Conference Agenda
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
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Session Overview |
Date: Tuesday, 11/June/2024 | |
10:00am - 1:00pm |
SC1: Semiconductor packaging using structured glass panels as platform, Dr. Martin Letz, SCHOTT AG, Location: Banquet Hall Floor 3 Chair: Anders E. Petersen, Demant / Oticon |
1:00pm - 1:45pm |
Short course lunch Location: Exhibition area Floor 1 1/2 |
2:00pm - 5:30pm |
BTBF: Next-Gen Packaging Location: Banquet Hall Floor 3 Chair: Heidi Lundén, Schott Primoceler Oy / IMAPS Nordic Tuesday afternoon collaboration session with Business Finland and Business Tampere 14.00-17.30 |
6:00pm - 9:00pm |
WR: Welcome reception Location: Päänäyttämön lämpiö (entrance via outdoors) |
Date: Wednesday, 12/June/2024 | |
8:00am - 11:00am |
E_setup: Exhbitor setup Location: Exhibition area Floor 1 1/2 |
8:30am - 3:00pm |
Reg: Registration Location: Entrance Hall |
9:00am - 11:00am |
SC2: "Sustainable materials in electronics", Attila Géczy, Budspest University of Technology, Hungary Location: Banquet Hall Floor 3 Chair: Dr. Markku Sakari Lahti, VTT Technical Research Centre of Finland, Ltd. / IMAPS Nordic |
11:00am - 11:30am |
CB1: Coffee & tea Location: Exhibition area Floor 1 1/2 |
11:30am - 11:45am |
OS: Opening Session Location: Banquet Hall Floor 3 Chair: Heidi Lundén, Schott Primoceler Oy / IMAPS Nordic test further info |
11:30am - 5:00pm |
Exh1: Exhibition Location: Exhibition area Floor 1 1/2 |
11:45am - 12:15pm |
Keynote 1: The European Chips Act: Opportunities and Challenges, Ralph W. Bernstein (PhD), SINTEF AS Location: Banquet Hall Floor 3 Chair: Dr. Daniel Wright, SINTEF Digital / IMAPS Nordic |
12:15pm - 1:00pm |
LW: Lunch Location: Päänäyttämön lämpiö (entrance via outdoors) |
1:00pm - 1:45pm |
Keynote 2: Textile-based Wearable Antennas and Interconnections in Body-centric Wireless Systems, Prof. Leena Ukkonen, Tampere University Location: Banquet Hall Floor 3 Chair: Paul Collander, IMAPS Nordic |
1:45pm - 2:15pm |
CB2: Coffee & Tea Location: Exhibition area Floor 1 1/2 |
2:15pm - 4:15pm |
WS: Workshop: Photonics-electronics integration and co-packaging. From technology to applications Location: Banquet Hall Floor 3
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4:30pm - 5:00pm |
AM: IMAPS Nordic Annual Meeting Location: Banquet Hall Floor 3 Chair: Heidi Lundén, Schott Primoceler Oy / IMAPS Nordic Annual Meeting for IMAPS Nordic memebers |
7:00pm - 10:00pm |
CD: Conference dinner Location: Restaurant Ravintola Myllärit |
Date: Thursday, 13/June/2024 | ||
9:00am - 11:00am |
T1A: 3D Advanced Packaging Location: Banquet Hall Floor 3 Chair: Anders E. Petersen, Demant / Oticon 3D ceramic packaging; a solution to high-density device integration at harsh environments Microcertec, France 9:24am - 9:48am Direct copper interconnection: laser direct structuring and morphological characterization of copper plated vias. ST Microelectronics, Italy 9:48am - 10:12am Accelerate and optimize your packaging using large-scale multiphysics simulations in your browser Quanscient, Finland 10:12am - 10:36am Molding Process Simulation and Viscoelastic Model for Package Warpage Anticipation STMicroelectronics, Italy 10:36am - 11:00am Development of a Non-contact Jet Dispensing of Liquid Metals 1: Department of Materials Science and Engineering, Division of Microsystems Technology, Ångström Laboratory, Uppsala University, Uppsala, Sweden; 2: Mycronic AB, Täby, Sweden; 3: STMicroelectronics, Agrate Brianza, MB, Italy |
T1B: Micropackaging Applications Location: Väinö Voionmaa Floor 8 Chair: Dr. Daniel Wright, SINTEF Digital / IMAPS Nordic LTCC Back-scattered Polarization Duplexing Chipless RFID for Nearfield Interrogation IMST GmbH, Germany 9:24am - 9:48am Anti-biofouling PCL-based Polyurethane Permselective Film Packaging for Dopamine-sensing Brain Implant Tampere University, Finland 9:48am - 10:12am OPMMEG – Development of sensor package for measuring magnetic fields from brain VTT Technical Research Centre of Finland, Ltd., Finland 10:12am - 10:36am Advanced Nanopackaging for Silicon Nanowire Sensor 1: The City University of New York, United States of America; 2: Korea Research Institute of Ships & Ocean Engineering in Republic of Korea. 10:36am - 11:00am Innovative Digital System In Package building block development for futur space equipments 1: Thales Alenia Space; 2: Hytek; 3: Panasonic; 4: Somacis; 5: IMT |
