Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

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Session Overview

Date: Thursday, 13/June/2024
9:00am - 11:00am	T1A: 3D Advanced Packaging Location: Banquet Hall Floor 3 Chair: Anders E. Petersen, Demant / Oticon	T1B: Micropackaging Applications Location: Väinö Voionmaa Floor 8 Chair: Dr. Daniel Wright, SINTEF Digital / IMAPS Nordic
9:00am - 3:00pm	Exh2 Location: Exhibition area Floor 1 1/2
11:00am - 11:30am	CB3: Coffee and tea break Location: Exhibition area Floor 1 1/2
11:30am - 12:15pm	Keynote 3: From Reliability of Mobile Phone Packages to Advanced Solutions for Telecom Base Stations and Renewable Energy, Dr. Olli Salmela, Nokia Bell Labs Location: Banquet Hall Floor 3 Chair: Dr. Markku Sakari Lahti, VTT Technical Research Centre of Finland, Ltd. / IMAPS Nordic
12:15pm - 1:00pm	LT: Lunch Location: Päänäyttämön lämpiö (entrance via outdoors)
1:00pm - 3:00pm	T2A: Materials and Processing Location: Banquet Hall Floor 3 Chair: Dr. Jiantong Li, KTH	T2B: Optoelectronics and photonics Location: Väinö Voionmaa Floor 8 Chair: Dr. Hoang-Vu Nguyen, University of South-Eastern Norway (USN)
3:00pm - 3:15pm	CB4: Coffee and tea break Location: Exhibition area Floor 1 1/2
3:15pm - 3:45pm	Keynote 4: A Fully Additive Manufacturing Approach for the Fabrication of Interconnects, Onboard, and Embedded Passives for HDI-Printed Circuit Boards, Dr. Shailesh Singh Chouhan, Luleå University of Technology Location: Banquet Hall Floor 3 Chair: Dr. Jiantong Li, KTH
3:45pm - 4:00pm	CLS: Closing session Location: Banquet Hall Floor 3 Chair: Heidi Lundén, Schott Primoceler Oy / IMAPS Nordic