IEEE ESTC 2024

September 11–13, 2024 | Berlin, Germany

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Index of Authors

A list of all persons who contribute to the sessions of this conference. Please select a letter below to list all persons with the corresponding surname. Select the presentation in the right-hand column to access session and presentation details.

List by Initial Letter: A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

List Options: Authors and Sessions · Authors and Presentations

Author(s)	Organization(s)	Session
A. Marques, Antonio	Instituto de Telecomunicacoes, Portugal	Opto1_Photonic Module Packaging
Aasmundtveit, KNUT EILIF	University of South-Eastern Norway, Norway	MIP3_Low-temperature Materials for Interconnects and Packaging MIP3_Low-temperature Materials for Interconnects and Packaging
Abadie, Karine	University Grenoble Alpes CEA, LETI, Grenoble, France	AP2_Hybrid Bonding I
Abdilla, Jonathan	BESI, Radfeld, Austria	AP2_Hybrid Bonding I
Abo Ras, Mohamad	Nanotest GmbH, Berlin, Germany	Rel3_Progress in Failure Analytical and Material Testing Methods
Ackerl, Norbert	Besi Switzerland AG, Steinhausen, Switzerland	AMT2_Computer-aided Process Control Presenter
Adavi, Karamat	Huber Automotive AG, Muehlhausen, Germany	RF2_Embedded System-in-Package and Interconnections Technologies Presenter
Adorno, Silvia	STMicroelectronics, Italy	AP6_Challenges and Solutions for HI
Ain, Kaneeze Noorul	Silicon Austria Labs (SAL), Villach, Austria; Delft University of Technology (TUD), Delft, The Netherlands	Power2_Power Semiconductor Packaging and Cooling Presenter
Akhtar, Mohd Zubair	Technische Hochschule Ingolstadt, Ingolstadt, Germany	DTM3_Reliability and Virtual Prototyping Presenter
Al-Shami, Hashem	Fraunhofer IZM, Germany	AMT3_Process for Enhancement of Device Robustness Presenter
Alajoki, Teemu	VTT Technical Research Centre of Finland, Espoo, Finland	Flex1_Reliability Assessment of Flexible Electronics
Albrecht, Jan	Fraunhofer ENAS, Chemnitz, Germany	DTM3_Reliability and Virtual Prototyping
Albrecht, Oliver	TU Dresden, Dresden Germany	Poster Session 2 Presenter Power1_Electronics Measurement and Simulation
Alexiou, Ioannis	Evatec AG, Trübbach, Switzerland	AP1_Advanced Substrates
Alves, Luis Nero	Instituto de Telecomunicacoes, Portugal	Opto1_Photonic Module Packaging
Ambrosius, Norbert	LPKF Laser & Electronics SE, Garbsen, Germany	AP1_Advanced Substrates
Amos, Brian	The Chemours Company, Newark, USA	Poster Session 2
Anand, Ketan	IHP – Leibniz-Institut für innovative Mikroelektronik, Frankfurt (Oder), Germany	AMT4_Hybrid Bonding, Direct Bonding, Heterogeneous Integration
Andrianov, Nikolai	Silicon Austria Labs GmbH, Austria	Poster Session 1
Ankeraa, Kim	Hytek	AMT5_Advanced Materials and Processes
Anspach, Nils	LPKF Laser & Electronics SE, Garbsen, Germany	AP1_Advanced Substrates
Asseburg, Gerret	University of Applied Science and Arts, Dortmund Soest, Germany	Rel2_Package- and Board Level Moisture- and Thermal Stress-related Reliability Effects
Auer, Benedikt	BESI, Radfeld, Austria	AP2_Hybrid Bonding I
Azeem, Munir Syed	Silicon Austria Labs GmbH, Austria	Poster Session 1

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