Conference Time: 23rd Nov 2024, 04:11:43pm CET
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AMT4_Hybrid Bonding, Direct Bonding, Heterogeneous Integration
Time:
Friday, 13/Sept/2024:
9:15am - 10:30am
Session Chair: Hoang-Vu Nguyen , University of South-Eastern Norway
Location: MOA 4 MOA 4
Presentations
9:15am - 9:40am First Electrical Performance of Self-assembly Applied to Die-to-wafer Hybrid Bonding
Adèle Thiolon , Pierre Montméat, Thierry Enot, Alice Bond, Carine Ladner, Loic Sanchez, Alain Campo, Thomas Magis, Floriane Baudin, Sébastien Dominguez, Frank Fournel, Emilie Bourjot
Univ. Grenoble Alpes, CEA, LETI, Grenoble, France
9:40am - 10:05am BiCMOS BEOL Coupon Fabrication and Micro Transfer Printing for Heterogeneous Integration Applications
Selin Tolunay Wipf , Steffen Marschmeyer, Martin Drost, Ketan Anand, Matthias Wietstruck
IHP – Leibniz-Institut für innovative Mikroelektronik, Frankfurt (Oder), Germany
10:05am - 10:30am Impact of Dielectric Types & Surface Profile on Wafer-to-Wafer Hybrid Bonding
Vikas Dubey 1 , Dirk Wünsch1 , Knut Gottfried1,3 , Tobias Fischer1,2 , Lutz Hofmann1 , Maik Wiemer1 , Stefan E. Schulz1,2
1 Fraunhofer ENAS, Chemnitz, Germany; 2 TU-Chemnitz, Chemnitz, Germany; 3 ErZm Technologies, Chemnitz, Germany
