Conference Agenda

Session

AP8_Fan Out Reliability Aspects

Time:

Friday, 13/Sept/2024:

11:00am - 12:15pm

Session Chair: Grace O'Malley, INEMI

Location: MOA 5

MOA 5

Presentations

11:00am - 11:25am

Power Delivery for AI/HPC Microprocessors

Mark Li, Vikas Gupta

ASE, United States of America

11:25am - 11:50am

Reliability and RF Performance Assessment of Heterogeneous Integrated FO-WLP Test Structure Packages for Mixed RF Digital Front-End Application

Jesse C. Riedl¹, Vincent Bortolussi¹, Christophe Chang¹, Didier Floriot¹, Jonathan Leroy¹, Romain Mathieu¹, Julien Perraud³, Hermann Stieglauer², Gregory Uren¹, Benoit Lambert¹

¹UMS SAS, Villebon Sur Yvette, France; ²UMS GmbH, Ulm, Germany; ³Thales Research and Technology, Palaiseau, France

11:50am - 12:15pm

No Warpage and Fast Cure: UV-molding for FOWLP/FOPLP

Markus Schindler, Severin Ringelstetter, Martin Bues, Tobias Königer, Kilian Kreul

DELO Industrial Adhesives, Windach, Germany