Index of Authors

A list of all persons who contribute to the sessions of this conference. Please select a letter below to list all persons with the corresponding surname. Select the presentation in the right-hand column to access session and presentation details.

Session Overview
 
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Author(s) Organization(s) Session
A. Marques, AntonioInstituto de Telecomunicacoes, PortugalOpto1_Photonic Module Packaging
Aasmundtveit, KNUT EILIFUniversity of South-Eastern Norway, NorwayMIP3_Low-temperature Materials for Interconnects and Packaging
MIP3_Low-temperature Materials for Interconnects and Packaging
Abadie, KarineUniversity Grenoble Alpes CEA, LETI, Grenoble, FranceAP2_Hybrid Bonding I
Abdilla, JonathanBESI, Radfeld, AustriaAP2_Hybrid Bonding I
Abo Ras, MohamadNanotest GmbH, Berlin, GermanyRel3_Progress in Failure Analytical and Material Testing Methods
Ackerl, NorbertBesi Switzerland AG, Steinhausen, SwitzerlandAMT2_Computer-aided Process Control  Presenter
Adavi, KaramatHuber Automotive AG, Muehlhausen, GermanyRF2_Embedded System-in-Package and Interconnections Technologies  Presenter
Adorno, SilviaSTMicroelectronics, ItalyAP6_Challenges and Solutions for HI
Ain, Kaneeze NoorulSilicon Austria Labs (SAL), Villach, Austria;
Delft University of Technology (TUD), Delft, The Netherlands		Power2_Power Semiconductor Packaging and Cooling  Presenter
Akhtar, Mohd ZubairTechnische Hochschule Ingolstadt, Ingolstadt, GermanyDTM3_Reliability and Virtual Prototyping  Presenter
Al-Shami, HashemFraunhofer IZM, GermanyAMT3_Process for Enhancement of Device Robustness  Presenter
Alajoki, TeemuVTT Technical Research Centre of Finland, Espoo, FinlandFlex1_Reliability Assessment of Flexible Electronics
Albrecht, JanFraunhofer ENAS, Chemnitz, GermanyDTM3_Reliability and Virtual Prototyping
Albrecht, OliverTU Dresden, Dresden GermanyPoster Session 2  Presenter
Power1_Electronics Measurement and Simulation
Alexiou, IoannisEvatec AG, Trübbach, SwitzerlandAP1_Advanced Substrates
Alves, Luis NeroInstituto de Telecomunicacoes, PortugalOpto1_Photonic Module Packaging
Ambrosius, NorbertLPKF Laser & Electronics SE, Garbsen, GermanyAP1_Advanced Substrates
Amos, BrianThe Chemours Company, Newark, USAPoster Session 2
Anand, KetanIHP – Leibniz-Institut für innovative Mikroelektronik, Frankfurt (Oder), GermanyAMT4_Hybrid Bonding, Direct Bonding, Heterogeneous Integration
Andrianov, NikolaiSilicon Austria Labs GmbH, AustriaPoster Session 1
Ankeraa, KimHytekAMT5_Advanced Materials and Processes
Anspach, NilsLPKF Laser & Electronics SE, Garbsen, GermanyAP1_Advanced Substrates
Asseburg, GerretUniversity of Applied Science and Arts, Dortmund Soest, GermanyRel2_Package- and Board Level Moisture- and Thermal Stress-related Reliability Effects
Auer, BenediktBESI, Radfeld, AustriaAP2_Hybrid Bonding I
Azeem, Munir SyedSilicon Austria Labs GmbH, AustriaPoster Session 1
Bailey, ChristopherSchool of Electrical, Computer and Energy Engineering, Arizona State University, Arizona, USADTM2_Reduced Order Modeling for Advanced Packaging
Bakonyi, AntalSzéchenyi István University, Győr, HungaryRel4_New Approaches in Reliability Simulation and Modelling  Presenter
Balin, AntoineContinental Reifen Deutschland GmbH, GermanyEmerging II
Balogh, ImreSemilab, Budapest, HungaryPoster Session 1
Bando, KojiShinko Electric Industries Co, LTD. JapanPower2_Power Semiconductor Packaging and Cooling
Bardalen, EivindUniversity of South-Eastern Norway, Notodden, NorwayEmerging I_From Mounting to Recycling – Highlites from Emerging Technologies
Barmettler, ErnstBesi Switzerland AG, Steinhausen, SwitzerlandAMT2_Computer-aided Process Control
Basa, PeterSemilab Semiconductor Physics Laboratory Co. Ltd., Budapest, HungaryPoster Session 3
Bashir, Muhammad FaisalIHP - Leibniz Institut für innovative Mikroelektronik, Frankfurt Oder, GermanyRF1_Millimeter-wave and Sub-THz Antenna-in-Package Integration for High Performance Systems
Baudin, FlorianeUniv. Grenoble Alpes, CEA, LETI, Grenoble, FranceAMT4_Hybrid Bonding, Direct Bonding, Heterogeneous Integration
AP2_Hybrid Bonding I
Baumgartl, HannaCADFEM Germany GmbH, GermanyDTM2_Reduced Order Modeling for Advanced Packaging
Bechtold, TamaraJade University of Applied Sciences, Wilhelmshaven, Germany;
University of Rostock, Rostock, Germany		DTM3_Reliability and Virtual Prototyping
Becker, Karl-FriedrichFraunhofer IZM, Berlin, GermanyAMT1_Innovative Assembly Processes
AP7_Fan Out Packages
Poster Session 3
Bel, ThijsHolst Centre TNO, Eindhoven, The NetherlandsAP9_Power Electronics Packaging
Bellutti, PierluigiFondazione Bruno Kessler, Trento, Italy;
INAF, Italy		Flex2_Formation of a Conductive Interconnection for Flexible Electronics
Poster Session 3
Benesova, AndreaUniversity of West Bohemia, Plzeň, Czech RepublicPoster Session 2
Bensalem, DhiaPlasmatreat, Steinhagen, GermanyPoster Session 1
Beolé, StefaniaUniversity of Turin/ INFN Turin, ItalyPoster Session 3
Flex2_Formation of a Conductive Interconnection for Flexible Electronics
Besseling, ThijsIMEC at Holst Centre., The NetherlandsPoster Session 3
Bex, Pieterimec, Leuven, BelgiumAP2_Hybrid Bonding I  Presenter
Beyer, Geraldimec, Belgium;
IMEC, Leuven, Belgium		AMT2_Computer-aided Process Control
AP6_Challenges and Solutions for HI
Beyne, Ericimec, Leuven, BelgiumAP2_Hybrid Bonding I
AMT2_Computer-aided Process Control
AP2_Hybrid Bonding I
AP4_Advances in WLP Technologies I
AP6_Challenges and Solutions for HI
AP6_Challenges and Solutions for HI
DTM1_Co-design and Modeling for Chiplets
MIP5_Microstructural Properties of Materials for Interconnects
MIP5_Microstructural Properties of Materials for Interconnects
Bhogaraju, Sri KrishnaCuNex GmbHPoster Session 1
Bhutani, AkankshaKIT - Institut für Hochfrequenztechnik und Elektronik (IHE), Karlsruhe, GermanyRF1_Millimeter-wave and Sub-THz Antenna-in-Package Integration for High Performance Systems
Bickel, SteffenFraunhofer IZM - ASSID, Moritzburg Germany;
TU Dresden, Dresden, Germany		AMT6_Enhanced Process Control
MIP1_Advanced Material Architectures for Interconnects  Presenter
Bikaljevic, DjuroBESI, Radfeld, AustriaAP2_Hybrid Bonding I
Bogdanowicz, Januszimec, Leuven, BelgiumAP6_Challenges and Solutions for HI
Bon-mardion, CharlesUniv. Grenoble Alpes, CEA, LETI, Grenoble, FranceMIP1_Advanced Material Architectures for Interconnects  Presenter
Bond, AliceUniv. Grenoble Alpes, CEA, LETI, Grenoble, FranceAMT4_Hybrid Bonding, Direct Bonding, Heterogeneous Integration
Borchardt, Luc SteffenFraunhofer IZM, Berlin, GermanyAP7_Fan Out Packages
Borngräber, LeaTU Dresden, Dresden, GermanyPower1_Electronics Measurement and Simulation
Bortolussi, VincentUMS SAS, Villebon Sur Yvette, FranceAP8_Fan Out Reliability Aspects
Böttcher, LarsFraunhofer IZM, Berlin, GermanyAP1_Advanced Substrates
AP7_Fan Out Packages
Böttger, GunnarFraunhofer IZM, Berlin, GermanyOpto1_Photonic Module Packaging  Presenter
Bourjot, EmilieUniv. Grenoble Alpes, CEA, LETI, Grenoble, FranceAMT4_Hybrid Bonding, Direct Bonding, Heterogeneous Integration
Brand, SebastianFraunhofer IMWS, Halle, GermanyRel1_Reliability Performance and Electromigration Behavior
Branzei, MihaiCETTI UNSTPBAP9_Power Electronics Packaging
Braun, SilviaFraunhofer ENAS, Chemnitz, GermanyMIP1_Advanced Material Architectures for Interconnects
MIP2_Advanced Interconnection Metallurgical Materials and Interconnects
Rel3_Progress in Failure Analytical and Material Testing Methods
Braun, TanjaFraunhofer IZM, Berlin, GermanyAP7_Fan Out Packages
Poster Session 3
Braun, TanjaTU Berlin, Berlin, GermanyAMT1_Innovative Assembly Processes
Brems, Stevenimec, Leuven, BelgiumAP2_Hybrid Bonding I
Breuer, JakobFraunhofer IISB, Erlangen, GermanyPower1_Electronics Measurement and Simulation
Brookes, Toby G.UKRI-Science and Technology Facilities Council, Rutherford Appleton Laboratory, Harwell Campus, Didcot, United KingdomAMT5_Advanced Materials and Processes
Bues, MartinDELO Industrial Adhesives, Windach, GermanyAP8_Fan Out Reliability Aspects
Burcea, Irina MadalinaPOLITEHNICA București National University for Science and Technology, Bukarest, RomaniaPoster Session 3  Presenter
Burghartz, Joachim N.Institut für Mikroelektronik Stuttgart IMS CHIPS, Stuttgart, GermanyPoster Session 2
Burt, DavidKelvin Nanotechnology Ltd., Glasgow, United KingdomAMT5_Advanced Materials and Processes
Cai, JianSchool of Integrated Circuits, Tsinghua University, Beijing, China, Peoples Republic of;
Beijing National Research Center for Information Science and Technology, Beijing, China, Peoples Republic of		DTM4_Device Level Modeling
Campo, AlainUniv. Grenoble Alpes, CEA, LETI, Grenoble, FranceAMT4_Hybrid Bonding, Direct Bonding, Heterogeneous Integration
MIP1_Advanced Material Architectures for Interconnects
Capraro, BeateFraunhofer IKTS, Hermsdorf, GermanyAP9_Power Electronics Packaging
Carazzetti, PatrikEvatec AG, Truebbach, SwitzerlandAP4_Advances in WLP Technologies I  Presenter
Casto, AndreaAT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AustriaAP7_Fan Out Packages
Cerini, FabrizioSTMicroelectronics, ItalyAP6_Challenges and Solutions for HI
Chang, ChristopheUMS SAS, Villebon Sur Yvette, FranceAP8_Fan Out Reliability Aspects
Charbonnier, JeanUniv. Grenoble Alpes, CEA, LETI, Grenoble, FranceMIP1_Advanced Material Architectures for Interconnects
Charley, Anne-Laureimec, Loewen, BelgiumAP2_Hybrid Bonding I
AP6_Challenges and Solutions for HI
Chatterjee, UrmimalaInteruniversity Microelectronics Centre (IMEC), Loewen, BelgiumPower2_Power Semiconductor Packaging and Cooling
Chaudhuri, AdrijaFraunhofer IZM, Berlin, GermanyRel1_Reliability Performance and Electromigration Behavior  Presenter
Chen, Chi-YuanMediaTek, Inc.AMT3_Process for Enhancement of Device Robustness
