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„IEEE EPS Heterogeneous Integration Roadmap“ (HIR) I
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| Session Abstract | ||
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Part 1 8.30 – 10.30 Introduction/Opening/Motivation HIR Erik Jung and Klaus Pressel“Introduction to the HIR Roadmap” (Erik Jung, Fraunhofer IZM, Klaus Pressel, Bill Chen) “Integrated Power Electronics” (Michael Jank, Fraunhofer IISB) “Trends in Photonics” (Onno Huiskamp, CITC/TNO Netherlands) “LETI perspective on Heterogeneous Integration (RTO perspective)” (Jean-Charles Souriau /David Henry, CEA LETI) “Material Trends - Importance of tailored materials” (Erich Neubauer RHP-Technology Austria) “The move towards chiplets - Open European Industrial Foundry for Advanced Packaging and Micro Integration – An Innovation Driver for Start-ups, SME and LE” (Torsten Grawunder, Swissbit) |