Conference Agenda

Session

AP7_Fan Out Packages

Time:

Friday, 13/Sept/2024:

9:15am - 10:30am

Session Chair: Erik Jung, Fraunhofer IZM

Location: MOA 5

MOA 5

Presentations

9:15am - 9:40am

INVITED TALK: Accelerating the AI Economy through Heterogeneous Integration

CP Hung

ASE, United States of America

9:40am - 10:05am

Development of an Adaptive Re-distribution Patterning Process for Fan-out Packages with Embedded High I/O Components

Ruben Kahle¹, Lars Böttcher¹, Luc Steffen Borchardt¹, Dionysios Manessis¹, Anna Meierfrankenfeld¹, Andreas Zluc², Andrea Casto², Stefano Sergio Oggioni²

¹Fraunhofer IZM, Berlin, Germany; ²AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, Austria

10:05am - 10:30am

On the Design and Fabrication of SMT-compatible 3D-Freeform Antennas Based on Compression Molding and Direct Cu-Metallization

Marc Dreissigacker¹, Friedrich Müller¹, Christian Tschoban², Tanja Braun², Karl-Friedrich Becker², Paul Perlwitz¹, Martin Schneider-Ramelow¹

¹TU Berlin, Microperipheric Center, Berlin, Germany; ²Fraunhofer IZM, Berlin, Germany