Conference Agenda

Session

RF2_Embedded System-in-Package and Interconnections Technologies

Time:

Friday, 13/Sept/2024:

1:45pm - 3:00pm

Session Chair: Maurizio Cirillo, Rheinmetall Italia SpA

Location: MOA 3

MOA 3

Presentations

1:45pm - 2:10pm

Integration of Microwave SMD Components into Organic Multilayer PCBs

Lorenzo Giambuzzi¹, Maurizio Cirillo¹, David Schütze², Martin Hempel², Thomas Löher²

¹Rheinmetall Italia S.p.A., Rome, Italy; ²Fraunhofer IZM, Berlin, Germany

2:10pm - 2:35pm

Integration of III-V Components of 5G Transceiver in Embedding PCB-based Technology

Tekfouy Lim¹, Stefan Kosmider¹, Kavin Senthil Murugesan², Andreas Ostmann¹

¹Fraunhofer IZM, Berlin, Germany; ²TU Berlin, Berlin, Germany

2:35pm - 3:00pm

Passive Intermodulation Estimation of a Novel Printed Circuit Board Interconnection Technology Based on Static I-V

Karamat Adavi¹, Sebastian Quednau², Xaver Mueller³, Daniel Ernst⁴, Karsten Meier⁴, Hanno Platz⁵

¹Huber Automotive AG, Muehlhausen, Germany; ²NanoWired GmbH, Gernsheim, Germany; ³Becker & Müller Schaltungsdruck GmbH, Steinach, Germany; ⁴TU Dresden, Dresden, Germany; ⁵GED Gesellschaft für Elektronik und Design mbH, Ruppichteroth, Germany