Conference Agenda

11:00am - 11:25am

Effect of Electromigration on Micro Tensile Test Mechanical Properties and Micro Structure of Pure Copper

Chih-Yu Wang, Kwang-Lung Lin

National Cheng Kung University, Tainan, Taiwan

11:25am - 11:50am

Thermal-Mechanical Analysis of Electroplated Copper for IC Packaging

Abdellah Salahouelhadj, Kris Vanstreels, Joke De Messemaeker, Carine Gerets, John Slabbekoorn, Zaid El-Mekki, Punith Kumar Mudigere Krishne Gowda, Mario Gonzalez, Eric Beyne

imec, Belgium

11:50am - 12:15pm

Study of Intermetallic Compound Evolution of Pure Sn and SnAg Alloy Solder on Single and Multi-layer Under-bump Materials

Tassawar Hussain^1,2, Jaber Derakhshandeh², Tom Cochet², Eric Beyne², Jack Hsu³, Dongming He³, Ingrid De Wolf^1,2

¹Department of Materials Engineering (MTM), KU Leuven, Leuven, Belgium; ²imec, Leuven, Belgium; ³Qualcomm Technologies, Inc.,San Diego, USA