Chen, RuiEastern Michigan University, Ypsilanti, United States of AmericaFlex1_Reliability Assessment of Flexible Electronics  Presenter
Chew, Soon Aikimec, Loewen, BelgiumAP2_Hybrid Bonding I  Presenter
AP6_Challenges and Solutions for HI  Presenter
Chiappini, FrancescaChip Integration Technology Center, Nijmegen, The Netherlands;
Holst Centre TNO, Eindhoven, The Netherlands		AP9_Power Electronics Packaging  Presenter
Chitchian, ShahabINTEKPLUS Co., Daejeon, Korea, Republic of (South Korea)AMT2_Computer-aided Process Control  Presenter
CHOI, Gwang-MunElectronics and Telecommunications Research Institute (ETRI), Daejeon, Republic of (South Korea)Poster Session 2
Choi, JoonYoungSTATS ChipPAC Korea Ltd.AMT3_Process for Enhancement of Device Robustness
CHOI, Kwang-SeongElectronics and Telecommunications Research Institute (ETRI), Daejeon, Republic of (South Korea)Poster Session 2
Cirillo, MaurizioRheinmetall Italia S.p.A., Rome, ItalyRF2_Embedded System-in-Package and Interconnections Technologies
Cirulis, ImantsFraunhofer ENAS, Chemnitz, GermanyMIP1_Advanced Material Architectures for Interconnects  Presenter
MIP2_Advanced Interconnection Metallurgical Materials and Interconnects
Rel3_Progress in Failure Analytical and Material Testing Methods
Cochet, TomIMEC, Leuven, BelgiumAP6_Challenges and Solutions for HI
MIP5_Microstructural Properties of Materials for Interconnects
coenen, nicoPlasmatreat, Steinhagen, GermanyPoster Session 1
Comeaga, Miruna-LucretiaNational University of Science and Technology POLITEHNICA Bucharest, Bucharest,RomaniaPoster Session 3  Presenter
Conrad, JanineTU Berlin, Berlin, GermanyRel3_Progress in Failure Analytical and Material Testing Methods  Presenter
Corazza, AlessioSAES Getters, Lainate, ItalyPoster Session 3
Corbett, BrianTyndall National Institute, Cork, IrelandOpto2_Heterogenous PIC Integration
Costina, AndreiFraunhofer IZM, Berlin, GermanyMIP6_New materials for Heterogeneous Integration  Presenter
Csiszár, AndrásMeshlin Composites Zrt., Győr, Hungary,Emerging I_From Mounting to Recycling – Highlites from Emerging Technologies
Csukas, Eduard-SebastianContinental Automotive, RomaniaPoster Session 1
Cucinella, GiovanniIMTAMT5_Advanced Materials and Processes
Cuypers, Dieter HIMEC, Leuven, BelgiumAP6_Challenges and Solutions for HI
Cuypers, Dieter H.imec, Leuven, BelgiumAP2_Hybrid Bonding I
D`Havé, Koenimec, Leuven, BelgiumAP2_Hybrid Bonding I
Dao, Thang DuySilicon Austria Labs GmbH, AustriaPoster Session 1
Darázs, Bence DánielRobert Bosch Kft., Budapest, HungaryPoster Session 1
De Messemaeker, Jokeimec, BelgiumMIP5_Microstructural Properties of Materials for Interconnects
De Vos, Joeriimec, Loewen, BelgiumAP2_Hybrid Bonding I
AP6_Challenges and Solutions for HI
De Wolf, IngridDepartment of Materials Engineering (MTM), KU Leuven, Leuven, Belgium;
imec, Leuven, Belgium		MIP5_Microstructural Properties of Materials for Interconnects
Debreceni, TiborRobert Bosch Kft., Budapest, HungaryPoster Session 1  Presenter
Del Sarto, MarcoSTMicroelectronics, ItalyAP6_Challenges and Solutions for HI
Delan, AnnekatrinFraunhofer IZM - ASSID, Moritzburg GermanyAMT6_Enhanced Process Control
Derakhshandeh, JaberIMEC, Leuven, BelgiumAP6_Challenges and Solutions for HI
MIP5_Microstructural Properties of Materials for Interconnects
Deschaseaux, EdouardUniv. Grenoble Alpes, CEA, LETI, Grenoble, FranceMIP1_Advanced Material Architectures for Interconnects
Deubler, ManuelBESI, Radfeld, AustriaAP2_Hybrid Bonding I
Dhakras, Prathameshimec, Leuven, BelgiumAP2_Hybrid Bonding I
Di Nuzzo, GiovanniSanan Semiconductor, Munich, GermanyDTM4_Device Level Modeling  Presenter
Diez, SteffenHeidelberg Instruments Mikrotechnik GmbH, Heidelberg, GermanyAP5_Advances in WLP Technologies II
Ding, FeiInstitute of Microelectronics of the Chinese Academy of Sciences, Beijing, China, People's Republic ofDTM1_Co-design and Modeling for Chiplets
Dominguez, SébastienUniv. Grenoble Alpes, CEA, LETI, Grenoble, FranceAMT4_Hybrid Bonding, Direct Bonding, Heterogeneous Integration
AP2_Hybrid Bonding I
Dontu, OctavianNational University of Science and Technology POLITEHNICA Bucharest, Bucharest,RomaniaPoster Session 3
Drechsel, CarlEvatec AG, Truebbach, SwitzerlandAP4_Advances in WLP Technologies I
Dreissigacker, MarcTU Berlin, Microperipheric Center, Berlin, Germany;
TU Berlin, Berlin, Germany		AP7_Fan Out Packages  Presenter
Poster Session 3
Dresel, FabianFraunhofer IISB, Erlangen, GermanyPower1_Electronics Measurement and Simulation
Driel, W.D VanTU Delft, Delft, The NetherlandsPoster Session 2
Drost, MartinIHP – Leibniz-Institut für innovative Mikroelektronik, Frankfurt (Oder), GermanyAMT4_Hybrid Bonding, Direct Bonding, Heterogeneous Integration
Du, XiangbinThe Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China, People's Republic ofPoster Session 1
Dubarry, ChristopheUniversity Grenoble Alpes CEA, LETI, Grenoble, FranceAP2_Hybrid Bonding I
Dubey, VikasFraunhofer ENAS, Chemnitz, GermanyAMT4_Hybrid Bonding, Direct Bonding, Heterogeneous Integration  Presenter
AP4_Advances in WLP Technologies I
MIP2_Advanced Interconnection Metallurgical Materials and Interconnects  Presenter
Duchemin, HélèneUniv. Grenoble Alpes, CEA, LETI, Grenoble, FranceMIP1_Advanced Material Architectures for Interconnects
Duma, Virgil-FlorinPolytechnic University of Timisoara, Timisoara, RomaniaPoster Session 1  Presenter
Dunker, DanielLPKF Laser & Electronics SE, Garbsen, GermanyAP1_Advanced Substrates
Dunn, KathleenUniversity at Albany, State University of New York, New York, USAMIP2_Advanced Interconnection Metallurgical Materials and Interconnects
Dupont, FrancoisUniversity Liege, Liege, BelgiumAMT3_Process for Enhancement of Device Robustness
E. Schulz, StefanFraunhofer ENAS, Chemnitz, Germany;
TU-Chemnitz, Chemnitz, Germany		AMT4_Hybrid Bonding, Direct Bonding, Heterogeneous Integration
Eckardt, BerndFraunhofer IISB, Erlangen, GermanyPoster Session 1
Power1_Electronics Measurement and Simulation
Ehsanian, MehdiK. N. Toosi University of Technology, Tehran, IranPoster Session 2
Eichhorn, RicoFraunhofer ENAS, Chemnitz, GermanyDTM3_Reliability and Virtual Prototyping
El-Mekki, Zaidimec, BelgiumMIP5_Microstructural Properties of Materials for Interconnects
Elger, GordonTechnische Hochschule Ingolstadt, Ingolstadt, GermanyDTM3_Reliability and Virtual Prototyping
MIP3_Low-temperature Materials for Interconnects and Packaging
Rel3_Progress in Failure Analytical and Material Testing Methods
Endoh, TetsuoTohoku University, Tohoku, JapanPower2_Power Semiconductor Packaging and Cooling
Enot, ThierryUniv. Grenoble Alpes, CEA, LETI, Grenoble, FranceAMT4_Hybrid Bonding, Direct Bonding, Heterogeneous Integration
EOM, Yong-SungElectronics and Telecommunications Research Institute (ETRI), Daejeon, Republic of (South Korea)Poster Session 2
Ernst, DanielTU Dresden, Dresden, GermanyRF2_Embedded System-in-Package and Interconnections Technologies
Ertl, StefanEV Group, Florian am Inn, AustriaOpto2_Heterogenous PIC Integration
Facchinelli, TizianoFondazione Bruno Kessler, Trento, ItalyFlex2_Formation of a Conductive Interconnection for Flexible Electronics
Poster Session 3  Presenter
Farjot, ThierryUniv. Grenoble Alpes, CEA, LETI, Grenoble, FranceMIP1_Advanced Material Architectures for Interconnects
Farkas, CsabaBudapest University of Technology and Economics, Budapest, HungaryEmerging I_From Mounting to Recycling – Highlites from Emerging Technologies
Farnbacher, LukasFraunhofer IISB, Erlangen, GermanyPoster Session 1
Farrell, AlexX-Celeprint Limited, Cork, IrelandOpto2_Heterogenous PIC Integration
Farrugia, Mark LukeChip Integration Technology Center, Nijmegen, The NetherlandsAP9_Power Electronics Packaging
Faure, MargotUniversity Grenoble Alpes CEA, LETI, Grenoble, FranceAP2_Hybrid Bonding I  Presenter
Feautrier, CélineUniv. Grenoble Alpes, CEA, LETI, Grenoble, FranceMIP1_Advanced Material Architectures for Interconnects
Fell, JohannFraunhofer IZM - ASSID, Moritzburg GermanyAMT6_Enhanced Process Control  Presenter
Feuchter, MikeCADFEM Germany GmbH, GermanyDTM2_Reduced Order Modeling for Advanced Packaging  Presenter
Fiedler, ConnyFraunhofer IZM - ASSID, Moritzburg GermanyAMT6_Enhanced Process Control
Fiehler, RalphKSG GmbH, Gornsdorf, GermanyPoster Session 2
Fischer, TobiasFraunhofer ENAS, Chemnitz, Germany;
TU-Chemnitz, Chemnitz, Germany		AMT4_Hybrid Bonding, Direct Bonding, Heterogeneous Integration
Floriot, DidierUMS SAS, Villebon Sur Yvette, FranceAP8_Fan Out Reliability Aspects
Forooghifar, FarnazBesi Switzerland AG, Steinhausen, SwitzerlandAMT2_Computer-aided Process Control
Fournel, FrankUniv. Grenoble Alpes, CEA, LETI, Grenoble, FranceAMT4_Hybrid Bonding, Direct Bonding, Heterogeneous Integration
AP2_Hybrid Bonding I
Franco, Fabiane FantinelliUniversity of Glasgow, Glasgow, United KingdomPoster Session 3
Frank, AlexanderInstitut für Mikroelektronik Stuttgart IMS CHIPS, Stuttgart, GermanyPoster Session 2
Frankosky, JackThe Chemours Company, Newark, USAPoster Session 2
Freitag, ChristianRobert Bosch GmbH, GermanyPoster Session 1
French, Marcus J.UKRI-Science and Technology Facilities Council, Rutherford Appleton Laboratory, Harwell Campus, Didcot, United KingdomAMT5_Advanced Materials and Processes
Fuentes, RubenAmkor Technology, United States of AmericaAP5_Advances in WLP Technologies II  Presenter
Fumita, YusukeLINTEC CorporationAP3_Hybrid Bonding II
Fuse, JunyaYokohama National University, Yokohama, JapanAP3_Hybrid Bonding II  Presenter
Poster Session 2
Gaebler, AlexanderFraunhofer IZM, Berlin, GermanyPoster Session 1  Presenter
Gahein-Sama, NyakeFraunhofer IZM, Berlin, GermanyPoster Session 3
Gandikota, Mohammed IbaadUniversity of Maryland, College Park, USAPoster Session 2
Gao, ChenxiThe Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China, People's Republic ofPoster Session 1
