Conference Agenda

3D ceramic packaging; a solution to high-density device integration at harsh environments

Khashayar Khazen, Pascal Metayer

Microcertec, France

Direct copper interconnection: laser direct structuring and morphological characterization of copper plated vias.

Alessandro Mellina Gottardo, Claudio Zafferoni, Riccardo Villa

ST Microelectronics, Italy

Accelerate and optimize your packaging using large-scale multiphysics simulations in your browser

Abhishek Deshmukh, Rahul Nagaraja, Jonni Lohi, Mika Lyly, Janne Ruuskanen, Alexandre Halbach, Bassou Khouya

Quanscient, Finland

Molding Process Simulation and Viscoelastic Model for Package Warpage Anticipation

Marco Rovitto, Alessandro Mellina

STMicroelectronics, Italy

Development of a Non-contact Jet Dispensing of Liquid Metals

Jan Maslik¹, Gustaf Mårtensson², Alessandro Gumiero³, Elio Cometti³, Klas Hjort¹

1: Department of Materials Science and Engineering, Division of Microsystems Technology, Ångström Laboratory, Uppsala University, Uppsala, Sweden; 2: Mycronic AB, Täby, Sweden; 3: STMicroelectronics, Agrate Brianza, MB, Italy

LTCC Back-scattered Polarization Duplexing Chipless RFID for Nearfield Interrogation

Peter Uhlig, Enrico Tolin

IMST GmbH, Germany

Anti-biofouling PCL-based Polyurethane Permselective Film Packaging for Dopamine-sensing Brain Implant

Stefanus Wirdatmadja, Vijay Singh Parihar, Lauri Sydänheimo, Merja Voutilainen, Minna Kellomäki, Leena Ukkonen

Tampere University, Finland

OPMMEG – Development of sensor package for measuring magnetic fields from brain

Markku Sakari Lahti

VTT Technical Research Centre of Finland, Ltd., Finland

Advanced Nanopackaging for Silicon Nanowire Sensor

Thambiraj Selvarathinam¹, Bruce Kim¹, Lee Jeong H.², Park Jong W.²

1: The City University of New York, United States of America; 2: Korea Research Institute of Ships & Ocean Engineering in Republic of Korea.

Innovative Digital System In Package building block development for futur space equipments

Hugo GARCIA¹, Hélène JOCHEM¹, Norbert VENET¹, Mirko ROCCI¹, Luca SOLLECCHIA¹, Andres Matias Dabas¹, Poul JUUL², Kim Ankeraa², Monique Mayr³, Paolo Scalmati⁴, Giovanni Cucinella⁵

1: Thales Alenia Space; 2: Hytek; 3: Panasonic; 4: Somacis; 5: IMT

Novel degradable and water dissoluble substrate for Printed Circuit Board (PCB) applications

Attila Géczy¹, István Hajdu¹, Amir Hamadeh¹, Csaba Farkas¹, Péter Tamás Lajter²

1: Budapest University of Technology and Economics, Hungary Faculty of Electrical Engineering and Informatics, Department of Electronics Technology; 2: DegrAway Technologies Ltd., Hungary

Simultaneous Modeling of Swelling and Heat Transfer in Polymers

Stefan Wagner¹, Mario Gschwandl², Roland Nagl¹, Michael Fischlschweiger³, Tim Zeiner¹

1: Graz University of Technology, Graz, Austria; 2: Ottronic E-Systems, Fohnsdorf, Austria; 3: Clausthal University of Technology, Clausthal-Zellerfeld, Germany

Monolithic fabrication of on-paper self-charging power systems through direct ink writing

Yingchun Su, Yujie Fu, Shiqian Chen, Zheng Li, Han Xue, Jiantong Li

KTH Royal Institute of Technology, Sweden

Comparative Simulation of Thermally Conductive Silicone Grease and Graphene-enhanced Thermal Pad in Single-chip and Multi-chip Packaging

Jiabin Chen¹, Yunzheng Xuan², Yiran Liu², Jin Chen¹, Yuanyuan Wang³, Johan Möller³, Johan Liu^1,4

1: Shanghai Ruixi New Materials High Tech Co. Ltd., No 818, Chuhua North Road, Shanghai, P. R. China; 2: Shanghai Institute of IC Materials, No 333, Huangqing Road, Jiading District, Shanghai, P. R. China c SHT Smart High-Tech AB, Arendals Allé 3, SE-418 79 Gothenburg, Sweden; 3: SHT Smart High-Tech AB, Arendals Allé 3, SE-418 79 Gothenburg, Sweden; 4: Electronics Materials and Systems Laboratory, Department of Microtechnology and Nanoscience, Chalmers University of Technology, Kemivägen 9, SE 412 96, Gothenburg, Sweden

PurPest - developing a sensor system prototype for detecting pests in plants

Daniel Wright¹, Andrea Ficke²

1: SINTEF Digital, Norway; 2: Norwegian Institute of Bioeconomy Research (NIBIO)

Integration of a miniature multichannel laser diode chip to a silicon photonics integrated circuit using Laser-Assisted Bonding

Aleksandr Vlasov, Santeri Lehtinen, Evgenii Lepukhov, Heikki Virtanen, Samu-Pekka Ojanen, Jukka Viheriälä, Mircea Guina

Tampere University, Finland

Advancements in Microelectronic and Optoelectronic Packaging: Novel Approaches for Enhanced Performance and Reliability

GIOVANNI ZAFARANA, LUCA MAURI, ENEA RIZZI, ALESSIO CORAZZA

SAES GROUP, Italy

Sodium silicate as an enabler for wafer bonding of glass substrates and lids

Parnika Gupta, Joseph O' Brien, Jun Su Lee, How Yuan Hwang, Kamil Gradkowski, Padraic E. Morrissey, Peter O' Brien

Tyndall National Institute, Ireland

Assembly of optical micro-ring resonator-based ultrasound sensor for photoacoustic imaging

Evgenii Lepukhov¹, Aleksandr Vlasov¹, Santhosh Pandian¹, Rainer Hainberger², Paul Müllner², Moritz Eggeling², Tapio Niemi¹

1: Tampere university, Finland; 2: AIT Austrian Institute of Technology, Austria

Co-Integration of microelectronics and photonics in novel sensor

Firehun Dullo¹, Daniel Wright¹, Christpher Dirdal¹, Marco Povoli¹, Anneirudh Sundararajan², Milan Milosevic²

1: SINTEF Digital, Norway; 2: PHIX, The Netherlands