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MIP4_Mechanical properties of Materials for Interconnects
Time:
Friday, 13/Sept/2024:
9:15am - 10:30am
Session Chair: Glenn Hamilton Ross, Aalto University
Location:MOA 10-12
MOA 10-12
Presentations
9:15am - 9:40am
Prediction of High Strain Rate Properties of Bi-doped SnAgCu Solders after Sustained High-temperature Operation
Pradeep Lall, Vishal Mehta, Mrinmoy Saha
Auburn University, Auburn, USA
9:40am - 10:05am
Quantification of Adhesion Strength and Mechanism of Adhesion Degradation Between Sputtered SUS304 and Mold Resin in Electromagnetic Wave Shield Packages
1Memory Packaging Development Department, Kioxia Corporation, Japan; 2Memory Packaging Engineering Department, Kioxia Corporation, Japan; 3Joining and Welding Research Institute, Osaka University, Osaka, Japan
10:05am - 10:30am
Effect of Minor Element Addition on Mechanical Properties and Microstructure of Sn-Bi Alloys