Garai, BálintRobert Bosch GmbH, GermanyPoster Session 1
Garcia, HugoThales Alenia Space, Cannes, FranceAMT5_Advanced Materials and Processes
Géczy, AttilaBudapest University of Technology and Economics, Budapest, HungaryEmerging I_From Mounting to Recycling – Highlites from Emerging Technologies  Presenter
Geens, KarenInteruniversity Microelectronics Centre (IMEC), Loewen, BelgiumPower2_Power Semiconductor Packaging and Cooling
Georgiev, GeorgiKSG GmbH, Gornsdorf, GermanyPoster Session 2
Ger, AvronNova Ltd., Rehovot, IsraelAP2_Hybrid Bonding I
Gerets, CarineIMEC, Leuven, BelgiumAP6_Challenges and Solutions for HI
MIP5_Microstructural Properties of Materials for Interconnects
Gerhold, LutzFraunhofer IZM, Berlin, GermanyRF1_Millimeter-wave and Sub-THz Antenna-in-Package Integration for High Performance Systems
Ghorbanian, NavidUKRI-Science and Technology Facilities Council, Rutherford Appleton Laboratory, Harwell Campus, Didcot, United KingdomAMT5_Advanced Materials and Processes
Giambuzzi, LorenzoRheinmetall Italia S.p.A., Rome, ItalyRF2_Embedded System-in-Package and Interconnections Technologies  Presenter
Gollhardt, AstridFraunhofer IZM, Berlin, GermanyRel1_Reliability Performance and Electromigration Behavior
Gonzalez, Marioimec, Leuven, BelgiumAP2_Hybrid Bonding I
DTM1_Co-design and Modeling for Chiplets
MIP5_Microstructural Properties of Materials for Interconnects
Gottfried, KnutFraunhofer ENAS, Chemnitz, Germany;
ErZm Technologies, Chemnitz, Germany		AMT4_Hybrid Bonding, Direct Bonding, Heterogeneous Integration
Gritti, AlexSTMicroelectronics, ItalyAP6_Challenges and Solutions for HI
Grosse, ChristianFraunhofer IMWS, Halle, GermanyRel1_Reliability Performance and Electromigration Behavior
Grosse-Kockert, CorinnaBerliner Nanotest und Design GmbH, Berlin, GermanyPoster Session 1
Grosso, GiovannaSilicon Austria Labs GmbH, AustriaDTM2_Reduced Order Modeling for Advanced Packaging
Gualberto de Sousa, JacksonChip Integration Technology Center, Nijmegen, The NetherlandsAP9_Power Electronics Packaging
Guina, MirceaTampere University, Tampere, FinlandOpto2_Heterogenous PIC Integration
Gupta, VikasASE, United States of AmericaAP8_Fan Out Reliability Aspects  Presenter
Gyenge, OliverMSG Lithoglas GmbH, GermanyOpto1_Photonic Module Packaging
Gyenizse, LíviaBudapest University of Technology and Economics, Budapest, HungaryEmerging I_From Mounting to Recycling – Highlites from Emerging Technologies
Hanke, MartinCADFEM Germany GmbH, GermanyDTM2_Reduced Order Modeling for Advanced Packaging
Hansen, UlliMSG Lithoglas GmbH, GermanyOpto1_Photonic Module Packaging  Presenter
Happonen, TuomasVTT Technical Research Centre of Finland, Espoo, FinlandFlex1_Reliability Assessment of Flexible Electronics  Presenter
Harb, AdnanLebanese International University, Beirut, LibanonPoster Session 2
Harendt, ChristineInstitut für Mikroelektronik Stuttgart IMS CHIPS, Stuttgart, GermanyPoster Session 2
Harr, KristofferSmart High Tech AB, Goeteborg, SwedenPower1_Electronics Measurement and Simulation  Presenter
Hasan, Md NazmulSilicon Austria Labs (SAL), Villach, AustriaPower2_Power Semiconductor Packaging and Cooling
Hassan, SheikhSchool of Computing and Mathematical Sciences, University of Greenwich, London, United Kingdom.DTM2_Reduced Order Modeling for Advanced Packaging  Presenter
Hasumi, KazuhisaHitachi High-Tech Corporation Ibaraki, Ibraki, JapanAP6_Challenges and Solutions for HI
Häußler, MichaelLaser Electronics LE GmbH, Berlin, GermanyOpto1_Photonic Module Packaging
Hayashi, YutaroToshiba Electronic Devices & Storage Corporation, JapanPower2_Power Semiconductor Packaging and Cooling
He, DongmingQualcomm Technologies, Inc.,San Diego, USAMIP5_Microstructural Properties of Materials for Interconnects
Heidenreich, ManuelUniversity of Applied Sciences Jena, Jena, GermanyAP9_Power Electronics Packaging
Heilmann, JensTU Chemnitz, Chemnitz, GermanyRel3_Progress in Failure Analytical and Material Testing Methods
Helmers, HenningFraunhofer ISE, Freiburg, GermanyAMT1_Innovative Assembly Processes
Hempel, MartinFraunhofer IZM, Berlin, GermanyOpto1_Photonic Module Packaging
RF2_Embedded System-in-Package and Interconnections Technologies
Hepp, MaximilianMercedes-Benz AG, Böblingen, GermanyDTM3_Reliability and Virtual Prototyping
Hernandez Gonzalez, LisetteUniversity of South-Eastern Norway, NorwayMIP3_Low-temperature Materials for Interconnects and Packaging  Presenter
Hichri, HabibAjinomoto Fine-Techno USA Corporation, USARF1_Millimeter-wave and Sub-THz Antenna-in-Package Integration for High Performance Systems
Hirai, YuyaTAZMO CO.,LTD.AP3_Hybrid Bonding II
Hirata, YukiOsaka University, Osaka, JapanMIP4_Mechanical properties of Materials for Interconnects
Hirman, MartinUniversity of West Bohemia, Plzeň, Czech RepublicPoster Session 2  Presenter
Hiro, Akitoimec, BelgiumAMT2_Computer-aided Process Control
Hlina, JiriUniversity of West Bohemia, Faculty of Electrical Engineering, Prague, Czech RepublicPoster Session 3  Presenter
Hofmann, ChristianFraunhofer ENAS, Chemnitz, GermanyMIP1_Advanced Material Architectures for Interconnects
Hofmann, LutzFraunhofer ENAS, Chemnitz, GermanyAMT4_Hybrid Bonding, Direct Bonding, Heterogeneous Integration
Holzmann, DominikSilicon Austria Labs (SAL), Villach, AustriaPower2_Power Semiconductor Packaging and Cooling
Homma, SoichiMemory Packaging Development Department, Kioxia Corporation, JapanMIP4_Mechanical properties of Materials for Interconnects  Presenter
Hoppius, Jan StefanLidrotec GmbH, Bochum, GermanyPoster Session 3
Hou, FengzeInstitute of Microelectronics of the Chinese Academy of Sciences, Beijing, China, People's Republic ofDTM1_Co-design and Modeling for Chiplets
Hsieh, Ming-CheSTATS ChipPAC Pte. Ltd., Singapore, Republic of SingaporeAMT3_Process for Enhancement of Device Robustness  Presenter
Hsu, JackQualcomm Technologies, Inc.,San Diego, USAMIP5_Microstructural Properties of Materials for Interconnects
Hu, XiaodongMSG Lithoglas GmbH, GermanyOpto1_Photonic Module Packaging
Huang, Pu-ShanMediaTek, Inc.AMT3_Process for Enhancement of Device Robustness
Hung, CPASE, United States of AmericaAP7_Fan Out Packages  Presenter
Hung, JoeyNova Ltd., Rehovot, IsraelAP2_Hybrid Bonding I
Hussain, TassawarDepartment of Materials Engineering (MTM), KU Leuven, Leuven, Belgium;
imec, Leuven, Belgium		MIP5_Microstructural Properties of Materials for Interconnects  Presenter
Hutzler, AaronBond Pulse GmbH, GermanyAMT6_Enhanced Process Control  Presenter
Iacovo, Serenaimec, Loewen, BelgiumDTM1_Co-design and Modeling for Chiplets
Imi, HitoshiToshiba Electronic Devices & Storage Corporation, JapanPower2_Power Semiconductor Packaging and Cooling
Inamdar, AdwaitTU Delft, Delft, The NetherlandsPoster Session 2
Inoue, FumihiroYokohama National University, Yokohama, JapanAP3_Hybrid Bonding II
Poster Session 2
Ishii, YutaroLINTEC Corporation, JapanEmerging I_From Mounting to Recycling – Highlites from Emerging Technologies
Iuppa, RobertoUniversity of Trento/ INFN TIFPA, ItalyPoster Session 3
Flex2_Formation of a Conductive Interconnection for Flexible Electronics
Jadery, Ahmad hatemSaint Joseph University of Beirut, Beirut, LibanonPoster Session 2
Jaeschke, JohannesFraunhofer IZM, Berlin, GermanyRel1_Reliability Performance and Electromigration Behavior
JANG, Ki-SeokElectronics and Telecommunications Research Institute (ETRI), Daejeon, Republic of (South Korea)Poster Session 2  Presenter
Järvinen, PetriForciot, FinnlandFlex1_Reliability Assessment of Flexible Electronics
Jaziri, NesrineTU Ilmenau, Illmenau, GermanyPoster Session 2
Poster Session 3
JEDIDI, NADERIMEC, Loewen, BelgiumPoster Session 3  Presenter
Jiao, BinbinThe Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China, People's Republic ofPoster Session 1
Jin, RenxiInstitute of Microelectronics of the Chinese Academy of Sciences, Beijing, China, People's Republic ofDTM1_Co-design and Modeling for Chiplets
Jochem, HélèneThales Alenia Space, Cannes, FranceAMT5_Advanced Materials and Processes  Presenter
Joo, ByeongGweonINTEKPLUS Co., Daejeon, Korea, Republic of (South Korea)AMT2_Computer-aided Process Control
JOO, JihoElectronics and Telecommunications Research Institute (ETRI), Daejeon, Republic of (South Korea)Poster Session 2
Joseph, YvonneTU Bergakademie Freiberg, Institute of Nanoscale and Biobased Materials, Freiberg, GermanyMIP6_New materials for Heterogeneous Integration
JUNG, Ji-EunElectronics and Telecommunications Research Institute (ETRI), Daejeon, Republic of (South Korea)Poster Session 2
Jung, TaeYoungINTEKPLUS Co., Daejeon, Korea, Republic of (South Korea)AMT2_Computer-aided Process Control
Junghähnel, ManuelaFraunhofer IZM - ASSID, Moritzburg GermanyAMT6_Enhanced Process Control
MIP1_Advanced Material Architectures for Interconnects
Poster Session 3
Juul, PoulHytekAMT5_Advanced Materials and Processes
Kahle, RubenFraunhofer IZM, Berlin, GermanyAP7_Fan Out Packages  Presenter
Kaiser, ElisaFraunhofer ISE, Freiburg, Germany;
University of Freiburg, Freiburg, Germany		AMT1_Innovative Assembly Processes
Kallmayer, ChristineFraunhofer IZM, Berlin, GermanyFlex1_Reliability Assessment of Flexible Electronics
Kamata, YujiMITSUBISHI GAS CHEMICAL COMPANY, INC., JapanMIP6_New materials for Heterogeneous Integration
Kandziora, AdrianVolkswagen AG, GermanyRel2_Package- and Board Level Moisture- and Thermal Stress-related Reliability Effects
Kang, DongchulResonac Corporation, JapanAP1_Advanced Substrates
Kang, Shuoimec, Loewen, BelgiumDTM1_Co-design and Modeling for Chiplets
Kanitz, AlexanderLidrotec GmbH, Bochum, GermanyPoster Session 3
Kartmann, SabrinaHahn-Schickard, Freiburg, Germany, Germany;
University of Freiburg, Freiburg, Germany		Flex2_Formation of a Conductive Interconnection for Flexible Electronics
Kasai, HiroakiHitachi High-Tech Corporation Ibaraki, Ibraki, JapanAP6_Challenges and Solutions for HI
