Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

 
Authors
 
Session Overview
Date: Wednesday, 11/Sept/2024
8:00am - 2:30pmRegistration
8:30am - 10:30am„IEEE EPS Heterogeneous Integration Roadmap“ (HIR) I
Location: MOA 10-12
8:30am - 10:30amPDC: “Advanced Packaging for MEMS and Sensors” I
Location: MOA 5

Course instructor: Horst Theuss
8:30am - 10:30amPDC: “Automotive Electronics Reliability – Assurance Approaches and Challenges” I
Location: MOA 4

Course instructor: Pradeep Lall
8:30am - 10:30amPDC: “Flip Chip Fabrication and Applications“ I
Location: MOA 3

Course instructor: Eric Perfecto
10:30am - 10:45amBreak
10:45am - 12:45pm„IEEE EPS Heterogeneous Integration Roadmap“ (HIR) II
Location: MOA 10-12
10:45am - 12:45pmPDC: “Advanced Packaging for MEMS and Sensors” II
Location: MOA 5

Course instructor: Horst Theuss
10:45am - 12:45pmPDC: “Automotive Electronics Reliability – Assurance Approaches and Challenges” II
Location: MOA 4

Course instructor: Pradeep Lall
10:45am - 12:45pmPDC: “Flip Chip Fabrication and Applications“ II
Location: MOA 3

Course instructor: Eric Perfecto
11:00am - 3:00pmExhibition Setup
Location: Atrium
12:45pm - 1:30pmBreak
1:30pm - 1:45pmOpening
Location: MOA 10-12

Opening remarks
Tanja Braun
General Chair IEEE ESTC2024

Welcome on behalf of the German Ministry for Education and Research (BMBF)
Engelbert Beyer
Deputy Director-General of Directorate 51, Technology-Oriented Research for Innovation, BMBF, Germany

1:45pm - 2:30pmKeynote 1
Location: MOA 10-12

"A Vision for Modular, Ubiquitous and Scalable Compute Systems"

Bernd Waidhas
Principal Engineer, Silicon Packaging Architecture, Intel
2:30pm - 2:40pmRoom change
2:40pm - 3:55pmMIP1_Advanced Material Architectures for Interconnects
Location: MOA 10-12
2:40pm - 3:55pmAP1_Advanced Substrates
Location: MOA 5
2:40pm - 3:55pmOpto1_Photonic Module Packaging
Location: MOA 4
2:40pm - 3:55pmDTM1_Co-design and Modeling for Chiplets
Location: MOA 3
2:40pm - 3:55pmPower1_Electronics Measurement and Simulation
Location: MOA 1+2
3:00pm - 8:00pmExhibition
Location: Atrium
3:55pm - 4:25pmCoffee Break & Exhibition
Location: Atrium
3:55pm - 5:00pmPoster Session 1
Location: Atrium
4:25pm - 4:55pmExhibitor Pitches
Location: MOA 10-12
4:55pm - 5:00pmRoom change
5:00pm - 6:15pmMIP2_Advanced Interconnection Metallurgical Materials and Interconnects
Location: MOA 10-12
5:00pm - 6:15pmAP2_Hybrid Bonding I
Location: MOA 5
5:00pm - 6:15pmOpto2_Heterogenous PIC Integration
Location: MOA 4
5:00pm - 6:15pmDTM2_Reduced Order Modeling for Advanced Packaging
Location: MOA 3
5:00pm - 6:15pmPower2_Power Semiconductor Packaging and Cooling
Location: MOA 1+2
6:15pm - 8:00pmWelcome Reception
Location: Atrium
Date: Thursday, 12/Sept/2024
8:30am - 9:15amKeynote 2
Location: MOA 10-12

"Electronics Integration: Challenges in Computed Tomography Scanners"

Dr. Michael Hosemann
Head of Digital Electronics at Healthineers Computed Tomography Detector Center, Siemens
8:30am - 7:00pmExhibition
Location: Atrium
9:15am - 10:30amMIP3_Low-temperature Materials for Interconnects and Packaging
Location: MOA 10-12
9:15am - 10:30amAP3_Hybrid Bonding II
Location: MOA 5
9:15am - 10:30amAMT1_Innovative Assembly Processes
Location: MOA 4
9:15am - 10:30amDTM3_Reliability and Virtual Prototyping
Location: MOA 3
9:15am - 10:30amRel1_Reliability Performance and Electromigration Behavior
Location: MOA 1+2
10:30am - 11:00amCoffee Break & Exhibition
Location: Atrium
10:30am - 11:45amPoster Session 2
Location: Atrium
11:00am - 12:15pmEmerging I_From Mounting to Recycling – Highlites from Emerging Technologies
Location: MOA 10-12
11:00am - 12:15pmAP4_Advances in WLP Technologies I
Location: MOA 5
11:00am - 12:15pmAMT2_Computer-aided Process Control
Location: MOA 4
11:00am - 12:15pmDTM4_Device Level Modeling
Location: MOA 3
11:00am - 12:15pmRel2_Package- and Board Level Moisture- and Thermal Stress-related Reliability Effects
Location: MOA 1+2
12:15pm - 1:45pmLunch
1:45pm - 3:15pmSpecial Session
Location: MOA 10-12

