Session | ||
AP9_Power Electronics Packaging
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Presentations | ||
1:45pm - 2:10pm
Additive Fan-out Panel-level Processing for Power MOSFET Devices 1Chip Integration Technology Center, Nijmegen, The Netherlands; 2Holst Centre TNO, Eindhoven, The Netherlands 2:10pm - 2:35pm
Advancing Packaging Solutions: Integrating Power Electronics Using LTCC Technology 1VIA electronic GmbH, Hermsdorf, Germany; 2University of Applied Sciences Jena, Jena, Germany; 3Fraunhofer IKTS, Hermsdorf, Germany 2:35pm - 3:00pm
Thermal Diffusivity Investigation of a Heat Pipe CETTI UNSTPB |