JavaScript is Disabled
Your browser's JavaScript functionality is disabled. It has to be enabled to use this function of ConfTool.
Here you can find information on how to enable JavaScript
If you have any problems, please contact the organisers at info@nordpac.org.

Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Session Overview
Location: Väinö Voionmaa Floor 8 8th floor

Date: Thursday, 13/June/2024

9:00am
-
11:00am

T1B: Micropackaging Applications
Location: Väinö Voionmaa Floor 8
Chair: Dr. Daniel Wright, SINTEF Digital / IMAPS Nordic

9:00am - 9:24am

LTCC Back-scattered Polarization Duplexing Chipless RFID for Nearfield Interrogation

Peter Uhlig, Enrico Tolin

IMST GmbH, Germany

9:24am - 9:48am

Anti-biofouling PCL-based Polyurethane Permselective Film Packaging for Dopamine-sensing Brain Implant

Stefanus Wirdatmadja, Vijay Singh Parihar, Lauri Sydänheimo, Merja Voutilainen, Minna Kellomäki, Leena Ukkonen

Tampere University, Finland

9:48am - 10:12am

OPMMEG – Development of sensor package for measuring magnetic fields from brain

Markku Sakari Lahti

VTT Technical Research Centre of Finland, Ltd., Finland

10:12am - 10:36am

Advanced Nanopackaging for Silicon Nanowire Sensor

Thambiraj Selvarathinam¹, Bruce Kim¹, Lee Jeong H.², Park Jong W.²

1: The City University of New York, United States of America; 2: Korea Research Institute of Ships & Ocean Engineering in Republic of Korea.

10:36am - 11:00am

Innovative Digital System In Package building block development for futur space equipments

Hugo GARCIA¹, Hélène JOCHEM¹, Norbert VENET¹, Mirko ROCCI¹, Luca SOLLECCHIA¹, Andres Matias Dabas¹, Poul JUUL², Kim Ankeraa², Monique Mayr³, Paolo Scalmati⁴, Giovanni Cucinella⁵

1: Thales Alenia Space; 2: Hytek; 3: Panasonic; 4: Somacis; 5: IMT

1:00pm
-
3:00pm

T2B: Optoelectronics and photonics
Location: Väinö Voionmaa Floor 8
Chair: Dr. Hoang-Vu Nguyen, University of South-Eastern Norway (USN)

1:00pm - 1:24pm

Integration of a miniature multichannel laser diode chip to a silicon photonics integrated circuit using Laser-Assisted Bonding

Aleksandr Vlasov, Santeri Lehtinen, Evgenii Lepukhov, Heikki Virtanen, Samu-Pekka Ojanen, Jukka Viheriälä, Mircea Guina

Tampere University, Finland

1:24pm - 1:48pm

Advancements in Microelectronic and Optoelectronic Packaging: Novel Approaches for Enhanced Performance and Reliability

GIOVANNI ZAFARANA, LUCA MAURI, ENEA RIZZI, ALESSIO CORAZZA

SAES GROUP, Italy

1:48pm - 2:12pm

Sodium silicate as an enabler for wafer bonding of glass substrates and lids

Parnika Gupta, Joseph O' Brien, Jun Su Lee, How Yuan Hwang, Kamil Gradkowski, Padraic E. Morrissey, Peter O' Brien

Tyndall National Institute, Ireland

2:12pm - 2:36pm

Assembly of optical micro-ring resonator-based ultrasound sensor for photoacoustic imaging

Evgenii Lepukhov¹, Aleksandr Vlasov¹, Santhosh Pandian¹, Rainer Hainberger², Paul Müllner², Moritz Eggeling², Tapio Niemi¹

1: Tampere university, Finland; 2: AIT Austrian Institute of Technology, Austria

2:36pm - 3:00pm

Co-Integration of microelectronics and photonics in novel sensor

Firehun Dullo¹, Daniel Wright¹, Christpher Dirdal¹, Marco Povoli¹, Anneirudh Sundararajan², Milan Milosevic²

1: SINTEF Digital, Norway; 2: PHIX, The Netherlands

Mobile View Print View

Contact and Legal Notice · Contact Address:
Privacy Statement · Conference: NordPac 2024