Conference Agenda

Session

Flex2_Formation of a Conductive Interconnection for Flexible Electronics

Time:

Friday, 13/Sept/2024:

11:00am - 12:15pm

Session Chair: Jukka Hast, VTT Technical Research Centre of Finland ltd.

Location: MOA 3

MOA 3

Presentations

11:00am - 11:25am

Additively Manufactured Flexible Electronics with Selectively Soldered Surface-mounted Devices Utilising StarJet Technology

Daniel Straubinger¹, Zeba Khan^1,2, Peter Koltay³, Roland Zengerle^1,2, Sabrina Kartmann^1,2, Zhe Shu^1,2

¹Hahn-Schickard, Freiburg, Germany, Germany; ²University of Freiburg, Freiburg, Germany; ³Actome GmbH, Freiburg, Germany

11:25am - 11:50am

Electroless Nickel/Immersion Gold and Immersion Tin as Final Finish Solutions for Flexible Substrates in EV Batteries

Britta Schafsteller, Mario Rosin, Michael Schwaemmlein, Boris Kraft, Hubertus Mertens, Jasemin Tuerkelly, Sandra Nelle

MKS Atotech, Berlin, Germany

11:50am - 12:15pm

Electrical Characterization of an ALPIDE Chip TAB Bonded with Flexible PCBs

David Novel¹, Alessandro Lega^1,2, Tiziano Facchinelli¹, Roberto Iuppa², Stefania Beolé³, Pierluigi Bellutti^1,4

¹Fondazione Bruno Kessler, Trento, Italy; ²University of Trento / INFN TIFPA, Trento, Italy; ³University of Turin / INFN, Turin, Italy; ⁴INAF, Italy