The Future of Packaging in Europe - Strategies and Funding for R&D and Manufacturing I
IPCEI ME/CT and Pack4EU/ EU CHIPS ACT



1:45pm - 3:15pmAP5_Advances in WLP Technologies II
Location: MOA 5
1:45pm - 3:15pmAMT3_Process for Enhancement of Device Robustness
Location: MOA 4
1:45pm - 3:15pmSpecial Session
Location: MOA 3

PUNCH - Photonic Packaging



1:45pm - 3:15pmSpecial Session
Location: MOA 1+2

Education I: The Education, Training and Qualification Offer for Sustainable Electronics



3:15pm - 3:45pmCoffee Break & Exhibition
Location: Atrium
3:45pm - 5:15pmSpecial Session
Location: MOA 10-12

The Future of Packaging in Europe - Strategies and Funding for R&D and Manufacturing II
IPCEI ME/CT and Pack4EU/ EU CHIPS ACT



3:45pm - 5:15pmAP6_Challenges and Solutions for HI
Location: MOA 5
3:45pm - 5:15pmEmerging II
Location: MOA 4
3:45pm - 5:15pmSpecial Session
Location: MOA 3

Quantum Computing



3:45pm - 5:15pmSpecial Session
Location: MOA 1+2

Education II: t.b.c.



5:15pm - 6:45pmPanel Discussion

"Chiplet Architectures for Automotive: Package Options and Special Considerations"

E. Jan Vardaman, TechSearch International, Inc.
Vikas Gupta, ASE





7:10pm - 7:35pmBus Transfer
7:30pm - 11:00pmGala Dinner at Wasserwerk
Date: Friday, 13/Sept/2024
8:30am - 9:15amKeynote 3
Location: MOA 10-12

"Challenges and Opportunities of Semiconductor Packaging in the Chiplet Era"

Dr. Yasumitsu Orii
Senior Managing Executive Officer in 3D Assembly Division, Rapidus Corporation
8:30am - 1:45pmExhibition
Location: Atrium
9:15am - 10:30amMIP4_Mechanical properties of Materials for Interconnects
Location: MOA 10-12
9:15am - 10:30amAP7_Fan Out Packages
Location: MOA 5
9:15am - 10:30amAMT4_Hybrid Bonding, Direct Bonding, Heterogeneous Integration
Location: MOA 4
9:15am - 10:30amFlex1_Reliability Assessment of Flexible Electronics
Location: MOA 3
9:15am - 10:30amRF1_Millimeter-wave and Sub-THz Antenna-in-Package Integration for High Performance Systems
Location: MOA 1+2
10:30am - 11:00amCoffee Break & Exhibition
Location: Atrium
10:30am - 11:45amPoster Session 3
Location: Atrium
11:00am - 12:15pmMIP5_Microstructural Properties of Materials for Interconnects
Location: MOA 10-12
11:00am - 12:15pmAP8_Fan Out Reliability Aspects
Location: MOA 5
11:00am - 12:15pmAMT5_Advanced Materials and Processes
Location: MOA 4
11:00am - 12:15pmFlex2_Formation of a Conductive Interconnection for Flexible Electronics
Location: MOA 3
11:00am - 12:15pmRel3_Progress in Failure Analytical and Material Testing Methods
Location: MOA 1+2
12:15pm - 1:45pmLunch
1:45pm - 3:00pmMIP6_New materials for Heterogeneous Integration
Location: MOA 10-12
1:45pm - 3:00pmAP9_Power Electronics Packaging
Location: MOA 5
1:45pm - 3:00pmAMT6_Enhanced Process Control
Location: MOA 4
1:45pm - 3:00pmRF2_Embedded System-in-Package and Interconnections Technologies
Location: MOA 3
1:45pm - 3:00pmRel4_New Approaches in Reliability Simulation and Modelling
Location: MOA 1+2
3:00pm - 3:10pmRoom Change
Location: Atrium
3:10pm - 3:55pmKeynote 4
Location: MOA 10-12

"CHIPS -NAPMP: Overview and Next Steps"

George Orji
Deputy Director of CHIPS NAPMP, USA
3:55pm - 4:25pmClosing
Date: Saturday, 14/Sept/2024
8:30am - 3:30pmIEEE EPS Board of Governors Meeting (not public)

 
 
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