IEEE ESTC 2024

September 11–13, 2024 | Berlin, Germany

JavaScript is Disabled
Your browser's JavaScript functionality is disabled. It has to be enabled to use this function of ConfTool.
Here you can find information on how to enable JavaScript
If you have any problems, please contact the organizers at office@estc-conference.net.

Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Session Overview

Session

MIP6_New materials for Heterogeneous Integration

Time:

Friday, 13/Sept/2024:

1:45pm - 3:00pm

Session Chair: Nikhilendu Tiwary, Aalto University

Location: MOA 10-12

MOA 10-12

Presentations

1:45pm - 2:10pm

Development of Novel BT Laminate Materials for mmWave Antenna and Heterogeneous Integration

Masashi Okaniwa, Yuji Kamata, Amane Matsunaga, Takashi Kobayashi, Takaaki Ogashiwa

MITSUBISHI GAS CHEMICAL COMPANY, INC., Japan

2:10pm - 2:35pm

Parylene as a Novel Material for Adhesive Bonding, Flexible Electronics and Wafer Level Packaging

Franz Selbmann^1,2, Martin Kühn^1,2, Frank Roscher¹, Maik Wiemer¹, Harald Kuhn^1,3, Yvonne Joseph²

¹Fraunhofer Institute for Electronic Nano Systems ENAS, Chemnitz, Germany; ²TU Bergakademie Freiberg, Institute of Nanoscale and Biobased Materials, Freiberg, Germany; ³TU Chemnitz, Center for Microtechnologies, Chemnitz, Germany

2:35pm - 3:00pm

Manufacturing and Characterization of Thin-Film Tantalum Pentoxide Integrated Capacitors

Andrei Costina¹, Markus Wöhrmann¹, Michael Schiffer¹, Martin Schneider-Ramelow²

¹Fraunhofer IZM, Berlin, Germany; ²TU Berlin, Berlin, Germany

Mobile View Print View

Contact and Legal Notice · Contact Address:
Privacy Statement · Conference: IEEE ESTC 2024