11:00am - 11:25amThin Substrate Bonding
Partia Naghibi
HRL Laboratories, United States of America
11:25am - 11:50amSystem-in-package Building block Development for Future Space Equipment
Hélène Jochem1, Hugo Garcia1, Norbert Venet1, Mirko Rocci2, Lucas Sollecchia2, Paolo Scalmati3, Monique Mayr4, Carlo Tuninetti5, Giovanni Cucinella5, Kim Ankeraa6, Poul Juul6
1Thales Alenia Space, Cannes, France; 2Thales Alenia Space, Italy; 3Somacis; 4Panasonic; 5IMT; 6Hytek
11:50am - 12:15pmSingle Die Process Using Shadow Masks for a 55µm Fine Pitch Array of 4µm-tall Indium Bumps Across an Entire Chip
Andreas Schneider1, Aswathi Koorikkat1, Navid Ghorbanian1, Toby G. Brookes1, John D. Lipp1, David Burt2, Marcus J. French1
1UKRI-Science and Technology Facilities Council, Rutherford Appleton Laboratory, Harwell Campus, Didcot, United Kingdom; 2Kelvin Nanotechnology Ltd., Glasgow, United Kingdom
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