Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

 
 
Session Overview
Session
RF2_Embedded System-in-Package and Interconnections Technologies
Time:
Friday, 13/Sept/2024:
1:45pm - 3:00pm

Session Chair: Maurizio Cirillo, Rheinmetall Italia SpA
Location: MOA 3

MOA 3

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Presentations
1:45pm - 2:10pm

Integration of Microwave SMD Components into Organic Multilayer PCBs

Lorenzo Giambuzzi1, Maurizio Cirillo1, David Schütze2, Martin Hempel2, Thomas Löher2

1Rheinmetall Italia S.p.A., Rome, Italy; 2Fraunhofer IZM, Berlin, Germany



2:10pm - 2:35pm

Integration of III-V Components of 5G Transceiver in Embedding PCB-based Technology

Tekfouy Lim1, Stefan Kosmider1, Kavin Senthil Murugesan2, Andreas Ostmann1

1Fraunhofer IZM, Berlin, Germany; 2TU Berlin, Berlin, Germany



2:35pm - 3:00pm

Passive Intermodulation Estimation of a Novel Printed Circuit Board Interconnection Technology Based on Static I-V

Karamat Adavi1, Sebastian Quednau2, Xaver Mueller3, Daniel Ernst4, Karsten Meier4, Hanno Platz5

1Huber Automotive AG, Muehlhausen, Germany; 2NanoWired GmbH, Gernsheim, Germany; 3Becker & Müller Schaltungsdruck GmbH, Steinach, Germany; 4TU Dresden, Dresden, Germany; 5GED Gesellschaft für Elektronik und Design mbH, Ruppichteroth, Germany



 
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