Conference Agenda

Session
Flex1_Reliability Assessment of Flexible Electronics
Time:
Friday, 13/Sept/2024:
9:15am - 10:30am

Session Chair: Jean Charles Souriau, CEA-Leti
 Location: MOA 3

MOA 3

Presentations
9:15am - 9:40am

Development and Reliability Assessment of a Flexible Printed Capacitive Sensor for Precise Twisting Movement Detection

Ahmed Zakwan, Colleen Stover, Rui Chen

Eastern Michigan University, Ypsilanti, United States of America


9:40am - 10:05am

Reliability Assessment of Temperature Sensors Integrated on Elastic Substrate

Tuomas Happonen1, Petri Järvinen2, Mikko Paakkolanvaara3, Teemu Alajoki1

1VTT Technical Research Centre of Finland, Espoo, Finland; 2Forciot, Finnland; 3Screentec, Oulu, Finnland


10:05am - 10:30am

Comparison of Electrical and Mechanical Properties of Stretchable Circuit Boards

Lukas Werft1, Christine Kallmayer1, Malte von Krshiwoblozki1, Martin Schneider-Ramelow2

1Fraunhofer IZM, Berlin, Germany; 2TU Berlin, Berlin, Germany