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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Session Overview

Session

AMT4_Hybrid Bonding, Direct Bonding, Heterogeneous Integration

Time:

Friday, 13/Sept/2024:

9:15am - 10:30am

Session Chair: Hoang-Vu Nguyen, University of South-Eastern Norway

Location: MOA 4

MOA 4

Presentations

9:15am - 9:40am

First Electrical Performance of Self-assembly Applied to Die-to-wafer Hybrid Bonding

Adèle Thiolon, Pierre Montméat, Thierry Enot, Alice Bond, Carine Ladner, Loic Sanchez, Alain Campo, Thomas Magis, Floriane Baudin, Sébastien Dominguez, Frank Fournel, Emilie Bourjot

Univ. Grenoble Alpes, CEA, LETI, Grenoble, France

9:40am - 10:05am

BiCMOS BEOL Coupon Fabrication and Micro Transfer Printing for Heterogeneous Integration Applications

Selin Tolunay Wipf, Steffen Marschmeyer, Martin Drost, Ketan Anand, Matthias Wietstruck

IHP – Leibniz-Institut für innovative Mikroelektronik, Frankfurt (Oder), Germany

10:05am - 10:30am

Impact of Dielectric Types & Surface Profile on Wafer-to-Wafer Hybrid Bonding

Vikas Dubey¹, Dirk Wünsch¹, Knut Gottfried^1,3, Tobias Fischer^1,2, Lutz Hofmann¹, Maik Wiemer¹, Stefan E. Schulz^1,2

¹Fraunhofer ENAS, Chemnitz, Germany; ²TU-Chemnitz, Chemnitz, Germany; ³ErZm Technologies, Chemnitz, Germany