Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

 
 
Session Overview
Date: Tuesday, 11/June/2024
10:00am
-
1:00pm
SC1: Semiconductor packaging using structured glass panels as platform, Dr. Martin Letz, SCHOTT AG,
Location: Banquet Hall Floor 3
Chair: Anders E. Petersen, Demant / Oticon
1:00pm
-
1:45pm
Short course lunch
Location: Exhibition area Floor 1 1/2
2:00pm
-
5:30pm
BTBF: Next-Gen Packaging
Location: Banquet Hall Floor 3
Chair: Heidi Lundén, Schott Primoceler Oy / IMAPS Nordic
Tuesday afternoon collaboration session with Business Finland and Business Tampere 14.00-17.30
6:00pm
-
9:00pm
WR: Welcome reception
Location: Päänäyttämön lämpiö (entrance via outdoors)

 
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