Katoh, SadaakiResonac Corporation, JapanAP1_Advanced Substrates
Kawashiro, FumiyoshiToshiba Electronic Devices & Storage Corporation, JapanPower2_Power Semiconductor Packaging and Cooling
Keil, PeterVIA electronic GmbH, Hermsdorf, GermanyAP9_Power Electronics Packaging
Kennes, Koenimec, Belgium;
IMEC, Loewen, Belgium		AMT2_Computer-aided Process Control
Poster Session 3
Keränen, Kimmo AnteroVTT Technical Research Centre of Finland, Espoo, FinlandEmerging II  Presenter
Khan, ZebaHahn-Schickard, Freiburg, Germany, Germany;
University of Freiburg, Freiburg, Germany		Flex2_Formation of a Conductive Interconnection for Flexible Electronics
Kim, SeungYeolINTEKPLUS Co., Daejeon, Korea, Republic of (South Korea)AMT2_Computer-aided Process Control
Kim, WooSoonSTATS ChipPAC Korea Ltd.AMT3_Process for Enhancement of Device Robustness
Kim, YoungCheolSTATS ChipPAC Korea Ltd.AMT3_Process for Enhancement of Device Robustness
Kirihata, TomokaLINTEC Corporation, JapanEmerging I_From Mounting to Recycling – Highlites from Emerging Technologies
Kiss, Zoltan TamasSemilab, Budapest, HungaryPoster Session 1
Klengel, RobertFraunhofer IMWS, Halle, GermanyRel2_Package- and Board Level Moisture- and Thermal Stress-related Reliability Effects
Klengel, SandyFraunhofer IMWS, Halle, GermanyPoster Session 3
Rel2_Package- and Board Level Moisture- and Thermal Stress-related Reliability Effects
Klöcker, HelmutMines Saint-Etienne, Saint-Étienne, FranceRel2_Package- and Board Level Moisture- and Thermal Stress-related Reliability Effects
Knoch, PhilipTUD Dresden University of Technology (IAVT), Dresden, GermanyPoster Session 2
Koba, YuichiTowa Europe GmbH, GermanyPoster Session 1  Presenter
Kobayashi, TakashiMITSUBISHI GAS CHEMICAL COMPANY, INC., JapanMIP6_New materials for Heterogeneous Integration
Kögel, MichaelFraunhofer IMWS, Halle, GermanyRel1_Reliability Performance and Electromigration Behavior
Koiwai, KojiVIA electronic GmbH, Hermsdorf, GermanyAP9_Power Electronics Packaging
Kolas, Kshitij AnilFraunhofer ENAS, Chemnitz, GermanyDTM3_Reliability and Virtual Prototyping  Presenter
Koltay, PeterActome GmbH, Freiburg, GermanyFlex2_Formation of a Conductive Interconnection for Flexible Electronics
Kondo, YusukeYokohama National University, Yokohama, GermanyPoster Session 2  Presenter
Kong, YanmeiThe Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China, People's Republic ofPoster Session 1
Königer, TobiasDELO Industrial Adhesives, Windach, GermanyAP8_Fan Out Reliability Aspects
Koorikkat, AswathiUKRI-Science and Technology Facilities Council, Rutherford Appleton Laboratory, Harwell Campus, Didcot, United KingdomAMT5_Advanced Materials and Processes
Korkalainen, MarkoVTT Technical Research Centre of Finland, Espoo, FinlandEmerging II
Kosmider, StefanFraunhofer IZM, Berlin, GermanyRF2_Embedded System-in-Package and Interconnections Technologies
Kotlar, AurelianEberspaecher Controls RO, Cluj-Napoca, RomaniaPoster Session 2
Kovács, ZsoltSemilab, Budapest, HungaryPoster Session 1
Kraft, BorisMKS Atotech, Berlin, GermanyFlex2_Formation of a Conductive Interconnection for Flexible Electronics
Kreiner, ChristianTechnische Hochschule Ingolstadt, Ingolstadt, GermanyDTM3_Reliability and Virtual Prototyping
Kreul, KilianDELO Industrial Adhesives, Windach, GermanyAP8_Fan Out Reliability Aspects  Presenter
Krieger, UweVIA electronic GmbH, Hermsdorf, GermanyAP9_Power Electronics Packaging
Krüger, PatrickIHP GmbH, Frankfurt Oder, Germany;
IHP - Leibniz Institut für innovative Mikroelektronik, Frankfurt Oder, Germany		Poster Session 2  Presenter
RF1_Millimeter-wave and Sub-THz Antenna-in-Package Integration for High Performance Systems
Kübler, MichaelInstitut für Mikroelektronik Stuttgart IMS CHIPS, Stuttgart, GermanyPoster Session 2  Presenter
Kubota, TadashiTowa Corporation, JapanPoster Session 1
Kuhn, HaraldFraunhofer Institute for Electronic Nano Systems ENAS, Chemnitz, Germany;
TU Chemnitz, Center for Microtechnologies, Chemnitz, Germany		MIP6_New materials for Heterogeneous Integration
Kühn, MartinFraunhofer Institute for Electronic Nano Systems ENAS, Chemnitz, Germany;
TU Bergakademie Freiberg, Institute of Nanoscale and Biobased Materials, Freiberg, Germany		MIP6_New materials for Heterogeneous Integration
Kurita, YoichiroTokyo Institute of Technology, Meguro City, JapanAP3_Hybrid Bonding II
Opto2_Heterogenous PIC Integration
Kurkela, TimoVTT Technical Research Centre of Finland, Espoo, FinlandEmerging II
Kurukuru, Varaha Satya BharathSilicon Austria Labs GmbH, AustriaDTM2_Reduced Order Modeling for Advanced Packaging
Kusters, RoelHolst Centre TNO, Eindhoven, The NetherlandsAP9_Power Electronics Packaging
Kuttler, SimonFraunhofer IZM, Berlin, GermanyRel1_Reliability Performance and Electromigration Behavior  Presenter
Kyatam, ShusmithaInstituto de Telecomunicacoes, PortugalOpto1_Photonic Module Packaging
Laake, KatharinaLidrotec GmbH, Bochum, GermanyPoster Session 3
Lábszki, ZoltanSemilab, Budapest, HungaryPoster Session 1
Ladner, CarineUniv. Grenoble Alpes, CEA, LETI, Grenoble, FranceAMT4_Hybrid Bonding, Direct Bonding, Heterogeneous Integration
Lall, PradeepAuburn University, Auburn, USAMIP4_Mechanical properties of Materials for Interconnects  Presenter
Lambert, BenoitUMS SAS, Villebon Sur Yvette, FranceAP8_Fan Out Reliability Aspects
Lamers, EdwinReden B.V. , The NetherlandsPoster Session 3
Le, Thi HuyenFraunhofer IZM, Berlin, GermanyRF1_Millimeter-wave and Sub-THz Antenna-in-Package Integration for High Performance Systems  Presenter
RF1_Millimeter-wave and Sub-THz Antenna-in-Package Integration for High Performance Systems  Presenter
LEE, Chan-MiElectronics and Telecommunications Research Institute (ETRI), Daejeon, Republic of (South Korea)Poster Session 2
LEE, Ga-EunElectronics and Telecommunications Research Institute (ETRI), Daejeon, Republic of (South Korea)Poster Session 2
Lee, TaeYongINTEKPLUS Co., Daejeon, Korea, Republic of (South Korea)AMT2_Computer-aided Process Control
Leech, Damien Jonimec, BelgiumAMT2_Computer-aided Process Control  Presenter
Lega, AlessandroFondazione Bruno Kessler, Trento, Italy;
University of Trento / INFN TIFPA, Trento, Italy		Flex2_Formation of a Conductive Interconnection for Flexible Electronics
Poster Session 3
Lehtinen, SanteriTampere University, Tampere, FinlandOpto2_Heterogenous PIC Integration
Leib, JuergenFraunhofer IISB, Erlangen, GermanyPower1_Electronics Measurement and Simulation  Presenter
Poster Session 1
Lepukhov, EvgeniiTampere University, Tampere, FinlandOpto2_Heterogenous PIC Integration
Leray, Philippeimec, Loewen, BelgiumAP2_Hybrid Bonding I
Leroy, JonathanUMS SAS, Villebon Sur Yvette, FranceAP8_Fan Out Reliability Aspects
Li, MarkASE, United States of AmericaAP8_Fan Out Reliability Aspects
Lieske, DanielAEMtec, Berlin, GermanyAMT6_Enhanced Process Control  Presenter
Lim, TekfouyFraunhofer IZM, Berlin, GermanyRF2_Embedded System-in-Package and Interconnections Technologies  Presenter
Lin, Kwang-LungNational Cheng Kung University, Tainan, TaiwanMIP5_Microstructural Properties of Materials for Interconnects
Lin, Shih-kangNational Cheng Kung University, Tainan City, TaiwanMIP4_Mechanical properties of Materials for Interconnects
Lin, StanleyMediaTek, Inc.AMT3_Process for Enhancement of Device Robustness
Lin, Yeimec, Leuven, BelgiumAP2_Hybrid Bonding I
Lipp, John D.UKRI-Science and Technology Facilities Council, Rutherford Appleton Laboratory, Harwell Campus, Didcot, United KingdomAMT5_Advanced Materials and Processes
Liu, ETechnische Hochschule, GermanyRel3_Progress in Failure Analytical and Material Testing Methods
Liu, JohanChalmers University of Technology, Goeteborg, SwedenPower1_Electronics Measurement and Simulation
Löher, ThomasFraunhofer IZM, Berlin, GermanyRF2_Embedded System-in-Package and Interconnections Technologies
Loi, RuggeroX-Celeprint Limited, Cork, IrelandOpto2_Heterogenous PIC Integration
Lopper, ChristinaFraunhofer IZM, Berlin, GermanyAP5_Advances in WLP Technologies II
Lorusso, Gianimec, Leuven, BelgiumAP6_Challenges and Solutions for HI
Lu, GuoranThe Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China, People's Republic ofPoster Session 1
Luca, Dan AndreiNational University of Science and Technology POLITEHNICA Bucharest, Bucharest,RomaniaPoster Session 3
Luniak, MarcoTUD Dresden University of Technology (IAVT), Dresden, Germany;
TU Dresden, Dresden, Germany		Poster Session 2
Poster Session 3
Ma, RuiInstitute of Microelectronics of the Chinese Academy of Sciences, Beijing, China, People's Republic ofDTM1_Co-design and Modeling for Chiplets
Maarouf, KhalilValeo Vision, France;
Mines Saint-Etienne, Saint-Étienne, France		Rel2_Package- and Board Level Moisture- and Thermal Stress-related Reliability Effects
Maaß, UweFraunhofer IZM, Berlin, GermanyPoster Session 1
Maehara, MasatakaSony Semiconductor Solutions Corporation, Atsugi, Kanagawa, JapanAP6_Challenges and Solutions for HI  Presenter
Maerz, MartinFriedrich-Alexander-University of Erlangen-Nürnberg, Erlangen, GermanyPower1_Electronics Measurement and Simulation
Maeter, SönkeCadfem GmbH, Munich, GermanyDTM3_Reliability and Virtual Prototyping
Maggi, LucaSTMicroelectronics, ItalyAP6_Challenges and Solutions for HI
Magis, ThomasUniv. Grenoble Alpes, CEA, LETI, Grenoble, FranceAMT4_Hybrid Bonding, Direct Bonding, Heterogeneous Integration
Maierna, AmedeoSTMicroelectronics, ItalyAP6_Challenges and Solutions for HI
Makarovič, KostjaJozef Stefan Institute, Ljubljana, Slovenia;
Keko-Equipment Ltd;
CoE NAMASTE		Poster Session 2  Presenter
Malic, BarbaraJozef Stefan Institute, Ljubljana, Slovenia;
International Postgraduate School, Ljubljana, Slovenia		Poster Session 2
Malik, Muhammad HassanSilicon Austria Labs, AustriaPoster Session 3  Presenter
