Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

 
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Session Overview
Session
MIP4_Mechanical properties of Materials for Interconnects
Time:
Friday, 13/Sept/2024:
9:15am - 10:30am

Session Chair: Glenn Hamilton Ross, Aalto University
 Location: MOA 10-12

MOA 10-12

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Presentations
9:15am - 9:40am

Prediction of High Strain Rate Properties of Bi-doped SnAgCu Solders after Sustained High-temperature Operation

Pradeep Lall, Vishal Mehta, Mrinmoy Saha

Auburn University, Auburn, USA


9:40am - 10:05am

Quantification of Adhesion Strength and Mechanism of Adhesion Degradation Between Sputtered SUS304 and Mold Resin in Electromagnetic Wave Shield Packages

Soichi Homma1, Daichi Okada2, Akihito Sawanobori1, Susumu Yamamoto1, Hiroshi Nishikawa3

1Memory Packaging Development Department, Kioxia Corporation, Japan; 2Memory Packaging Engineering Department, Kioxia Corporation, Japan; 3Joining and Welding Research Institute, Osaka University, Osaka, Japan


10:05am - 10:30am

Effect of Minor Element Addition on Mechanical Properties and Microstructure of Sn-Bi Alloys

Hiroshi Nishikawa1, Yuki Hirata1, Shiqi Zhou1, Chih-han Yang2, Shih-kang Lin2

1Osaka University, Osaka, Japan; 2National Cheng Kung University, Tainan City, Taiwan