Conference Agenda
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
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Session Overview |
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BTBF: Next-Gen Packaging
Tuesday afternoon collaboration session with Business Finland and Business Tampere 14.00-17.30
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14:00 Welcome and opening words Business Finland, Business Tampere & IMAPS Nordic 14:10 Keynote: Advanced packaging and system integration Martin Jaiser, Technical Project Management and Business Development, ASE 15:00 Growth from semiconductors Tomy Runne, Chair of Semiconductor Branch Group, Technology Industries of Finland 15:20 Developments from Finnish Semiconductor Industry Tomi Salo, Co-Creation Manager, Kvanttinova Juha Purmonen, Executive Director, Photonics Finland Mircea Guina, Professor, SiPFAB 15:50 Coffee break 16:20 Panel discussion: Future Visions and Opportunities of Packaging Industry Moderator: Tuomas Hollman, Director, Bosch Sensortec Panelists: Ville Hevonkorpi, Managing Director, Schott Primoceler Senni Laaksonen, Vice President, Research and Development, Murata Veijo Kontas, Head of SoC, Nokia Mobile Network Martin Jaiser, Technical Project Management and Business Development, ASE 17:00 NordPac exhibitors and sponsors brief introduction |
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