Manessis, DionysiosFraunhofer IZM, Berlin, GermanyAP7_Fan Out Packages
Maniar, YoussefRobert Bosch GmbH, Renningen, GermanyDTM3_Reliability and Virtual Prototyping
Manier, Charles-AlixFraunhofer IZM, Berlin, GermanyAMT1_Innovative Assembly Processes  Presenter
Mannetje, Hero ‘tHolst Centre TNO, Eindhoven, The NetherlandsAP9_Power Electronics Packaging
Marghescu, CristinaPOLITEHNICA București National University for Science and Technology, Bukarest, RomaniaPoster Session 3
Marschmeyer, SteffenIHP – Leibniz-Institut für innovative Mikroelektronik, Frankfurt (Oder), GermanyAMT4_Hybrid Bonding, Direct Bonding, Heterogeneous Integration
Matei, ConstantinUniversity Grenoble Alpes CEA, LETI, Grenoble, FranceAP2_Hybrid Bonding I
Mathieu, RomainUMS SAS, Villebon Sur Yvette, FranceAP8_Fan Out Reliability Aspects
Matsubara, IsamuCYBERNET SYSTEMS CO., LTD.Poster Session 2
Matsunaga, AmaneMITSUBISHI GAS CHEMICAL COMPANY, INC., JapanMIP6_New materials for Heterogeneous Integration
Mauri, LucaSAES Getters, Lainate, ItalyPoster Session 3
Maus, SimonMSG Lithoglas GmbH, GermanyOpto1_Photonic Module Packaging
Mausolf, ThomasIHP - Leibniz Institut für innovative Mikroelektronik, Frankfurt Oder, GermanyRF1_Millimeter-wave and Sub-THz Antenna-in-Package Integration for High Performance Systems
May, DanielTU Chemnitz, Chemnitz, GermanyRel3_Progress in Failure Analytical and Material Testing Methods
May, DanielBerliner Nanotest und Design GmbH, Berlin, GermanyPoster Session 1
Mayr, MoniquePanasonicAMT5_Advanced Materials and Processes
McCluskey, Francis PatrickUniversity of Maryland, College Park, USAPoster Session 2  Presenter
Mehrabi, AlirezaDelft University of Technology, Delft, The NetherlandsPoster Session 2
Rel4_New Approaches in Reliability Simulation and Modelling  Presenter
Mehrafsun, SalarWagenbrett GmbH & Co. KG, Bremen, GermanyAMT1_Innovative Assembly Processes
Mehta, VishalAuburn University, Auburn, USAMIP4_Mechanical properties of Materials for Interconnects
Meier, KarstenTUD Dresden University of Technology (IAVT), Dresden, Germany;
TU Dresden, Dresden, Germany		Poster Session 2
RF2_Embedded System-in-Package and Interconnections Technologies
Meierfrankenfeld, AnnaFraunhofer IZM, Berlin, GermanyAP7_Fan Out Packages
Mendes, Joana CatarinaInstituto de Telecomunicacoes, PortugalOpto1_Photonic Module Packaging  Presenter
Meng, XinhaoThe Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China, People's Republic ofPoster Session 1
Menjo, ToshiakiLINTEC Corporation, JapanAMT1_Innovative Assembly Processes
Mertens, HubertusMKS Atotech, Berlin, GermanyFlex2_Formation of a Conductive Interconnection for Flexible Electronics
Metes, AnaTechnical University of Cluj-Napoca, Cluj-Napoca, RomaniaPoster Session 2  Presenter
Meyer, JörgTUD Dresden University of Technology (IAVT), Dresden, GermanyPoster Session 2
Miao, WeiyangInstitute of Microelectronics (IME), Singapore, Republic of Singapore;
School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore, Republic of Singapore		DTM1_Co-design and Modeling for Chiplets  Presenter
Mihailescu, Bogdan TraianPOLITEHNICA București National University for Science and Technology, Bukarest, Romania;
CETTI UNSTPB		Poster Session 3
AP9_Power Electronics Packaging
Miller, Andyimec, Loewen, BelgiumAP2_Hybrid Bonding I
AP4_Advances in WLP Technologies I
AP6_Challenges and Solutions for HI
AP6_Challenges and Solutions for HI
Minami, MasashiResonac Corporation, JapanAP1_Advanced Substrates
Misawa, TaichiSumitomo Electric Industries, Ltd., Yokohama, JapanOpto2_Heterogenous PIC Integration  Presenter
Mise, NobuyukiHitachi High-Tech Corporation Tokyo, Tokyo, JapanAP6_Challenges and Solutions for HI
Mittag, MarcelFraunhofer IMWS, Halle, GermanyPoster Session 3
Rel2_Package- and Board Level Moisture- and Thermal Stress-related Reliability Effects
Mitulescu, Corina RuxandraCETTI UNSTPBAP9_Power Electronics Packaging  Presenter
Miyawaki, ManabuLINTEC Corporation, JapanEmerging I_From Mounting to Recycling – Highlites from Emerging Technologies
Mohan, NiheshTechnische Hochschule Ingolstadt, Ingolstadt, GermanyMIP3_Low-temperature Materials for Interconnects and Packaging
Mohd, ZubairTechnische Hochschule, GermanyRel3_Progress in Failure Analytical and Material Testing Methods
Moisa, CosminContinental Automotive, RomaniaPoster Session 1
Moise, Madalin VasileNational University of Science and Technology POLITEHNICA Bucharest, Bucharest,Romania;
POLITEHNICA București National University for Science and Technology, Bukarest, Romania		Poster Session 3
Poster Session 3
Möller, JohanSmart High Tech AB, Goeteborg, SwedenPower1_Electronics Measurement and Simulation
Montméat, PierreUniv. Grenoble Alpes, CEA, LETI, Grenoble, FranceAMT4_Hybrid Bonding, Direct Bonding, Heterogeneous Integration
Morales, ChristopheUniversity Grenoble Alpes CEA, LETI, Grenoble, FranceAP2_Hybrid Bonding I
Mori, KentaroToshiba Electronic Devices & Storage Corporation, JapanPower2_Power Semiconductor Packaging and Cooling  Presenter
Moura, ThiagoBESI, Radfeld, AustriaAP2_Hybrid Bonding I
Moussa, Alainimec, Loewen, BelgiumAP2_Hybrid Bonding I
AP6_Challenges and Solutions for HI
Mudigere Krishne Gowda, Punith Kumarimec, BelgiumMIP5_Microstructural Properties of Materials for Interconnects
Mueller, MaikTU Dresden, Dresden, GermanyPoster Session 3  Presenter
Mueller, XaverBecker & Müller Schaltungsdruck GmbH, Steinach, GermanyRF2_Embedded System-in-Package and Interconnections Technologies
Muhammad, Qaisar KhushiVIA electronic GmbH, Hermsdorf, GermanyAP9_Power Electronics Packaging  Presenter
Müller, FriedrichTU Berlin, Microperipheric Center, Berlin, Germany;
TU Berlin, Berlin, Germany		AP7_Fan Out Packages
Poster Session 3
Müller, JensTU Ilmenau, Illmenau, GermanyPoster Session 2
Poster Session 3
Müller, MaikTU Dresden, Dresden GermanyPoster Session 2
Munding, AndreasHuawei Technologies Duesseldorf GmbH, Nuremberg Research Center, Nuremberg, GermanyPoster Session 2
Murugesan, Kavin SenthilFraunhofer IZM, Berlin, GermanyPoster Session 2
RF1_Millimeter-wave and Sub-THz Antenna-in-Package Integration for High Performance Systems
Murugesan, Kavin SenthilTU Berlin, Berlin, GermanyRF2_Embedded System-in-Package and Interconnections Technologies
Musadiq, MuhammadTU Delft, Delft, The NetherlandsPoster Session 2  Presenter
Myndyk, MaksymFraunhofer IZM-ASSID, Moritzburg, GermanyPoster Session 3
Nadudvari, GyorgySemilab, Budapest, Hungary;
Semilab Semiconductor Physics Laboratory Co. Ltd., Budapest, Hungary		Poster Session 1  Presenter
Poster Session 3
Naghibi, PartiaHRL Laboratories, United States of AmericaAMT5_Advanced Materials and Processes  Presenter
Nakahara, KenRohm Co., Ltd, JapanRel4_New Approaches in Reliability Simulation and Modelling
Nakamura, YuzoYokohama National University, Yokohama, GermanyPoster Session 2
Nakano, RekiAjinomoto Corporation Inc., JapanRF1_Millimeter-wave and Sub-THz Antenna-in-Package Integration for High Performance Systems
Napetschnig, EvelynInfineon technologies Austria AG, Graz, AustriaEmerging II  Presenter
Nashkolnyy, NazariySTMicroelectronics, ItalyAP6_Challenges and Solutions for HI
Naumann, FalkFraunhofer IMWS, Halle, GermanyPoster Session 3
Rel2_Package- and Board Level Moisture- and Thermal Stress-related Reliability Effects  Presenter
Navratil, JiriUniversity of West Bohemia, Plzeň, Czech RepublicPoster Session 2
Ndip, IvanFraunhofer IZM, Berlin, Germany;
Brandenburg University of Technology (BTU) Cottbus-Senftenberg, Cottbus, Germany		Poster Session 1
Poster Session 2
RF1_Millimeter-wave and Sub-THz Antenna-in-Package Integration for High Performance Systems
RF1_Millimeter-wave and Sub-THz Antenna-in-Package Integration for High Performance Systems
Negroiu, Rodica CristinaPOLITEHNICA București National University for Science and Technology, Bukarest, RomaniaPoster Session 3
Nelle, SandraMKS Atotech, Berlin, GermanyFlex2_Formation of a Conductive Interconnection for Flexible Electronics  Presenter
Neumaier, LukasSilicon Austria Labs, AustriaPoster Session 3
Nguyen, Hoang-VuUniversity of South-Eastern Norway, Notodden, NorwayEmerging I_From Mounting to Recycling – Highlites from Emerging Technologies  Presenter
MIP3_Low-temperature Materials for Interconnects and Packaging
MIP3_Low-temperature Materials for Interconnects and Packaging
Nguyen, TaiSilicon Austria Labs GmbH, AustriaPoster Session 1
Nijenmanting, NielsReden B.V. , The NetherlandsPoster Session 3
Nishikawa, HiroshiJoining and Welding Research Institute, Osaka University, Osaka, JapanMIP4_Mechanical properties of Materials for Interconnects
MIP4_Mechanical properties of Materials for Interconnects  Presenter
Nishiwaki, TatsuyaToshiba Electronic Devices & Storage Corporation, JapanPower2_Power Semiconductor Packaging and Cooling
Noack, RichardLPKF Laser & Electronics SE, Garbsen, GermanyAP1_Advanced Substrates  Presenter
Novel, DavidFondazione Bruno Kessler, Trento, ItalyFlex2_Formation of a Conductive Interconnection for Flexible Electronics  Presenter
Poster Session 3
Nowotnik, Luca Finn TomTU Dresden, Dresden GermanyPoster Session 2
Oasa, KoheiToshiba Electronic Devices & Storage Corporation, JapanPower2_Power Semiconductor Packaging and Cooling
Ogashiwa, TakaakiMITSUBISHI GAS CHEMICAL COMPANY, INC., JapanMIP6_New materials for Heterogeneous Integration
Oggioni, Stefano SergioAT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AustriaAP7_Fan Out Packages
OH, Jin-HyukElectronics and Telecommunications Research Institute (ETRI), Daejeon, Republic of (South Korea)Poster Session 2
Ohguro, TatsuyaToshiba Electronic Devices & Storage Corporation, JapanPower2_Power Semiconductor Packaging and Cooling
Oishi, RyoheiAjinomoto Corporation Inc., JapanRF1_Millimeter-wave and Sub-THz Antenna-in-Package Integration for High Performance Systems
