| Session | ||
„IEEE EPS Heterogeneous Integration Roadmap“ (HIR) II
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| Session Abstract | ||
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Part 2 10.45 – 12.45 Opening System-in-Package Trends“Trends in Modelling and Simulation” (Chris Bailey, Arizona State University, Przemek Gromala, Bosch) “Virtual development for Advanced Substrates Made in Europe” (Thomas Krivec, AT&S) “Impact of Digitalization on Reliability in Microelectronics – Outcome of the ECSEL JU iRel40 project” (Klaus Pressel, Infineon) “Impact of Failure Analysis in Advanced Microelectronics” (Frank Altmann, Sebastian Brand, Fraunhofer IMWS, FA4.0 project) Panel discussion & Wrap-up – Link to US and Rest of the World, Erik Jung, Klaus Pressel |