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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Session Overview

Session

MIP5_Microstructural Properties of Materials for Interconnects

Time:

Friday, 13/Sept/2024:

11:00am - 12:15pm

Session Chair: Kay Essig, ASE Group

Location: MOA 10-12

MOA 10-12

Presentations

11:00am - 11:25am

Effect of Electromigration on Micro Tensile Test Mechanical Properties and Micro Structure of Pure Copper

Chih-Yu Wang, Kwang-Lung Lin

National Cheng Kung University, Tainan, Taiwan

11:25am - 11:50am

Thermal-Mechanical Analysis of Electroplated Copper for IC Packaging

Abdellah Salahouelhadj, Kris Vanstreels, Joke De Messemaeker, Carine Gerets, John Slabbekoorn, Zaid El-Mekki, Punith Kumar Mudigere Krishne Gowda, Mario Gonzalez, Eric Beyne

imec, Belgium

11:50am - 12:15pm

Study of Intermetallic Compound Evolution of Pure Sn and SnAg Alloy Solder on Single and Multi-layer Under-bump Materials

Tassawar Hussain^1,2, Jaber Derakhshandeh², Tom Cochet², Eric Beyne², Jack Hsu³, Dongming He³, Ingrid De Wolf^1,2

¹Department of Materials Engineering (MTM), KU Leuven, Leuven, Belgium; ²imec, Leuven, Belgium; ³Qualcomm Technologies, Inc.,San Diego, USA