Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

 
 
Session Overview
Session
Flex2_Formation of a Conductive Interconnection for Flexible Electronics
Time:
Friday, 13/Sept/2024:
11:00am - 12:15pm

Session Chair: Jukka Hast, VTT Technical Research Centre of Finland ltd.
Location: MOA 3

MOA 3

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Presentations
11:00am - 11:25am

Additively Manufactured Flexible Electronics with Selectively Soldered Surface-mounted Devices Utilising StarJet Technology

Daniel Straubinger1, Zeba Khan1,2, Peter Koltay3, Roland Zengerle1,2, Sabrina Kartmann1,2, Zhe Shu1,2

1Hahn-Schickard, Freiburg, Germany, Germany; 2University of Freiburg, Freiburg, Germany; 3Actome GmbH, Freiburg, Germany



11:25am - 11:50am

Electroless Nickel/Immersion Gold and Immersion Tin as Final Finish Solutions for Flexible Substrates in EV Batteries

Britta Schafsteller, Mario Rosin, Michael Schwaemmlein, Boris Kraft, Hubertus Mertens, Jasemin Tuerkelly, Sandra Nelle

MKS Atotech, Berlin, Germany



11:50am - 12:15pm

Electrical Characterization of an ALPIDE Chip TAB Bonded with Flexible PCBs

David Novel1, Alessandro Lega1,2, Tiziano Facchinelli1, Roberto Iuppa2, Stefania Beolé3, Pierluigi Bellutti1,4

1Fondazione Bruno Kessler, Trento, Italy; 2University of Trento / INFN TIFPA, Trento, Italy; 3University of Turin / INFN, Turin, Italy; 4INAF, Italy