Conference Time: 19th Sept 2024, 03:52:38am CEST
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
AMT6_Enhanced Process Control
Time:
Friday, 13/Sept/2024:
1:45pm - 3:00pm
Session Chair: Knut E. Aasmundtveit , University of South-Eastern Norway
Location: MOA 4 MOA 4
Presentations
1:45pm - 2:10pm Invited Paper: A Novel Approach for Wafer level Solder Reflow and Cleaning of Semiconductor Wafer in Silicon Photonics, MEMS and Advanced Packaging
Daniel Lieske
AEMtec, Berlin, Germany
2:10pm - 2:35pm In-situ Measurement of HCOOH, CO2 and H2O Concentrations During Formic Acid Reflow Soldering
Aaron Hutzler
Bond Pulse GmbH, Germany
2:35pm - 3:00pm Enhanced Process Control for Dry Etching of Functional TiN Structures on 300 mm Wafer Level.
Johann Fell , Steffen Bickel, Conny Fiedler, Annekatrin Delan, Manuela Junghähnel
Fraunhofer IZM - ASSID, Moritzburg Germany