Ojanen, Samu-PekkaTampere University, Tampere, FinlandOpto2_Heterogenous PIC Integration
Okada, DaichiMemory Packaging Engineering Department, Kioxia Corporation, JapanMIP4_Mechanical properties of Materials for Interconnects
Okaniwa, MasashiMITSUBISHI GAS CHEMICAL COMPANY, INC., JapanMIP6_New materials for Heterogeneous Integration  Presenter
Okudur, Oguzhan Orkutimec, Loewen, BelgiumDTM1_Co-design and Modeling for Chiplets  Presenter
Ollila, JyrkiVTT Technical Research Centre of Finland, Espoo, FinlandEmerging II
Oppermann, HermannFraunhofer IZM, Berlin, GermanyAMT1_Innovative Assembly Processes
Rel1_Reliability Performance and Electromigration Behavior
Oppermann, MartinTU Dresden, Dresden, GermanyPower1_Electronics Measurement and Simulation  Presenter
Osaki, MayukaHitachi, Ltd. Kanagawa, Kanagawa, JapanAP6_Challenges and Solutions for HI
Oshida, HirokiTowa Corporation, JapanPoster Session 1
Ossieur, PeterIDLab, INTEC, Ghent University - imec, Ghent, BelgiumOpto2_Heterogenous PIC Integration
Ostholt, RomanLPKF Laser & Electronics SE, Garbsen, GermanyAP1_Advanced Substrates
Ostmann, AndreasFraunhofer IZM, Berlin, GermanyRF2_Embedded System-in-Package and Interconnections Technologies
Otsuka, KanjiMeisei University, Hino, JapanMIP2_Advanced Interconnection Metallurgical Materials and Interconnects
Otsuka, TakukazuRohm Co., Ltd, JapanRel4_New Approaches in Reliability Simulation and Modelling
Otto, AlexanderFraunhofer ENAS, Chemnitz, GermanyDTM3_Reliability and Virtual Prototyping
Paakkolanvaara, MikkoScreentec, Oulu, FinnlandFlex1_Reliability Assessment of Flexible Electronics
Pai, Ajay PoonjalSanan Semiconductor, Munich, GermanyDTM4_Device Level Modeling
Pak, MuratIMEC, BelgiumAP4_Advances in WLP Technologies I
Panchenko, JulianaFraunhofer IZM-ASSID, Moritzburg, Germany;
TU Dresden, Dresden, Germany		MIP1_Advanced Material Architectures for Interconnects
Poster Session 3
Poster Session 2
Poster Session 3
Pantou, RemiFraunhofer ENAS, Chemnitz, GermanyRel3_Progress in Failure Analytical and Material Testing Methods
Pappas, DaphnePlasmatreat, Steinhagen, GermanyPoster Session 1
Passlack, UlrikeInstitut für Mikroelektronik Stuttgart IMS CHIPS, Stuttgart, GermanyPoster Session 2
Patarau, TomaTechnical University of Cluj-Napoca, Cluj-Napoca, RomaniaPoster Session 2
Paulasto-Kröckel, MerviAalto University, Espoo, FinlandRel1_Reliability Performance and Electromigration Behavior
Pereira, GabrielaYole Group, Villeurbanne, FranceAP5_Advances in WLP Technologies II  Presenter
Perlwitz, PaulTU Berlin, Microperipheric Center, Berlin, GermanyAP7_Fan Out Packages
Perraud, JulienThales Research and Technology, Palaiseau, FranceAP8_Fan Out Reliability Aspects
Petersen, LukasTU Dresden, Dresden GermanyPoster Session 2
Petrella, RobertoSilicon Austria Labs GmbH, AustriaDTM2_Reduced Order Modeling for Advanced Packaging
Petschnigg, MadeleineSilicon Austria Labs GmbH, AustriaPoster Session 1
Phommahaxay, Alainimec, Belgium;
IMEC, Loewen, Belgium		AMT2_Computer-aided Process Control
Poster Session 3
AP2_Hybrid Bonding I
Pietruske, HeikoHelmholtz-Zentrum Dresden-Rossendorf, Dresden, GermanyPoster Session 3
Pinho, NelsonIMEC, BelgiumAP4_Advances in WLP Technologies I
Pires, MarianaEV Group, Florian am Inn, AustriaOpto2_Heterogenous PIC Integration
Platz, HannoGED Gesellschaft für Elektronik und Design mbH, Ruppichteroth, GermanyRF2_Embedded System-in-Package and Interconnections Technologies
Poelma, RenéDelft University of Technology, Delft, The NetherlandsPoster Session 2
Poelma, Rene H.Delft University of Technology, Delft, The NetherlandsRel4_New Approaches in Reliability Simulation and Modelling
Poppa, SilviaSemilab, Germany;
Semilab Semiconductor Physics Laboratory Co. Ltd., Budapest, Hungary		Poster Session 1
Poster Session 3
Pradhan, AbinashSilicon Austria Labs GmbH, AustriaDTM2_Reduced Order Modeling for Advanced Packaging  Presenter
Prince, Kawsar AhmedBESI, Radfeld, AustriaAP2_Hybrid Bonding I
Quednau, SebastianNanoWired GmbH, Gernsheim, GermanyRF2_Embedded System-in-Package and Interconnections Technologies
Rachid, EliasSaint Joseph University of Beirut, Beirut, LibanonPoster Session 2  Presenter
Rajaguru, PushparajahSchool of Computing and Mathematical Sciences, University of Greenwich, London, United Kingdom.DTM2_Reduced Order Modeling for Advanced Packaging
Ramaswamy, PrasannaX-Celeprint Limited, Cork, IrelandOpto2_Heterogenous PIC Integration
Rämer, OlafTU Berlin, Berlin, GermanyMIP3_Low-temperature Materials for Interconnects and Packaging
Poster Session 1  Presenter
Ratti, AndreaSTMicroelectronics, ItalyAP6_Challenges and Solutions for HI  Presenter
Reboun, JanUniversity of West Bohemia, Faculty of Electrical Engineering, Prague, Czech RepublicPoster Session 3
Reck, TamaraFraunhofer IISB, Erlangen, GermanyPoster Session 1
Redouté, Jean-MichelUniversity Liege, Liege, BelgiumAMT3_Process for Enhancement of Device Robustness
Reichel, AlexanderFraunhofer IMWS, Halle, GermanyPoster Session 3
Renaud, PabloUniversity Grenoble Alpes CEA, LETI, Grenoble, FranceAP2_Hybrid Bonding I
Rettenmeier, RolandEvatec AG, Trübbach, SwitzerlandAP1_Advanced Substrates
AP4_Advances in WLP Technologies I
Richter, UweSENTECH Instruments GmbH, Berlin, GermanyPoster Session 1  Presenter
Riedl, Jesse C.UMS SAS, Villebon Sur Yvette, FranceAP8_Fan Out Reliability Aspects  Presenter
Rigler, DánielBudapest University of Technology and Economics, Budapest, HungaryEmerging I_From Mounting to Recycling – Highlites from Emerging Technologies
Rimboeck, JohannaEV Group, Florian am Inn, AustriaOpto2_Heterogenous PIC Integration
Ringelstetter, SeverinDELO Industrial Adhesives, Windach, GermanyAP8_Fan Out Reliability Aspects
Poster Session 1
Ritton, FrédéricUniv. Grenoble Alpes, CEA, LETI, Grenoble, FranceMIP1_Advanced Material Architectures for Interconnects
Rizzi, EneaSAES Getters, Lainate, ItalyPoster Session 3
Rocci, MirkoThales Alenia Space, ItalyAMT5_Advanced Materials and Processes
Rodrigues, Augusto DanielSilicon Austria Labs (SAL), Villach, Austria;
Silicon Austria Labs GmbH, Austria;
Carinthia University of Applied Sciences, Villach, Austria		Power2_Power Semiconductor Packaging and Cooling
Poster Session 1  Presenter
Rodrigues, LuisInstituto de Telecomunicacoes, PortugalOpto1_Photonic Module Packaging
Romano, ClaudioIdeas & Motion s.r.l., Cherasco, ItalyDTM2_Reduced Order Modeling for Advanced Packaging
Roscher, FrankFraunhofer ENAS, Chemnitz, Germany;
Fraunhofer Institute for Electronic Nano Systems ENAS, Chemnitz, Germany		AP4_Advances in WLP Technologies I
MIP6_New materials for Heterogeneous Integration
Roshanghias, AliSilicon Austria Labs GmbH, Heterogeneous Integration Technologies, Villach, Austria;
Silicon Austria Labs GmbH, Austria;
Silicon Austria Labs (SAL), Villach, Austria		AP3_Hybrid Bonding II
Poster Session 1
Poster Session 3
Power2_Power Semiconductor Packaging and Cooling
Rosin, MarioMKS Atotech, Berlin, GermanyFlex2_Formation of a Conductive Interconnection for Flexible Electronics
Ross, GlennAalto University, Espoo, FinlandRel1_Reliability Performance and Electromigration Behavior
Rotaru, Mihai DragosInstitute of Microelectronics (IME), Singapore, Republic of SingaporeDTM1_Co-design and Modeling for Chiplets
Roucou, RomualdNXP Semiconductors N.V. (NXP)Poster Session 2
Roucoules, ChristineValeo Vision, FranceRel2_Package- and Board Level Moisture- and Thermal Stress-related Reliability Effects  Presenter
Rovitto, MarcoSTMicroelectronics, ItalyPoster Session 1  Presenter
Rubingh, EricHolst Centre TNO, Eindhoven, The NetherlandsAP9_Power Electronics Packaging
Rudolph, MarcoFraunhofer IMWS, Halle, GermanyPoster Session 3
Rzepka, SvenFraunhofer ENAS, Chemnitz, GermanyDTM2_Reduced Order Modeling for Advanced Packaging
DTM3_Reliability and Virtual Prototyping
Saakyan, SergeyTU Dresden, Dresden, GermanyPoster Session 3
Sáfár, BalázsBudapest University of Technology and Economics, Budapest, HungaryEmerging I_From Mounting to Recycling – Highlites from Emerging Technologies
Safari, YousefECE Department, McGill University, Montreal, CanadaEmerging II  Presenter
Saha, MrinmoyAuburn University, Auburn, USAMIP4_Mechanical properties of Materials for Interconnects
Saib, Mohamedimec, Loewen, BelgiumAP2_Hybrid Bonding I
AP6_Challenges and Solutions for HI
Salahouelhadj, Abdellahimec, BelgiumMIP5_Microstructural Properties of Materials for Interconnects  Presenter
Sanchez, LoicUniv. Grenoble Alpes, CEA, LETI, Grenoble, FranceAMT4_Hybrid Bonding, Direct Bonding, Heterogeneous Integration
Sano, IchiroTAZMO CO.,LTD.AP3_Hybrid Bonding II
Sano, MarieYokohama National University, Yokohama, JapanAP3_Hybrid Bonding II
Poster Session 2
Sao-Joao, SergioMines Saint-Etienne, Saint-Étienne, FranceRel2_Package- and Board Level Moisture- and Thermal Stress-related Reliability Effects
Sauvageot, Jean-LucUniversité Paris-Saclay, CEA, IRFU, Gif-sur-Yvette, FranceMIP1_Advanced Material Architectures for Interconnects
Sawanobori, AkihitoMemory Packaging Development Department, Kioxia Corporation, JapanMIP4_Mechanical properties of Materials for Interconnects
Scalmati, PaoloSomacisAMT5_Advanced Materials and Processes
Schabbel, DirkFraunhofer IKTS, Hermsdorf, GermanyAP9_Power Electronics Packaging
Schacht, RalphBTU Cottbus, Cottbus, GermanyRel3_Progress in Failure Analytical and Material Testing Methods
Schafsteller, BrittaMKS Atotech, Berlin, GermanyFlex2_Formation of a Conductive Interconnection for Flexible Electronics
Schiffer, MichaelFraunhofer IZM, Berlin, GermanyMIP6_New materials for Heterogeneous Integration
Schindler, MarkusDELO Industrial Adhesives, Windach, GermanyAP8_Fan Out Reliability Aspects
Schirmer, PatrickDELO Industrial Adhesives, Windach, GermanyPoster Session 1  Presenter
Schleicher, EckhardHelmholtz-Zentrum Dresden-Rossendorf, Dresden, GermanyPoster Session 3
