Conference Agenda

Session
AMT6_Enhanced Process Control
Time:
Friday, 13/Sept/2024:
1:45pm - 3:00pm

Session Chair: Knut E. Aasmundtveit, University of South-Eastern Norway
 Location: MOA 4

MOA 4

Presentations
1:45pm - 2:10pm

Invited Paper: A Novel Approach for Wafer level Solder Reflow and Cleaning of Semiconductor Wafer in Silicon Photonics, MEMS and Advanced Packaging

Daniel Lieske

AEMtec, Berlin, Germany


2:10pm - 2:35pm

In-situ Measurement of HCOOH, CO2 and H2O Concentrations During Formic Acid Reflow Soldering

Aaron Hutzler

Bond Pulse GmbH, Germany


2:35pm - 3:00pm

Enhanced Process Control for Dry Etching of Functional TiN Structures on 300 mm Wafer Level.

Johann Fell, Steffen Bickel, Conny Fiedler, Annekatrin Delan, Manuela Junghähnel

Fraunhofer IZM - ASSID, Moritzburg Germany