Conference Agenda

9:15am - 9:40am

First Electrical Performance of Self-assembly Applied to Die-to-wafer Hybrid Bonding

Adèle Thiolon, Pierre Montméat, Thierry Enot, Alice Bond, Carine Ladner, Loic Sanchez, Alain Campo, Thomas Magis, Floriane Baudin, Sébastien Dominguez, Frank Fournel, Emilie Bourjot

Univ. Grenoble Alpes, CEA, LETI, Grenoble, France

9:40am - 10:05am

BiCMOS BEOL Coupon Fabrication and Micro Transfer Printing for Heterogeneous Integration Applications

Selin Tolunay Wipf, Steffen Marschmeyer, Martin Drost, Ketan Anand, Matthias Wietstruck

IHP – Leibniz-Institut für innovative Mikroelektronik, Frankfurt (Oder), Germany

10:05am - 10:30am

Impact of Dielectric Types & Surface Profile on Wafer-to-Wafer Hybrid Bonding

Vikas Dubey¹, Dirk Wünsch¹, Knut Gottfried^1,3, Tobias Fischer^1,2, Lutz Hofmann¹, Maik Wiemer¹, Stefan E. Schulz^1,2

¹Fraunhofer ENAS, Chemnitz, Germany; ²TU-Chemnitz, Chemnitz, Germany; ³ErZm Technologies, Chemnitz, Germany