| Author(s) | Organization(s) | Session |
| A. Marques, Antonio | Instituto de Telecomunicacoes, Portugal | Opto1_Photonic Module Packaging |
| Aasmundtveit, KNUT EILIF | University of South-Eastern Norway, Norway | MIP3_Low-temperature Materials for Interconnects and Packaging MIP3_Low-temperature Materials for Interconnects and Packaging |
| Abadie, Karine | University Grenoble Alpes CEA, LETI, Grenoble, France | AP2_Hybrid Bonding I |
| Abdilla, Jonathan | BESI, Radfeld, Austria | AP2_Hybrid Bonding I |
| Abo Ras, Mohamad | Nanotest GmbH, Berlin, Germany | Rel3_Progress in Failure Analytical and Material Testing Methods |
| Ackerl, Norbert | Besi Switzerland AG, Steinhausen, Switzerland | AMT2_Computer-aided Process Control Presenter |
| Adavi, Karamat | Huber Automotive AG, Muehlhausen, Germany | RF2_Embedded System-in-Package and Interconnections Technologies Presenter |
| Adorno, Silvia | STMicroelectronics, Italy | AP6_Challenges and Solutions for HI |
| Ain, Kaneeze Noorul | Silicon Austria Labs (SAL), Villach, Austria; Delft University of Technology (TUD), Delft, The Netherlands | Power2_Power Semiconductor Packaging and Cooling Presenter |
| Akhtar, Mohd Zubair | Technische Hochschule Ingolstadt, Ingolstadt, Germany | DTM3_Reliability and Virtual Prototyping Presenter |
| Al-Shami, Hashem | Fraunhofer IZM, Germany | AMT3_Process for Enhancement of Device Robustness Presenter |
| Alajoki, Teemu | VTT Technical Research Centre of Finland, Espoo, Finland | Flex1_Reliability Assessment of Flexible Electronics |
| Albrecht, Jan | Fraunhofer ENAS, Chemnitz, Germany | DTM3_Reliability and Virtual Prototyping |
| Albrecht, Oliver | TU Dresden, Dresden Germany | Poster Session 2 Presenter Power1_Electronics Measurement and Simulation |
| Alexiou, Ioannis | Evatec AG, Trübbach, Switzerland | AP1_Advanced Substrates |
| Alves, Luis Nero | Instituto de Telecomunicacoes, Portugal | Opto1_Photonic Module Packaging |
| Ambrosius, Norbert | LPKF Laser & Electronics SE, Garbsen, Germany | AP1_Advanced Substrates |
| Amos, Brian | The Chemours Company, Newark, USA | Poster Session 2 |
| Anand, Ketan | IHP – Leibniz-Institut für innovative Mikroelektronik, Frankfurt (Oder), Germany | AMT4_Hybrid Bonding, Direct Bonding, Heterogeneous Integration |
| Andrianov, Nikolai | Silicon Austria Labs GmbH, Austria | Poster Session 1 |
| Ankeraa, Kim | Hytek | AMT5_Advanced Materials and Processes |
| Anspach, Nils | LPKF Laser & Electronics SE, Garbsen, Germany | AP1_Advanced Substrates |
| Asseburg, Gerret | University of Applied Science and Arts, Dortmund Soest, Germany | Rel2_Package- and Board Level Moisture- and Thermal Stress-related Reliability Effects |
| Auer, Benedikt | BESI, Radfeld, Austria | AP2_Hybrid Bonding I |
| Azeem, Munir Syed | Silicon Austria Labs GmbH, Austria | Poster Session 1 |