Conference Agenda

Session
Rel3_Progress in Failure Analytical and Material Testing Methods
Time:
Friday, 13/Sept/2024:
11:00am - 12:15pm

Session Chair: Matthias Petzold, Fraunhofer IMWS
Location: MOA 1+2

MOA 1+2

Presentations
11:00am - 11:25am

Full-field IR-Thermography for Bond-quality Inspection of Electroplated Aluminium Interconnects for Cryo-SiP Architectures

Bernhard Wunderle1, Daniel May1, Imants Cirulis2, Silvia Braun2, Uwe Zschenderlein1, Jens Heilmann1, Remi Pantou2, Ralph Schacht3, Mohamad Abo Ras4

1TU Chemnitz, Chemnitz, Germany; 2Fraunhofer ENAS, Chemnitz, Germany; 3BTU Cottbus, Cottbus, Germany; 4Nanotest GmbH, Berlin, Germany



11:25am - 11:50am

Using ยต-RAMAN Spectroscopy to Inspect Sintered Interconnects

Gordon Elger1, E Liu1, Fabian Steinberger1, Bernhard Wunderle2, Zubair Mohd1

1Technische Hochschule, Germany; 2TU Chemnitz, Chemnitz, Germany



11:50am - 12:15pm

Determination of Mechanical Properties for Copper in Plated Through Holes by Combination of Tensile Test and Nanoindentation

Janine Conrad1, Olaf Wittler2, Martin Schneider-Ramelow1

1TU Berlin, Berlin, Germany; 2Fraunhofer IZM, Berlin, Germany