Sitzung | |
BLOCK 3: Sensorik
| |
Präsentationen | |
14:15 - 14:40
Challenges and Opportunities of Centralized Radar Processing on the way to Autonomous Driving Texas Instruments EMEA Sales GmbH 14:40 - 15:05
Wafer Level HF System in Package for automotive radars Infineon Technologies AG 15:05 - 15:30
Packaging und Zuverlässigkeit von optischen ADAS Sensoren 1Technische Hochschule Ingolstadt, Deutschland; 2Continental Temic microelectronic GmbH 15:30 - 15:55
Automated Driving - Chances and Challenges for Automotive MEMS Robert Bosch GmbH |