Conference Time: 23rd Nov 2024, 03:36:07pm CET
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Flex2_Formation of a Conductive Interconnection for Flexible Electronics
Time:
Friday, 13/Sept/2024:
11:00am - 12:15pm
Session Chair: Jukka Hast , VTT Technical Research Centre of Finland ltd.
Location: MOA 3 MOA 3
Presentations
11:00am - 11:25am Additively Manufactured Flexible Electronics with Selectively Soldered Surface-mounted Devices Utilising StarJet Technology
Daniel Straubinger 1 , Zeba Khan1,2 , Peter Koltay3 , Roland Zengerle1,2 , Sabrina Kartmann1,2 , Zhe Shu1,2
1 Hahn-Schickard, Freiburg, Germany, Germany; 2 University of Freiburg, Freiburg, Germany; 3 Actome GmbH, Freiburg, Germany
11:25am - 11:50am Electroless Nickel/Immersion Gold and Immersion Tin as Final Finish Solutions for Flexible Substrates in EV Batteries
Britta Schafsteller, Mario Rosin, Michael Schwaemmlein, Boris Kraft, Hubertus Mertens, Jasemin Tuerkelly, Sandra Nelle
MKS Atotech, Berlin, Germany
11:50am - 12:15pm Electrical Characterization of an ALPIDE Chip TAB Bonded with Flexible PCBs
David Novel 1 , Alessandro Lega1,2 , Tiziano Facchinelli1 , Roberto Iuppa2 , Stefania Beolé3 , Pierluigi Bellutti1,4
1 Fondazione Bruno Kessler, Trento, Italy; 2 University of Trento / INFN TIFPA, Trento, Italy; 3 University of Turin / INFN, Turin, Italy; 4 INAF, Italy