Conference Agenda

1:45pm - 2:10pm

AI-Driven Digital Twin for Real-Time Health Monitoring of Wide Band Gap Semiconductors in Power Electronic Applications

Alireza Mehrabi, Keyvan Yari, Willem D. van Driel, Rene H. Poelma

Delft University of Technology, Delft, The Netherlands

2:10pm - 2:35pm

Damage Parameter: Proposed Index to Quantify the Durability of Sintered Nano Silver and Multilayer Aluminum Foil Die Attach Materials

Keisuke Wakamoto, Takukazu Otsuka, Ken Nakahara

Rohm Co., Ltd, Japan

2:35pm - 3:00pm

Energy-Based Approach on Calculating Stand-off Height of Different Solder Joints

Antal Bakonyi, Ambrus Zelei

Széchenyi István University, Győr, Hungary