Conference Agenda

Session
AP8_Fan Out Reliability Aspects
Time:
Friday, 13/Sept/2024:
11:00am - 12:15pm

Session Chair: Grace O'Malley, INEMI
Location: MOA 5

MOA 5

Presentations
11:00am - 11:25am

Power Delivery for AI/HPC Microprocessors

Mark Li, Vikas Gupta

ASE, United States of America



11:25am - 11:50am

Reliability and RF Performance Assessment of Heterogeneous Integrated FO-WLP Test Structure Packages for Mixed RF Digital Front-End Application

Jesse C. Riedl1, Vincent Bortolussi1, Christophe Chang1, Didier Floriot1, Jonathan Leroy1, Romain Mathieu1, Julien Perraud3, Hermann Stieglauer2, Gregory Uren1, Benoit Lambert1

1UMS SAS, Villebon Sur Yvette, France; 2UMS GmbH, Ulm, Germany; 3Thales Research and Technology, Palaiseau, France



11:50am - 12:15pm

No Warpage and Fast Cure: UV-molding for FOWLP/FOPLP

Markus Schindler, Severin Ringelstetter, Martin Bues, Tobias Königer, Kilian Kreul

DELO Industrial Adhesives, Windach, Germany