Conference Agenda

9:15am - 9:40am

Prediction of High Strain Rate Properties of Bi-doped SnAgCu Solders after Sustained High-temperature Operation

Pradeep Lall, Vishal Mehta, Mrinmoy Saha

Auburn University, Auburn, USA

9:40am - 10:05am

Quantification of Adhesion Strength and Mechanism of Adhesion Degradation Between Sputtered SUS304 and Mold Resin in Electromagnetic Wave Shield Packages

Soichi Homma¹, Daichi Okada², Akihito Sawanobori¹, Susumu Yamamoto¹, Hiroshi Nishikawa³

¹Memory Packaging Development Department, Kioxia Corporation, Japan; ²Memory Packaging Engineering Department, Kioxia Corporation, Japan; ³Joining and Welding Research Institute, Osaka University, Osaka, Japan

10:05am - 10:30am

Effect of Minor Element Addition on Mechanical Properties and Microstructure of Sn-Bi Alloys

Hiroshi Nishikawa¹, Yuki Hirata¹, Shiqi Zhou¹, Chih-han Yang², Shih-kang Lin²

¹Osaka University, Osaka, Japan; ²National Cheng Kung University, Tainan City, Taiwan