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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Session Overview
Location: Banquet Hall Floor 3 3rd floor

Date: Tuesday, 11/June/2024
10:00am - 1:00pm	SC1: Semiconductor packaging using structured glass panels as platform, Dr. Martin Letz, SCHOTT AG, Location: Banquet Hall Floor 3 Chair: Anders E. Petersen, Demant / Oticon See this link<\a> for more information.
2:00pm - 5:30pm	BTBF: Next-Gen Packaging Location: Banquet Hall Floor 3 Chair: Heidi Lundén, Schott Primoceler Oy / IMAPS Nordic Tuesday afternoon collaboration session with Business Finland and Business Tampere 14.00-17.30

Date: Wednesday, 12/June/2024
9:00am - 11:00am	SC2: "Sustainable materials in electronics", Attila Géczy, Budspest University of Technology, Hungary Location: Banquet Hall Floor 3 Chair: Dr. Markku Sakari Lahti, VTT Technical Research Centre of Finland, Ltd. / IMAPS Nordic
11:30am - 11:45am	OS: Opening Session Location: Banquet Hall Floor 3 Chair: Heidi Lundén, Schott Primoceler Oy / IMAPS Nordic test further info
11:45am - 12:15pm	Keynote 1: The European Chips Act: Opportunities and Challenges, Ralph W. Bernstein (PhD), SINTEF AS Location: Banquet Hall Floor 3 Chair: Dr. Daniel Wright, SINTEF Digital / IMAPS Nordic
1:00pm - 1:45pm	Keynote 2: Textile-based Wearable Antennas and Interconnections in Body-centric Wireless Systems, Prof. Leena Ukkonen, Tampere University Location: Banquet Hall Floor 3 Chair: Paul Collander, IMAPS Nordic
2:15pm - 4:15pm	WS: Workshop: Photonics-electronics integration and co-packaging. From technology to applications Location: Banquet Hall Floor 3 Topics: Scalable foundry enablement for electronic and photonic co-design Commercial perspective to electronics-photonics packaging Integration of photonics components – the common ground with microelectronics Micro-transfer printing hybrid integration Silicon photonics platfrom Monolithic integrated photonics with metasurfaces – COMPAS Medical application of hybrid system
4:30pm - 5:00pm	AM: IMAPS Nordic Annual Meeting Location: Banquet Hall Floor 3 Chair: Heidi Lundén, Schott Primoceler Oy / IMAPS Nordic Annual Meeting for IMAPS Nordic memebers

Date: Thursday, 13/June/2024
9:00am - 11:00am	T1A: 3D Advanced Packaging Location: Banquet Hall Floor 3 Chair: Anders E. Petersen, Demant / Oticon 9:00am - 9:24am 3D ceramic packaging; a solution to high-density device integration at harsh environments Khashayar Khazen, Pascal Metayer Microcertec, France 9:24am - 9:48am Direct copper interconnection: laser direct structuring and morphological characterization of copper plated vias. Alessandro Mellina Gottardo, Claudio Zafferoni, Riccardo Villa ST Microelectronics, Italy 9:48am - 10:12am Accelerate and optimize your packaging using large-scale multiphysics simulations in your browser Abhishek Deshmukh, Rahul Nagaraja, Jonni Lohi, Mika Lyly, Janne Ruuskanen, Alexandre Halbach, Bassou Khouya Quanscient, Finland 10:12am - 10:36am Molding Process Simulation and Viscoelastic Model for Package Warpage Anticipation Marco Rovitto, Alessandro Mellina STMicroelectronics, Italy 10:36am - 11:00am Development of a Non-contact Jet Dispensing of Liquid Metals Jan Maslik¹, Gustaf Mårtensson², Alessandro Gumiero³, Elio Cometti³, Klas Hjort¹ 1: Department of Materials Science and Engineering, Division of Microsystems Technology, Ångström Laboratory, Uppsala University, Uppsala, Sweden; 2: Mycronic AB, Täby, Sweden; 3: STMicroelectronics, Agrate Brianza, MB, Italy
11:30am - 12:15pm	Keynote 3: From Reliability of Mobile Phone Packages to Advanced Solutions for Telecom Base Stations and Renewable Energy, Dr. Olli Salmela, Nokia Bell Labs Location: Banquet Hall Floor 3 Chair: Dr. Markku Sakari Lahti, VTT Technical Research Centre of Finland, Ltd. / IMAPS Nordic
1:00pm - 3:00pm	T2A: Materials and Processing Location: Banquet Hall Floor 3 Chair: Dr. Jiantong Li, KTH 1:00pm - 1:24pm Novel degradable and water dissoluble substrate for Printed Circuit Board (PCB) applications Attila Géczy¹, István Hajdu¹, Amir Hamadeh¹, Csaba Farkas¹, Péter Tamás Lajter² 1: Budapest University of Technology and Economics, Hungary Faculty of Electrical Engineering and Informatics, Department of Electronics Technology; 2: DegrAway Technologies Ltd., Hungary 1:24pm - 1:48pm Simultaneous Modeling of Swelling and Heat Transfer in Polymers Stefan Wagner¹, Mario Gschwandl², Roland Nagl¹, Michael Fischlschweiger³, Tim Zeiner¹ 1: Graz University of Technology, Graz, Austria; 2: Ottronic E-Systems, Fohnsdorf, Austria; 3: Clausthal University of Technology, Clausthal-Zellerfeld, Germany 1:48pm - 2:12pm Monolithic fabrication of on-paper self-charging power systems through direct ink writing Yingchun Su, Yujie Fu, Shiqian Chen, Zheng Li, Han Xue, Jiantong Li KTH Royal Institute of Technology, Sweden 2:12pm - 2:36pm Comparative Simulation of Thermally Conductive Silicone Grease and Graphene-enhanced Thermal Pad in Single-chip and Multi-chip Packaging Jiabin Chen¹, Yunzheng Xuan², Yiran Liu², Jin Chen¹, Yuanyuan Wang³, Johan Möller³, Johan Liu^1,4 1: Shanghai Ruixi New Materials High Tech Co. Ltd., No 818, Chuhua North Road, Shanghai, P. R. China; 2: Shanghai Institute of IC Materials, No 333, Huangqing Road, Jiading District, Shanghai, P. R. China c SHT Smart High-Tech AB, Arendals Allé 3, SE-418 79 Gothenburg, Sweden; 3: SHT Smart High-Tech AB, Arendals Allé 3, SE-418 79 Gothenburg, Sweden; 4: Electronics Materials and Systems Laboratory, Department of Microtechnology and Nanoscience, Chalmers University of Technology, Kemivägen 9, SE 412 96, Gothenburg, Sweden 2:36pm - 3:00pm PurPest - developing a sensor system prototype for detecting pests in plants Daniel Wright¹, Andrea Ficke² 1: SINTEF Digital, Norway; 2: Norwegian Institute of Bioeconomy Research (NIBIO)
3:15pm - 3:45pm	Keynote 4: A Fully Additive Manufacturing Approach for the Fabrication of Interconnects, Onboard, and Embedded Passives for HDI-Printed Circuit Boards, Dr. Shailesh Singh Chouhan, Luleå University of Technology Location: Banquet Hall Floor 3 Chair: Dr. Jiantong Li, KTH
3:45pm - 4:00pm	CLS: Closing session Location: Banquet Hall Floor 3 Chair: Heidi Lundén, Schott Primoceler Oy / IMAPS Nordic

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