Conference Agenda

Session
MIP6_New materials for Heterogeneous Integration
Time:
Friday, 13/Sept/2024:
1:45pm - 3:00pm

Session Chair: Nikhilendu Tiwary, Aalto University
Location: MOA 10-12

MOA 10-12

Presentations
1:45pm - 2:10pm

Development of Novel BT Laminate Materials for mmWave Antenna and Heterogeneous Integration

Masashi Okaniwa, Yuji Kamata, Amane Matsunaga, Takashi Kobayashi, Takaaki Ogashiwa

MITSUBISHI GAS CHEMICAL COMPANY, INC., Japan



2:10pm - 2:35pm

Parylene as a Novel Material for Adhesive Bonding, Flexible Electronics and Wafer Level Packaging

Franz Selbmann1,2, Martin Kühn1,2, Frank Roscher1, Maik Wiemer1, Harald Kuhn1,3, Yvonne Joseph2

1Fraunhofer Institute for Electronic Nano Systems ENAS, Chemnitz, Germany; 2TU Bergakademie Freiberg, Institute of Nanoscale and Biobased Materials, Freiberg, Germany; 3TU Chemnitz, Center for Microtechnologies, Chemnitz, Germany



2:35pm - 3:00pm

Manufacturing and Characterization of Thin-Film Tantalum Pentoxide Integrated Capacitors

Andrei Costina1, Markus Wöhrmann1, Michael Schiffer1, Martin Schneider-Ramelow2

1Fraunhofer IZM, Berlin, Germany; 2TU Berlin, Berlin, Germany