Conference Agenda

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Session Overview

Session

WS: Workshop: Photonics-electronics integration and co-packaging. From technology to applications Time: Wednesday, 12/June/2024: 2:15pm - 4:15pm Location: Banquet Hall Floor 3 3rd floor Topics: Scalable foundry enablement for electronic and photonic co-design Commercial perspective to electronics-photonics packaging Integration of photonics components – the common ground with microelectronics Micro-transfer printing hybrid integration Silicon photonics platfrom Monolithic integrated photonics with metasurfaces – COMPAS Medical application of hybrid system

Session Abstract

Time Presenter Topic / title 14:15 - 14:20 Prof. Mircea Guina Tampere University, Finland Welcome and introduction 14:20 - 14:40 Dr. Twan Korthorst Synopsys Photonic IC Solutions Scalable foundry enablement for electronic and photonic co-design 14:40 - 15:00 Dr. How Yuan HWANG Tyndall National Institute, Ireland Integration of photonics components – the common ground with microelectronics 15:00 - 15:20 Dr. Jukka Viheriälä Tampere University, Finland   Micro-transfer printing for hybrid integration 15:20 - 15:40 Dr. Timo Aalto VTT, Finland Silicon photonics platfrom 15:40 - 16:00 Dr. Firehun Dullo SINTEF, Norway Monolithic integrated photonics with metasurfaces - COMPAS 16:00 - 16:20 Dr. Jussi Hiltunen VTT, Finland Medical application of hybrid systems 16:20 - 16:45 Open session Prof. Mircea Guina Project brokerage (1 slide), Q&A and discussion

No contributions were assigned to this session.