Conference Agenda

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Session Overview
Session
„IEEE EPS Heterogeneous Integration Roadmap“ (HIR) II
Time:
Wednesday, 11/Sept/2024:
10:45am - 12:45pm

Location: MOA 10-12

MOA 10-12

Session Abstract

Part 2 10.45 – 12.45

Opening System-in-Package Trends


“Trends in Modelling and Simulation”

(Chris Bailey, Arizona State University, Przemek Gromala, Bosch)


“Virtual development for Advanced Substrates Made in Europe”

(Thomas Krivec, AT&S)


“Impact of Digitalization on Reliability in Microelectronics – Outcome of the ECSEL JU iRel40 project”

(Klaus Pressel, Infineon)


“Impact of Failure Analysis in Advanced Microelectronics”

(Frank Altmann, Sebastian Brand, Fraunhofer IMWS, FA4.0 project)



Panel discussion & Wrap-up – Link to US and Rest of the World, Erik Jung, Klaus Pressel




 
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