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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Session Overview

Session

MIP6_New materials for Heterogeneous Integration

Time:

Friday, 13/Sept/2024:

1:45pm - 3:00pm

Session Chair: Nikhilendu Tiwary, Aalto University

Location: MOA 10-12

MOA 10-12

Presentations

1:45pm - 2:10pm

Development of Novel BT Laminate Materials for mmWave Antenna and Heterogeneous Integration

Masashi Okaniwa, Yuji Kamata, Amane Matsunaga, Takashi Kobayashi, Takaaki Ogashiwa

MITSUBISHI GAS CHEMICAL COMPANY, INC., Japan

2:10pm - 2:35pm

Parylene as a Novel Material for Adhesive Bonding, Flexible Electronics and Wafer Level Packaging

Franz Selbmann^1,2, Martin Kühn^1,2, Frank Roscher¹, Maik Wiemer¹, Harald Kuhn^1,3, Yvonne Joseph²

¹Fraunhofer Institute for Electronic Nano Systems ENAS, Chemnitz, Germany; ²TU Bergakademie Freiberg, Institute of Nanoscale and Biobased Materials, Freiberg, Germany; ³TU Chemnitz, Center for Microtechnologies, Chemnitz, Germany

2:35pm - 3:00pm

Manufacturing and Characterization of Thin-Film Tantalum Pentoxide Integrated Capacitors

Andrei Costina¹, Markus Wöhrmann¹, Michael Schiffer¹, Martin Schneider-Ramelow²

¹Fraunhofer IZM, Berlin, Germany; ²TU Berlin, Berlin, Germany