Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

 
 
Session Overview
Session
MIP5_Microstructural Properties of Materials for Interconnects
Time:
Friday, 13/Sept/2024:
11:00am - 12:15pm

Session Chair: Kay Essig, ASE Group
Location: MOA 10-12

MOA 10-12

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Presentations
11:00am - 11:25am

Effect of Electromigration on Micro Tensile Test Mechanical Properties and Micro Structure of Pure Copper

Chih-Yu Wang, Kwang-Lung Lin

National Cheng Kung University, Tainan, Taiwan



11:25am - 11:50am

Thermal-Mechanical Analysis of Electroplated Copper for IC Packaging

Abdellah Salahouelhadj, Kris Vanstreels, Joke De Messemaeker, Carine Gerets, John Slabbekoorn, Zaid El-Mekki, Punith Kumar Mudigere Krishne Gowda, Mario Gonzalez, Eric Beyne

imec, Belgium



11:50am - 12:15pm

Study of Intermetallic Compound Evolution of Pure Sn and SnAg Alloy Solder on Single and Multi-layer Under-bump Materials

Tassawar Hussain1,2, Jaber Derakhshandeh2, Tom Cochet2, Eric Beyne2, Jack Hsu3, Dongming He3, Ingrid De Wolf1,2

1Department of Materials Engineering (MTM), KU Leuven, Leuven, Belgium; 2imec, Leuven, Belgium; 3Qualcomm Technologies, Inc.,San Diego, USA