Conference Agenda

Session

Rel3_Progress in Failure Analytical and Material Testing Methods

Time:

Friday, 13/Sept/2024:

11:00am - 12:15pm

Session Chair: Matthias Petzold, Fraunhofer IMWS

Location: MOA 1+2

MOA 1+2

Presentations

11:00am - 11:25am

Full-field IR-Thermography for Bond-quality Inspection of Electroplated Aluminium Interconnects for Cryo-SiP Architectures

Bernhard Wunderle¹, Daniel May¹, Imants Cirulis², Silvia Braun², Uwe Zschenderlein¹, Jens Heilmann¹, Remi Pantou², Ralph Schacht³, Mohamad Abo Ras⁴

¹TU Chemnitz, Chemnitz, Germany; ²Fraunhofer ENAS, Chemnitz, Germany; ³BTU Cottbus, Cottbus, Germany; ⁴Nanotest GmbH, Berlin, Germany

11:25am - 11:50am

Using µ-RAMAN Spectroscopy to Inspect Sintered Interconnects

Gordon Elger¹, E Liu¹, Fabian Steinberger¹, Bernhard Wunderle², Zubair Mohd¹

¹Technische Hochschule, Germany; ²TU Chemnitz, Chemnitz, Germany

11:50am - 12:15pm

Determination of Mechanical Properties for Copper in Plated Through Holes by Combination of Tensile Test and Nanoindentation

Janine Conrad¹, Olaf Wittler², Martin Schneider-Ramelow¹

¹TU Berlin, Berlin, Germany; ²Fraunhofer IZM, Berlin, Germany