Conference Time: 23rd Nov 2024, 06:43:43pm CET
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
MIP5_Microstructural Properties of Materials for Interconnects
Time:
Friday, 13/Sept/2024:
11:00am - 12:15pm
Session Chair: Kay Essig , ASE Group
Location: MOA 10-12 MOA 10-12
Presentations
11:00am - 11:25am Effect of Electromigration on Micro Tensile Test Mechanical Properties and Micro Structure of Pure Copper
Chih-Yu Wang , Kwang-Lung Lin
National Cheng Kung University, Tainan, Taiwan
11:25am - 11:50am Thermal-Mechanical Analysis of Electroplated Copper for IC Packaging
Abdellah Salahouelhadj , Kris Vanstreels, Joke De Messemaeker, Carine Gerets, John Slabbekoorn, Zaid El-Mekki, Punith Kumar Mudigere Krishne Gowda, Mario Gonzalez, Eric Beyne
imec, Belgium
11:50am - 12:15pm Study of Intermetallic Compound Evolution of Pure Sn and SnAg Alloy Solder on Single and Multi-layer Under-bump Materials
Tassawar Hussain 1,2 , Jaber Derakhshandeh2 , Tom Cochet2 , Eric Beyne2 , Jack Hsu3 , Dongming He3 , Ingrid De Wolf1,2
1 Department of Materials Engineering (MTM), KU Leuven, Leuven, Belgium; 2 imec, Leuven, Belgium; 3 Qualcomm Technologies, Inc.,San Diego, USA
