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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Session Overview

Date: Tuesday, 11/June/2024
10:00am - 1:00pm	SC1: Semiconductor packaging using structured glass panels as platform, Dr. Martin Letz, SCHOTT AG, Location: Banquet Hall Floor 3 Chair: Anders E. Petersen, Demant / Oticon See this link<\a> for more information.
1:00pm - 1:45pm	Short course lunch Location: Exhibition area Floor 1 1/2
2:00pm - 5:30pm	BTBF: Next-Gen Packaging Location: Banquet Hall Floor 3 Chair: Heidi Lundén, Schott Primoceler Oy / IMAPS Nordic Tuesday afternoon collaboration session with Business Finland and Business Tampere 14.00-17.30
6:00pm - 9:00pm	WR: Welcome reception Location: Päänäyttämön lämpiö (entrance via outdoors)

Date: Wednesday, 12/June/2024
8:00am - 11:00am	E_setup: Exhbitor setup Location: Exhibition area Floor 1 1/2
8:30am - 3:00pm	Reg: Registration Location: Entrance Hall
9:00am - 11:00am	SC2: "Sustainable materials in electronics", Attila Géczy, Budspest University of Technology, Hungary Location: Banquet Hall Floor 3 Chair: Dr. Markku Sakari Lahti, VTT Technical Research Centre of Finland, Ltd. / IMAPS Nordic
11:00am - 11:30am	CB1: Coffee & tea Location: Exhibition area Floor 1 1/2
11:30am - 11:45am	OS: Opening Session Location: Banquet Hall Floor 3 Chair: Heidi Lundén, Schott Primoceler Oy / IMAPS Nordic test further info
11:30am - 5:00pm	Exh1: Exhibition Location: Exhibition area Floor 1 1/2
11:45am - 12:15pm	Keynote 1: The European Chips Act: Opportunities and Challenges, Ralph W. Bernstein (PhD), SINTEF AS Location: Banquet Hall Floor 3 Chair: Dr. Daniel Wright, SINTEF Digital / IMAPS Nordic
12:15pm - 1:00pm	LW: Lunch Location: Päänäyttämön lämpiö (entrance via outdoors)
1:00pm - 1:45pm	Keynote 2: Textile-based Wearable Antennas and Interconnections in Body-centric Wireless Systems, Prof. Leena Ukkonen, Tampere University Location: Banquet Hall Floor 3 Chair: Paul Collander, IMAPS Nordic
1:45pm - 2:15pm	CB2: Coffee & Tea Location: Exhibition area Floor 1 1/2
2:15pm - 4:15pm	WS: Workshop: Photonics-electronics integration and co-packaging. From technology to applications Location: Banquet Hall Floor 3 Topics: Scalable foundry enablement for electronic and photonic co-design Commercial perspective to electronics-photonics packaging Integration of photonics components – the common ground with microelectronics Micro-transfer printing hybrid integration Silicon photonics platfrom Monolithic integrated photonics with metasurfaces – COMPAS Medical application of hybrid system
4:30pm - 5:00pm	AM: IMAPS Nordic Annual Meeting Location: Banquet Hall Floor 3 Chair: Heidi Lundén, Schott Primoceler Oy / IMAPS Nordic Annual Meeting for IMAPS Nordic memebers
7:00pm - 10:00pm	CD: Conference dinner Location: Restaurant Ravintola Myllärit

Date: Thursday, 13/June/2024
9:00am - 11:00am	T1A: 3D Advanced Packaging Location: Banquet Hall Floor 3 Chair: Anders E. Petersen, Demant / Oticon	T1B: Micropackaging Applications Location: Väinö Voionmaa Floor 8 Chair: Dr. Daniel Wright, SINTEF Digital / IMAPS Nordic
9:00am - 3:00pm	Exh2 Location: Exhibition area Floor 1 1/2
11:00am - 11:30am	CB3: Coffee and tea break Location: Exhibition area Floor 1 1/2
11:30am - 12:15pm	Keynote 3: From Reliability of Mobile Phone Packages to Advanced Solutions for Telecom Base Stations and Renewable Energy, Dr. Olli Salmela, Nokia Bell Labs Location: Banquet Hall Floor 3 Chair: Dr. Markku Sakari Lahti, VTT Technical Research Centre of Finland, Ltd. / IMAPS Nordic
12:15pm - 1:00pm	LT: Lunch Location: Päänäyttämön lämpiö (entrance via outdoors)
1:00pm - 3:00pm	T2A: Materials and Processing Location: Banquet Hall Floor 3 Chair: Dr. Jiantong Li, KTH	T2B: Optoelectronics and photonics Location: Väinö Voionmaa Floor 8 Chair: Dr. Hoang-Vu Nguyen, University of South-Eastern Norway (USN)
3:00pm - 3:15pm	CB4: Coffee and tea break Location: Exhibition area Floor 1 1/2
3:15pm - 3:45pm	Keynote 4: A Fully Additive Manufacturing Approach for the Fabrication of Interconnects, Onboard, and Embedded Passives for HDI-Printed Circuit Boards, Dr. Shailesh Singh Chouhan, Luleå University of Technology Location: Banquet Hall Floor 3 Chair: Dr. Jiantong Li, KTH
3:45pm - 4:00pm	CLS: Closing session Location: Banquet Hall Floor 3 Chair: Heidi Lundén, Schott Primoceler Oy / IMAPS Nordic

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