Conference Time: 23rd Nov 2024, 04:45:21pm EET
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WS: Workshop: Photonics-electronics integration and co-packaging. From technology to applications
Time:
Wednesday, 12/June/2024:
2:15pm - 4:15pm
Location: Banquet Hall Floor 3 3rd floor
Topics: Scalable foundry enablement for electronic and photonic co-design Commercial perspective to electronics-photonics packaging Integration of photonics components – the common ground with microelectronics Micro-transfer printing hybrid integration Silicon photonics platfrom Monolithic integrated photonics with metasurfaces – COMPAS Medical application of hybrid system
Time Presenter Topic / title 14:15 - 14:20 Prof. Mircea Guina
Tampere University , Finland
Welcome and introduction 14:20 - 14:40 Dr. Twan Korthorst
Synopsys Photonic IC Solutions
Scalable foundry enablement for electronic and photonic co-design 14:40 - 15:00 Dr. How Yuan HWANG
Tyndall National Institute , Ireland
Integration of photonics components – the common ground with microelectronics 15:00 - 15:20
Micro-transfer printing for hybrid integration 15:20 - 15:40 Dr. Timo Aalto
VTT, Finland
Silicon photonics platfrom 15:40 - 16:00 Dr. Firehun Dullo
SINTEF, Norway
Monolithic integrated photonics with metasurfaces - COMPAS 16:00 - 16:20 Dr. Jussi Hiltunen
VTT, Finland
Medical application of hybrid systems 16:20 - 16:45 Open session
Prof. Mircea Guina
Project brokerage (1 slide), Q&A and discussion
No contributions were assigned to this session.
