronics and photonics
Location: Väinö Voionmaa Floor 8
Chair: Dr. Hoang-Vu Nguyen, University of South-Eastern Norway (USN)
 
1:00pm - 1:24pm

Integration of a miniature multichannel laser diode chip to a silicon photonics integrated circuit using Laser-Assisted Bonding

Aleksandr Vlasov, Santeri Lehtinen, Evgenii Lepukhov, Heikki Virtanen, Samu-Pekka Ojanen, Jukka Viheriälä, Mircea Guina

Tampere University, Finland



1:24pm - 1:48pm

Advancements in Microelectronic and Optoelectronic Packaging: Novel Approaches for Enhanced Performance and Reliability

GIOVANNI ZAFARANA, LUCA MAURI, ENEA RIZZI, ALESSIO CORAZZA

SAES GROUP, Italy



1:48pm - 2:12pm

Sodium silicate as an enabler for wafer bonding of glass substrates and lids

Parnika Gupta, Joseph O' Brien, Jun Su Lee, How Yuan Hwang, Kamil Gradkowski, Padraic E. Morrissey, Peter O' Brien

Tyndall National Institute, Ireland



2:12pm - 2:36pm

Assembly of optical micro-ring resonator-based ultrasound sensor for photoacoustic imaging

Evgenii Lepukhov1, Aleksandr Vlasov1, Santhosh Pandian1, Rainer Hainberger2, Paul Müllner2, Moritz Eggeling2, Tapio Niemi1

1: Tampere university, Finland; 2: AIT Austrian Institute of Technology, Austria



2:36pm - 3:00pm

Co-Integration of microelectronics and photonics in novel sensor

Firehun Dullo1, Daniel Wright1, Christpher Dirdal1, Marco Povoli1, Anneirudh Sundararajan2, Milan Milosevic2

1: SINTEF Digital, Norway; 2: PHIX, The Netherlands

3:00pm
-
3:15pm
CB4: Coffee and tea break
Location: Exhibition area Floor 1 1/2
3:15pm
-
3:45pm
Keynote 4: A Fully Additive Manufacturing Approach for the Fabrication of Interconnects, Onboard, and Embedded Passives for HDI-Printed Circuit Boards, Dr. Shailesh Singh Chouhan, Luleå University of Technology
Location: Banquet Hall Floor 3
Chair: Dr. Jiantong Li, KTH
3:45pm
-
4:00pm
CLS: Closing session
Location: Banquet Hall Floor 3
Chair: Heidi Lundén, Schott Primoceler Oy / IMAPS Nordic