Conference Agenda

Session
AP9_Power Electronics Packaging
Time:
Friday, 13/Sept/2024:
1:45pm - 3:00pm

Session Chair: Klaus Pressel, Infineon
Location: MOA 5

MOA 5

Presentations
1:45pm - 2:10pm

Additive Fan-out Panel-level Processing for Power MOSFET Devices

Eric Rubingh2, Edsger Smits1,2, Francesca Chiappini1,2, Roel Kusters2, Tindara Verduci2, Jackson Gualberto de Sousa1, Thijs Bel2, Jeroen van den Brand2, Mark Luke Farrugia1, Hero ‘t Mannetje2

1Chip Integration Technology Center, Nijmegen, The Netherlands; 2Holst Centre TNO, Eindhoven, The Netherlands



2:10pm - 2:35pm

Advancing Packaging Solutions: Integrating Power Electronics Using LTCC Technology

Qaisar Khushi Muhammad1, Peter Keil1, Uwe Krieger1, Manuel Heidenreich2, Jörg Töpfer2, Beate Capraro3, Dirk Schabbel3, Koji Koiwai1

1VIA electronic GmbH, Hermsdorf, Germany; 2University of Applied Sciences Jena, Jena, Germany; 3Fraunhofer IKTS, Hermsdorf, Germany



2:35pm - 3:00pm

Thermal Diffusivity Investigation of a Heat Pipe

Corina Ruxandra Mitulescu, Bogdan-Traian Mihailescu, Mihai Branzei, Paul Svasta

CETTI UNSTPB