Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
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Session Overview |
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„IEEE EPS Heterogeneous Integration Roadmap“ (HIR) I
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Part 1 8.30 – 10.30 Introduction/Opening/Motivation HIR Erik Jung and Klaus Pressel“Introduction to the HIR Roadmap” (Erik Jung, Fraunhofer IZM, Klaus Pressel, Bill Chen) “Integrated Power Electronics” (Michael Jank, Fraunhofer IISB) “Trends in Photonics” (Onno Huiskamp, CITC/TNO Netherlands) “LETI perspective on Heterogeneous Integration (RTO perspective)” (Jean-Charles Souriau /David Henry, CEA LETI) “Material Trends - Importance of tailored materials” (Erich Neubauer RHP-Technology Austria) “The move towards chiplets - Open European Industrial Foundry for Advanced Packaging and Micro Integration – An Innovation Driver for Start-ups, SME and LE” (Torsten Grawunder, Swissbit) |