9:00am - 3:00pm |
Exh2 Location: Exhibition area Floor 1 1/2 |
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11:00am - 11:30am |
CB3: Coffee and tea break Location: Exhibition area Floor 1 1/2 |
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11:30am - 12:15pm |
Keynote 3: From Reliability of Mobile Phone Packages to Advanced Solutions for Telecom Base Stations and Renewable Energy, Dr. Olli Salmela, Nokia Bell Labs Location: Banquet Hall Floor 3 Chair: Dr. Markku Sakari Lahti, VTT Technical Research Centre of Finland, Ltd. / IMAPS Nordic |
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12:15pm - 1:00pm |
LT: Lunch Location: Päänäyttämön lämpiö (entrance via outdoors) |
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1:00pm - 3:00pm |
T2A: Materials and Processing Location: Banquet Hall Floor 3 Chair: Dr. Jiantong Li, KTH Novel degradable and water dissoluble substrate for Printed Circuit Board (PCB) applications 1: Budapest University of Technology and Economics, Hungary Faculty of Electrical Engineering and Informatics, Department of Electronics Technology; 2: DegrAway Technologies Ltd., Hungary 1:24pm - 1:48pm Simultaneous Modeling of Swelling and Heat Transfer in Polymers 1: Graz University of Technology, Graz, Austria; 2: Ottronic E-Systems, Fohnsdorf, Austria; 3: Clausthal University of Technology, Clausthal-Zellerfeld, Germany 1:48pm - 2:12pm Monolithic fabrication of on-paper self-charging power systems through direct ink writing KTH Royal Institute of Technology, Sweden 2:12pm - 2:36pm Comparative Simulation of Thermally Conductive Silicone Grease and Graphene-enhanced Thermal Pad in Single-chip and Multi-chip Packaging 1: Shanghai Ruixi New Materials High Tech Co. Ltd., No 818, Chuhua North Road, Shanghai, P. R. China; 2: Shanghai Institute of IC Materials, No 333, Huangqing Road, Jiading District, Shanghai, P. R. China c SHT Smart High-Tech AB, Arendals Allé 3, SE-418 79 Gothenburg, Sweden; 3: SHT Smart High-Tech AB, Arendals Allé 3, SE-418 79 Gothenburg, Sweden; 4: Electronics Materials and Systems Laboratory, Department of Microtechnology and Nanoscience, Chalmers University of Technology, Kemivägen 9, SE 412 96, Gothenburg, Sweden 2:36pm - 3:00pm PurPest - developing a sensor system prototype for detecting pests in plants 1: SINTEF Digital, Norway; 2: Norwegian Institute of Bioeconomy Research (NIBIO) |
T2B: Optoelectronics and photonics Location: Väinö Voionmaa Floor 8 Chair: Dr. Hoang-Vu Nguyen, University of South-Eastern Norway (USN) Integration of a miniature multichannel laser diode chip to a silicon photonics integrated circuit using Laser-Assisted Bonding Tampere University, Finland 1:24pm - 1:48pm Advancements in Microelectronic and Optoelectronic Packaging: Novel Approaches for Enhanced Performance and Reliability SAES GROUP, Italy 1:48pm - 2:12pm Sodium silicate as an enabler for wafer bonding of glass substrates and lids Tyndall National Institute, Ireland 2:12pm - 2:36pm Assembly of optical micro-ring resonator-based ultrasound sensor for photoacoustic imaging 1: Tampere university, Finland; 2: AIT Austrian Institute of Technology, Austria 2:36pm - 3:00pm Co-Integration of microelectronics and photonics in novel sensor 1: SINTEF Digital, Norway; 2: PHIX, The Netherlands |
3:00pm - 3:15pm |
CB4: Coffee and tea break Location: Exhibition area Floor 1 1/2 |
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3:15pm - 3:45pm |
Keynote 4: A Fully Additive Manufacturing Approach for the Fabrication of Interconnects, Onboard, and Embedded Passives for HDI-Printed Circuit Boards, Dr. Shailesh Singh Chouhan, Luleå University of Technology Location: Banquet Hall Floor 3 Chair: Dr. Jiantong Li, KTH |
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3:45pm - 4:00pm |
CLS: Closing session Location: Banquet Hall Floor 3 Chair: Heidi Lundén, Schott Primoceler Oy / IMAPS Nordic |
Contact and Legal Notice · Contact Address: Privacy Statement · Conference: NordPac 2024 |
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