Session | ||
MIP6_New materials for Heterogeneous Integration
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Presentations | ||
1:45pm - 2:10pm
Development of Novel BT Laminate Materials for mmWave Antenna and Heterogeneous Integration MITSUBISHI GAS CHEMICAL COMPANY, INC., Japan 2:10pm - 2:35pm
Parylene as a Novel Material for Adhesive Bonding, Flexible Electronics and Wafer Level Packaging 1Fraunhofer Institute for Electronic Nano Systems ENAS, Chemnitz, Germany; 2TU Bergakademie Freiberg, Institute of Nanoscale and Biobased Materials, Freiberg, Germany; 3TU Chemnitz, Center for Microtechnologies, Chemnitz, Germany 2:35pm - 3:00pm
Manufacturing and Characterization of Thin-Film Tantalum Pentoxide Integrated Capacitors 1Fraunhofer IZM, Berlin, Germany; 2TU Berlin, Berlin, Germany |