Schletz, AndreasSCHLETZ GmbH, Amberg, GermanyPower1_Electronics Measurement and Simulation
Schmid, MaximilianTechnische Hochschule Ingolstadt, Ingolstadt, GermanyDTM3_Reliability and Virtual Prototyping
Schmid, StefanBESI, Radfeld, AustriaAP2_Hybrid Bonding I
Schneider, AndreasUKRI-Science and Technology Facilities Council, Rutherford Appleton Laboratory, Harwell Campus, Didcot, United KingdomAMT5_Advanced Materials and Processes  Presenter
Schneider, JensFraunhofer IZM, Berlin, GermanyPoster Session 2
Schneider-Ramelow, MartinTU Berlin, Berlin, Germany;
Fraunhofer IZM, Berlin, Germany;
Technical University Berlin (TUB), Berlin, Germany		Flex1_Reliability Assessment of Flexible Electronics
Opto1_Photonic Module Packaging
Poster Session 2
Rel1_Reliability Performance and Electromigration Behavior
RF1_Millimeter-wave and Sub-THz Antenna-in-Package Integration for High Performance Systems
RF1_Millimeter-wave and Sub-THz Antenna-in-Package Integration for High Performance Systems
AMT1_Innovative Assembly Processes
Schneider-Ramelow, MartinTU Berlin, Microperipheric Center, Berlin, Germany;
TU Berlin, Berlin, Germany		AP7_Fan Out Packages
MIP6_New materials for Heterogeneous Integration
Poster Session 3
Rel1_Reliability Performance and Electromigration Behavior
Rel3_Progress in Failure Analytical and Material Testing Methods
Schoofs, Geertimec, BelgiumAMT2_Computer-aided Process Control
Schröder, HenningFraunhofer IZM, GermanyAMT3_Process for Enhancement of Device Robustness
Schulze, SebastianIHP GmbH, Frankfurt Oder, GermanyPoster Session 2
Schutt-Aine, Jose E.University of Illinois at Urbana Champaign, Urbana, USADTM4_Device Level Modeling  Presenter
Schütze, DavidFraunhofer IZM, Berlin, GermanyRF2_Embedded System-in-Package and Interconnections Technologies
Schwaemmlein, MichaelMKS Atotech, Berlin, GermanyFlex2_Formation of a Conductive Interconnection for Flexible Electronics
Schwietering, JulianFraunhofer IZM, GermanyAMT3_Process for Enhancement of Device Robustness
Selbmann, FranzFraunhofer Institute for Electronic Nano Systems ENAS, Chemnitz, Germany;
TU Bergakademie Freiberg, Institute of Nanoscale and Biobased Materials, Freiberg, Germany		MIP6_New materials for Heterogeneous Integration  Presenter
Seroglazov, PavelBESI, Radfeld, AustriaAP2_Hybrid Bonding I
Shehzad, AdilFraunhofer IZM-ASSID, Moritzburg, GermanyPoster Session 3  Presenter
Shi, ShangyangSchool of Integrated Circuits, Peking University, Beijing, China, People's Republic ofDTM1_Co-design and Modeling for Chiplets
Shi, YunfanTsinghua University, Tsinghua, China, People's Republic ofPoster Session 1
SHIN, JunghoElectronics and Telecommunications Research Institute (ETRI), Daejeon, Republic of (South Korea)Poster Session 2
Shu, ZheHahn-Schickard, Freiburg, Germany, Germany;
University of Freiburg, Freiburg, Germany		Flex2_Formation of a Conductive Interconnection for Flexible Electronics
Simonovsky, MarekElceram a.s., Hradec Kralove, Czech RepublicPoster Session 3
Singh, SarabjotUniversity at Albany, State University of New York, New York, USAMIP2_Advanced Interconnection Metallurgical Materials and Interconnects  Presenter
Slabbekoorn, JohnIMEC, BelgiumAP4_Advances in WLP Technologies I
MIP5_Microstructural Properties of Materials for Interconnects
Smits, EdsgerChip Integration Technology Center, Nijmegen, The Netherlands;
Holst Centre TNO, Eindhoven, The Netherlands		AP9_Power Electronics Packaging
Sollecchia, LucasThales Alenia Space, ItalyAMT5_Advanced Materials and Processes
Song, ChangmingSchool of Integrated Circuits, Tsinghua University, Beijing, China, Peoples Republic ofDTM4_Device Level Modeling
Steinberger, FabianTechnische Hochschule Ingolstadt, Ingolstadt, GermanyMIP3_Low-temperature Materials for Interconnects and Packaging  Presenter
Rel3_Progress in Failure Analytical and Material Testing Methods
Steiner, FrantisekUniversity of West Bohemia, Plzeň, Czech RepublicPoster Session 2
Stepan, LukasElceram a.s., Hradec Kralove, Czech RepublicPoster Session 3
Stephan, TinoFraunhofer IMWS, Halle, GermanyRel2_Package- and Board Level Moisture- and Thermal Stress-related Reliability Effects
Stieglauer, HermannUMS GmbH, Ulm, GermanyAP8_Fan Out Reliability Aspects
Stoll, FieteFraunhofer ENAS, Chemnitz, GermanyAP4_Advances in WLP Technologies I  Presenter
Stoukatch, SergueiUniversity Liege, Liege, BelgiumAMT3_Process for Enhancement of Device Robustness  Presenter
Stover, ColleenEastern Michigan University, Ypsilanti, United States of AmericaFlex1_Reliability Assessment of Flexible Electronics
Stoyanov, StoyanSchool of Computing and Mathematical Sciences, University of Greenwich, London, United Kingdom.DTM2_Reduced Order Modeling for Advanced Packaging
Straubinger, DanielHahn-Schickard, Freiburg, Germany, GermanyFlex2_Formation of a Conductive Interconnection for Flexible Electronics  Presenter
Strolz, EwaldEvatec AG, Trübbach, SwitzerlandAP1_Advanced Substrates
AP4_Advances in WLP Technologies I
Su, YiCheSanan Semiconductor, Changsha, ChinaDTM4_Device Level Modeling
Suga, TadatomoMeisei University, Hino, JapanMIP2_Advanced Interconnection Metallurgical Materials and Interconnects  Presenter
Suto, AttilaSemilab Semiconductor Physics Laboratory Co. Ltd., Budapest, HungaryPoster Session 3  Presenter
Suzuki, KeitaTohoku University, Tohoku, JapanPower2_Power Semiconductor Packaging and Cooling
Svasta, PaulCETTI UNSTPB;
POLITEHNICA București National University for Science and Technology, Bukarest, Romania		AP9_Power Electronics Packaging
Poster Session 3
Szaz, DenesSemilab, Budapest, HungaryPoster Session 1
Takahashi, YoshikazuTohoku University, Tohoku, JapanPower2_Power Semiconductor Packaging and Cooling  Presenter
Takano, KenLINTEC Corporation, JapanAMT1_Innovative Assembly Processes
Takyu, ShinyaLINTEC Corporation, JapanAMT1_Innovative Assembly Processes
AP3_Hybrid Bonding II
Tan, Chuan SengInstitute of Microelectronics (IME), Singapore, Republic of Singapore;
School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore, Republic of Singapore		DTM1_Co-design and Modeling for Chiplets
Tan, LinSchool of Integrated Circuits, Tsinghua University, Beijing, China, Peoples Republic ofDTM4_Device Level Modeling
Tanaka, KeijiSumitomo Electric Industries, Ltd., Yokohama, JapanOpto2_Heterogenous PIC Integration
Tanaka, MakiHitachi High-Tech Corporation Ibaraki, Ibraki, JapanAP6_Challenges and Solutions for HI
Tanskanen, AnttiVTT Technical Research Centre of Finland, Espoo, FinlandEmerging II
Tetzlaff, UlrichTechnische Hochschule Ingolstadt, Ingolstadt, GermanyDTM3_Reliability and Virtual Prototyping
THAMPI, GAYATHRYUniversity of South-Eastern Norway, NorwayMIP3_Low-temperature Materials for Interconnects and Packaging  Presenter
Thiolon, AdèleUniv. Grenoble Alpes, CEA, LETI, Grenoble, FranceAMT4_Hybrid Bonding, Direct Bonding, Heterogeneous Integration  Presenter
Thoben, MarkusUniversity of Applied Science and Arts, Dortmund Soest, GermanyRel2_Package- and Board Level Moisture- and Thermal Stress-related Reliability Effects
Thomas, CandiceUniv. Grenoble Alpes, CEA, LETI, Grenoble, FranceMIP1_Advanced Material Architectures for Interconnects
Tiedje, TobiasTUD Dresden University of Technology (IAVT), Dresden, GermanyPoster Session 2  Presenter
Tinas, EnginTowa Europe GmbH, GermanyPoster Session 1
Tiwary, NikhilenduAalto University, Espoo, FinlandRel1_Reliability Performance and Electromigration Behavior  Presenter
Togasaki, KeiResonac Corporation, JapanAP1_Advanced Substrates  Presenter
Tolunay Wipf, SelinIHP – Leibniz-Institut für innovative Mikroelektronik, Frankfurt (Oder), GermanyAMT4_Hybrid Bonding, Direct Bonding, Heterogeneous Integration  Presenter
Töpfer, JörgUniversity of Applied Sciences Jena, Jena, GermanyAP9_Power Electronics Packaging
Tschoban, ChristianFraunhofer IZM, Berlin, GermanyAP7_Fan Out Packages
Poster Session 3
Tsigaras, IoannisEvatec AG, Trübbach, SwitzerlandAP1_Advanced Substrates  Presenter
Tuerkelly, JaseminMKS Atotech, Berlin, GermanyFlex2_Formation of a Conductive Interconnection for Flexible Electronics
Tunca Altintas, Bensuimec, Belgium;
imec, Leuven, Belgium		AMT2_Computer-aided Process Control
AP6_Challenges and Solutions for HI
Tuninetti, CarloIMTAMT5_Advanced Materials and Processes
Turoves, IgorNova Ltd., Rehovot, IsraelAP2_Hybrid Bonding I
Uemura, HiroshiSumitomo Electric Industries, Ltd., Yokohama, JapanOpto2_Heterogenous PIC Integration
Uesaka, KatsumiSumitomo Electric Industries, Ltd., Yokohama, JapanOpto2_Heterogenous PIC Integration
Ueshima, MinoruDaicel corporation, JapanPoster Session 3  Presenter
Uren, GregoryUMS SAS, Villebon Sur Yvette, FranceAP8_Fan Out Reliability Aspects
Uzun, AliPhotonics Research Group, INTEC, Ghent University - imec, Ghent, BelgiumOpto2_Heterogenous PIC Integration
Vaisband, BorisECE Department, McGill University, Montreal, CanadaEmerging II
van den Brand, JeroenHolst Centre TNO, Eindhoven, The NetherlandsAP9_Power Electronics Packaging
Van der Plas, GeertIMEC, Leuven, BelgiumAP6_Challenges and Solutions for HI
van Driel, Willem D.Delft University of Technology, Delft, The NetherlandsRel4_New Approaches in Reliability Simulation and Modelling
vanDriel, WillemDelft University of Technology, Delft, The NetherlandsPoster Session 2
Vanstreels, Krisimec, BelgiumMIP5_Microstructural Properties of Materials for Interconnects
Varga, KsenijaEV Group, Florian am Inn, AustriaOpto2_Heterogenous PIC Integration  Presenter
Vélard, RémiUniv. Grenoble Alpes, CEA, LETI, Grenoble, FranceMIP1_Advanced Material Architectures for Interconnects
Venet, NorbertThales Alenia Space, Cannes, FranceAMT5_Advanced Materials and Processes
Verduci, TindaraHolst Centre TNO, Eindhoven, The NetherlandsAP9_Power Electronics Packaging
Viehweger, KayFraunhofer IZM-ASSID, Moritzburg, GermanyAP4_Advances in WLP Technologies I
