Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

 
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Session Overview
Date: Tuesday, 11/June/2024
10:00am
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1:00pm		 SC1: Semiconductor packaging using structured glass panels as platform, Dr. Martin Letz, SCHOTT AG,
Location: Banquet Hall Floor 3
Chair: Anders E. Petersen, Demant / Oticon
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1:00pm
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1:45pm		 Short course lunch
Location: Exhibition area Floor 1 1/2
2:00pm
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5:30pm		 BTBF: Next-Gen Packaging
Location: Banquet Hall Floor 3
Chair: Heidi Lundén, Schott Primoceler Oy / IMAPS Nordic
Tuesday afternoon collaboration session with Business Finland and Business Tampere 14.00-17.30
6:00pm
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9:00pm		 WR: Welcome reception
Location: Päänäyttämön lämpiö (entrance via outdoors)

Date: Wednesday, 12/June/2024
8:00am
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11:00am		 E_setup: Exhbitor setup
Location: Exhibition area Floor 1 1/2
8:30am
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3:00pm		 Reg: Registration
Location: Entrance Hall
9:00am
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11:00am		 SC2: "Sustainable materials in electronics", Attila Géczy, Budspest University of Technology, Hungary
Location: Banquet Hall Floor 3
Chair: Dr. Markku Sakari Lahti, VTT Technical Research Centre of Finland, Ltd. / IMAPS Nordic
11:00am
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11:30am		 CB1: Coffee & tea
Location: Exhibition area Floor 1 1/2
11:30am
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11:45am		 OS: Opening Session
Location: Banquet Hall Floor 3
Chair: Heidi Lundén, Schott Primoceler Oy / IMAPS Nordic
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11:30am
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5:00pm		 Exh1: Exhibition
Location: Exhibition area Floor 1 1/2
11:45am
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12:15pm		 Keynote 1: The European Chips Act: Opportunities and Challenges, Ralph W. Bernstein (PhD), SINTEF AS
Location: Banquet Hall Floor 3
Chair: Dr. Daniel Wright, SINTEF Digital / IMAPS Nordic
12:15pm
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1:00pm		 LW: Lunch
Location: Päänäyttämön lämpiö (entrance via outdoors)
1:00pm
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1:45pm		 Keynote 2: Textile-based Wearable Antennas and Interconnections in Body-centric Wireless Systems, Prof. Leena Ukkonen, Tampere University
Location: Banquet Hall Floor 3
Chair: Paul Collander, IMAPS Nordic
1:45pm
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2:15pm		 CB2: Coffee & Tea
Location: Exhibition area Floor 1 1/2
2:15pm
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4:15pm		 WS: Workshop: Photonics-electronics integration and co-packaging. From technology to applications
Location: Banquet Hall Floor 3
    Topics:
  • Scalable foundry enablement for electronic and photonic co-design
  • Commercial perspective to electronics-photonics packaging
  • Integration of photonics components – the common ground with microelectronics
  • Micro-transfer printing hybrid integration
  • Silicon photonics platfrom
  • Monolithic integrated photonics with metasurfaces – COMPAS
  • Medical application of hybrid system
4:30pm
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5:00pm		 AM: IMAPS Nordic Annual Meeting
Location: Banquet Hall Floor 3
Chair: Heidi Lundén, Schott Primoceler Oy / IMAPS Nordic
Annual Meeting for IMAPS Nordic memebers
7:00pm
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10:00pm		 CD: Conference dinner
Location: Restaurant Ravintola Myllärit

Date: Thursday, 13/June/2024
9:00am
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11:00am		 T1A: 3D Advanced Packaging
Location: Banquet Hall Floor 3
Chair: Anders E. Petersen, Demant / Oticon
 T1B: Micropackaging Applications
Location: Väinö Voionmaa Floor 8
Chair: Dr. Daniel Wright, SINTEF Digital / IMAPS Nordic
9:00am
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3:00pm		 Exh2
Location: Exhibition area Floor 1 1/2
11:00am
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11:30am		 CB3: Coffee and tea break
Location: Exhibition area Floor 1 1/2
11:30am
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12:15pm		 Keynote 3: From Reliability of Mobile Phone Packages to Advanced Solutions for Telecom Base Stations and Renewable Energy, Dr. Olli Salmela, Nokia Bell Labs
Location: Banquet Hall Floor 3
Chair: Dr. Markku Sakari Lahti, VTT Technical Research Centre of Finland, Ltd. / IMAPS Nordic
12:15pm
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1:00pm		 LT: Lunch
Location: Päänäyttämön lämpiö (entrance via outdoors)
1:00pm
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3:00pm		 T2A: Materials and Processing
Location: Banquet Hall Floor 3
Chair: Dr. Jiantong Li, KTH
 T2B: Optoelectronics and photonics
Location: Väinö Voionmaa Floor 8
Chair: Dr. Hoang-Vu Nguyen, University of South-Eastern Norway (USN)
3:00pm
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3:15pm		 CB4: Coffee and tea break
Location: Exhibition area Floor 1 1/2
3:15pm
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3:45pm		 Keynote 4: A Fully Additive Manufacturing Approach for the Fabrication of Interconnects, Onboard, and Embedded Passives for HDI-Printed Circuit Boards, Dr. Shailesh Singh Chouhan, Luleå University of Technology
Location: Banquet Hall Floor 3
Chair: Dr. Jiantong Li, KTH
3:45pm
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4:00pm		 CLS: Closing session
Location: Banquet Hall Floor 3
Chair: Heidi Lundén, Schott Primoceler Oy / IMAPS Nordic