Session | ||
AMT5_Advanced Materials and Processes
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Presentations | ||
11:00am - 11:25am
Thin Substrate Bonding HRL Laboratories, United States of America 11:25am - 11:50am
System-in-package Building block Development for Future Space Equipment 1Thales Alenia Space, Cannes, France; 2Thales Alenia Space, Italy; 3Somacis; 4Panasonic; 5IMT; 6Hytek 11:50am - 12:15pm
Single Die Process Using Shadow Masks for a 55µm Fine Pitch Array of 4µm-tall Indium Bumps Across an Entire Chip 1UKRI-Science and Technology Facilities Council, Rutherford Appleton Laboratory, Harwell Campus, Didcot, United Kingdom; 2Kelvin Nanotechnology Ltd., Glasgow, United Kingdom |