Viheriälä, JukkaTampere University, Tampere, FinlandOpto2_Heterogenous PIC Integration
Virtanen, HeikkiTampere University, Tampere, FinlandOpto2_Heterogenous PIC Integration
Vlasov, AleksandrTampere University, Tampere, FinlandOpto2_Heterogenous PIC Integration  Presenter
Vogel, KlausFraunhofer ENAS, Chemnitz, GermanyMIP1_Advanced Material Architectures for Interconnects
Voigt, ChristianTU Berlin, Berlin, GermanyAP1_Advanced Substrates
Voitel, MarcusTU Berlin, Berlin, GermanyAMT1_Innovative Assembly Processes  Presenter
von Krshiwoblozki, MalteFraunhofer IZM, Berlin, GermanyFlex1_Reliability Assessment of Flexible Electronics
Voß, ThomasIHP GmbH, Frankfurt Oder, Germany;
IHP - Leibniz Institut für innovative Mikroelektronik, Frankfurt Oder, Germany		Poster Session 2
RF1_Millimeter-wave and Sub-THz Antenna-in-Package Integration for High Performance Systems
Vuorinen, VesaAalto University, Espoo, FinlandRel1_Reliability Performance and Electromigration Behavior
Wahl, MatthiasHeidelberg Instruments Mikrotechnik GmbH, Heidelberg, GermanyAP5_Advances in WLP Technologies II  Presenter
Wakamoto, KeisukeRohm Co., Ltd, JapanRel4_New Approaches in Reliability Simulation and Modelling  Presenter
Wang, Chih-YuNational Cheng Kung University, Tainan, TaiwanMIP5_Microstructural Properties of Materials for Interconnects  Presenter
Wang, JunshaMeisei University, Hino, Japan;
The University of Tokyo Tokyo, Japan		MIP2_Advanced Interconnection Metallurgical Materials and Interconnects
Wang, LiliIMEC, BelgiumAP4_Advances in WLP Technologies I  Presenter
Wang, QianSchool of Integrated Circuits, Tsinghua University, Beijing, China, Peoples Republic of;
Beijing National Research Center for Information Science and Technology, Beijing, China, Peoples Republic of		DTM4_Device Level Modeling
Wang, QidongInstitute of Microelectronics of the Chinese Academy of Sciences, Beijing, China, People's Republic ofDTM1_Co-design and Modeling for Chiplets
Wang, WeiSchool of Integrated Circuits, Peking University, Beijing, China, People's Republic of;
Beijing Advanced Innovation Center for Integrated Circuits, Beijing, China, People's Republic of;
National Key Lab of Micro/Nano Fabrication Technology, China, People's Republic of		DTM1_Co-design and Modeling for Chiplets
Wang, YuanyuanSmart High Tech AB, Goeteborg, SwedenPower1_Electronics Measurement and Simulation
Wang, ZheyaoTsinghua University, Tsinghua, China, People's Republic ofPoster Session 1
Wang, ZilinTsinghua University, Tsinghua, China, People's Republic ofPoster Session 1
Weichart, JürgenEvatec AG, Truebbach, SwitzerlandAP4_Advances in WLP Technologies I
Weißenburg, Lasse FelixFraunhofer IZM, Berlin, GermanyOpto1_Photonic Module Packaging
Werft, LukasFraunhofer IZM, Berlin, GermanyFlex1_Reliability Assessment of Flexible Electronics  Presenter
Wessels, Jan-PhilippLidrotec GmbH, Bochum, GermanyPoster Session 3
Wiedmer, AndreasBesi Switzerland AG, Steinhausen, SwitzerlandAMT2_Computer-aided Process Control
Wiemer, MaikFraunhofer ENAS, Chemnitz, Germany;
Fraunhofer Institute for Electronic Nano Systems ENAS, Chemnitz, Germany		AMT4_Hybrid Bonding, Direct Bonding, Heterogeneous Integration
AP4_Advances in WLP Technologies I
MIP1_Advanced Material Architectures for Interconnects
MIP2_Advanced Interconnection Metallurgical Materials and Interconnects
MIP6_New materials for Heterogeneous Integration
Wiese, SteffenSaarland University, Saarbücken, GermanyPoster Session 2
Poster Session 3
Wiesenfarth, MaikeFraunhofer ISE, Freiburg, GermanyAMT1_Innovative Assembly Processes
Wietstruck, MatthiasIHP – Leibniz-Institut für innovative Mikroelektronik, Frankfurt (Oder), Germany;
IHP GmbH, Frankfurt Oder, Germany		AMT4_Hybrid Bonding, Direct Bonding, Heterogeneous Integration
Poster Session 2
RF1_Millimeter-wave and Sub-THz Antenna-in-Package Integration for High Performance Systems  Presenter
Windemuth, ThiloAalto University, Espoo, FinlandRel1_Reliability Performance and Electromigration Behavior
Wiss, ErikSaarland University, Saarbücken, GermanyPoster Session 2
Poster Session 3
Wittig, BobVolkswagen AG, GermanyRel2_Package- and Board Level Moisture- and Thermal Stress-related Reliability Effects  Presenter
Wittler, OlafFraunhofer IZM, Berlin, GermanyRel1_Reliability Performance and Electromigration Behavior
Rel3_Progress in Failure Analytical and Material Testing Methods
Wöhrmann, MarkusFraunhofer IZM, Berlin, GermanyAP5_Advances in WLP Technologies II
MIP6_New materials for Heterogeneous Integration
Wu, YongboSchool of Integrated Circuits, Tsinghua University, Beijing, China, Peoples Republic ofDTM4_Device Level Modeling  Presenter
Wunderle, BernhardTU Chemnitz, Chemnitz, GermanyRel3_Progress in Failure Analytical and Material Testing Methods
Rel3_Progress in Failure Analytical and Material Testing Methods  Presenter
Wünsch, DirkFraunhofer ENAS, Chemnitz, GermanyAMT4_Hybrid Bonding, Direct Bonding, Heterogeneous Integration
AP4_Advances in WLP Technologies I
MIP2_Advanced Interconnection Metallurgical Materials and Interconnects
Yamada, KatsuyaTAZMO CO.,LTD.AP3_Hybrid Bonding II  Presenter
Yamada, TadatomoLINTEC Corporation, JapanAMT1_Innovative Assembly Processes  Presenter
Yamagishi, MasanoriLINTEC CorporationAP3_Hybrid Bonding II
Emerging I_From Mounting to Recycling – Highlites from Emerging Technologies  Presenter
Yamamoto, SusumuMemory Packaging Development Department, Kioxia Corporation, JapanMIP4_Mechanical properties of Materials for Interconnects
Yan, DongSilicon Austria Labs GmbH, Heterogeneous Integration Technologies, Villach, AustriaAP3_Hybrid Bonding II  Presenter
Yang, Chih-hanNational Cheng Kung University, Tainan City, TaiwanMIP4_Mechanical properties of Materials for Interconnects
Yang, YudongInstitute of Microelectronics of the Chinese Academy of Sciences, Beijing, China, People's Republic of;
School of Integrated Circuits, Peking University, Beijing, China, People's Republic of		DTM1_Co-design and Modeling for Chiplets  Presenter
Yari, KeyvanDelft University of Technology, Delft, The NetherlandsRel4_New Approaches in Reliability Simulation and Modelling
Ye, YuxinThe Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China, People's Republic ofPoster Session 1  Presenter
Yoshihara, YukiYokohama National University, Yokohama, JapanAP3_Hybrid Bonding II
Poster Session 2
Yuan, ChengdongJade University of Applied Sciences, Wilhelmshaven, Germany;
University of Rostock, Rostock, Germany		DTM3_Reliability and Virtual Prototyping  Presenter
Yuile, AdamSaarland University, Saarbücken, GermanyPoster Session 2
Poster Session 3
Yumoto, TakumiShinko Electric Industries Co, LTD. JapanPower2_Power Semiconductor Packaging and Cooling
Zafarana, GiovanniSAES Getters, Lainate, ItalyPoster Session 3  Presenter
Zajaczkowski, MarekBerliner Nanotest und Design GmbH, Berlin, GermanyPoster Session 1
Zakwan, AhmedEastern Michigan University, Ypsilanti, United States of AmericaFlex1_Reliability Assessment of Flexible Electronics
Zelei, AmbrusSzéchenyi István University, Győr, HungaryRel4_New Approaches in Reliability Simulation and Modelling
Zeng, GuodongBesi Switzerland AG, Steinhausen, SwitzerlandAMT2_Computer-aided Process Control
Zeng, YanpingChina Nanhu Academy of Electronics and Information Technology, Jiaxing, ChinaPoster Session 2
Zengerle, RolandHahn-Schickard, Freiburg, Germany, Germany;
University of Freiburg, Freiburg, Germany		Flex2_Formation of a Conductive Interconnection for Flexible Electronics
Zerna, ThomasTUD Dresden University of Technology (IAVT), Dresden, Germany;
TU Dresden, Dresden, Germany		Poster Session 2
Power1_Electronics Measurement and Simulation
Zhang, Boyaoimec, Loewen, BelgiumAP2_Hybrid Bonding I
AP6_Challenges and Solutions for HI
Zhang, ChiSchool of Integrated Circuits, Peking University, Beijing, China, People's Republic of;
National Key Lab of Micro/Nano Fabrication Technology, China, People's Republic of		DTM1_Co-design and Modeling for Chiplets
Zhang, Guo QiDelft University of Technology (TUD), Delft, The NetherlandsPower2_Power Semiconductor Packaging and Cooling
Zhang, YuInstitute of Microelectronics of the Chinese Academy of Sciences, Beijing, China, People's Republic ofDTM1_Co-design and Modeling for Chiplets
Zhang, ZihanDelft University of Technology, Delft, The NetherlandsPoster Session 2  Presenter
Zhao, DaweiFraunhofer IISB, Erlangen, GermanyPoster Session 1
Zhao, GuoqiangCollege of Information Science and Electronic Engineering, Zhejiang University, Hangzhou 310027, China;
International Joint Innovation Center, Zhejiang University, Haining, China;
China Nanhu Academy of Electronics and Information Technology, Jiaxing, China		Poster Session 2  Presenter
Zhao, YiCollege of Information Science and Electronic Engineering, Zhejiang University, Hangzhou 310027, China;
School of Integrated Circuits, East China Normal University, Shanghai, China		Poster Session 2
Zhao, YushuECE Department, McGill University, Montreal, CanadaEmerging II
Zhou, ShiqiOsaka University, Osaka, JapanMIP4_Mechanical properties of Materials for Interconnects
Zhou, YiUniversity of Illinois at Urbana Champaign, Urbana, USADTM4_Device Level Modeling
Ziegler, RalfLaser Electronics LE GmbH, Berlin, GermanyOpto1_Photonic Module Packaging
Zijl, JurrianBESI Netherlands B.V., The NetherlandsPoster Session 3  Presenter
Zimmermann, VictoriaFraunhofer IISB, Erlangen, GermanyPoster Session 1  Presenter
Zippelius, AndreasTechnische Hochschule Ingolstadt, Ingolstadt, GermanyDTM3_Reliability and Virtual Prototyping
Zluc, AndreasAT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AustriaAP7_Fan Out Packages
Zoschke, KaiFraunhofer IZM, Berlin, GermanyAMT1_Innovative Assembly Processes
Zschenderlein, UweTU Chemnitz, Chemnitz, GermanyRel3_Progress in Failure Analytical and Material Testing Methods