Conference Agenda

Session

Emerging II

Time:

Thursday, 12/Sept/2024:

3:45pm - 5:15pm

Session Chair: Martin Schneider-Ramelow, Fraunhofer IZM

Location: MOA 4

MOA 4

Presentations

10 Golden Rules of Chip- Package- Board Interactions

Evelyn Napetschnig

Infineon technologies Austria AG, Graz, Austria

Trench-Based Fully Integrated Capacitors for Power Delivery in Heterogeneous Integration Platforms

Yousef Safari, Yushu Zhao, Boris Vaisband

ECE Department, McGill University, Montreal, Canada

Sustainable Temperature and Pressure Sensing Solution for Tire

Kimmo Antero Keränen¹, Timo Kurkela¹, Jyrki Ollila¹, Antti Tanskanen¹, Marko Korkalainen¹, Antoine Balin²

¹VTT Technical Research Centre of Finland, Espoo, Finland; ²Continental Reifen Deutschland GmbH, Germany