IEEE ESTC 2024

September 11–13, 2024 | Berlin, Germany

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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Only Sessions at Date / Time

Session Overview

Session

AMT6_Enhanced Process Control

Time:

Friday, 13/Sept/2024:

1:45pm - 3:00pm

Session Chair: Knut E. Aasmundtveit, University of South-Eastern Norway

Location: MOA 4

MOA 4

Presentations

1:45pm - 2:10pm

Invited Paper: A Novel Approach for Wafer level Solder Reflow and Cleaning of Semiconductor Wafer in Silicon Photonics, MEMS and Advanced Packaging

Daniel Lieske

AEMtec, Berlin, Germany

2:10pm - 2:35pm

In-situ Measurement of HCOOH, CO2 and H2O Concentrations During Formic Acid Reflow Soldering

Aaron Hutzler

Bond Pulse GmbH, Germany

2:35pm - 3:00pm

Enhanced Process Control for Dry Etching of Functional TiN Structures on 300 mm Wafer Level.

Johann Fell, Steffen Bickel, Conny Fiedler, Annekatrin Delan, Manuela Junghähnel

Fraunhofer IZM - ASSID, Moritzburg Germany